TSOP-48 PACKAGE FOOTPRINT Search Results

Contextual Info: PA29F-S4-TS Data Sheet 48 pin TSOP Socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter converts the AMD 29Fx00 in its 48 pin TSOP package to a 32 pin DIP programming footprint for the Dataman S4 programmer. The adapter is made up of 3 sub-assemblies. They assemble via

A6 TSOP-6 MARKING

Contextual Info: S29AL016D 16 Megabit 2 M x 8-Bit/1 M x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Datasheet ADVANCE INFORMATION Distinctive Characteristics Architectural Advantages Package Options „ Single power supply operation „ 48-ball FBGA „ 48-pin TSOP — Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications

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Contextual Info: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA

Contextual Info: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64359// 6169#97.ð49#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA

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Contextual Info: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA • Center power and ground pins for low noise • ESD protection ≥ 2000 volts

Contextual Info: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • JEDEC registered packaging - 32-pin TSOP package - 48-ball 8mm x 6mm CSP BGA • ESD protection ≥ 2000 volts

Contextual Info: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA

Contextual Info: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.

29f800 29f400

Contextual Info: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP

29F800 equivalent

Contextual Info: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP

ddr 3 tsop

Abstract: TSOP 56 LAYOUT TSOP 66 Package
Contextual Info: 128 Megabit CMOS DDR SDRAM DPDD16MX8RSBY5 DESCRIPTION: The 128 Megabit LP-StackTM module DPDD16MX8RSBY5, based on 64 Mbit devices, has been designed to fit the same footprint as the 8 Meg x 8 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or

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Contextual Info: 512 Megabit CMOS DDR SDRAM DPDD32MX16WSCY5 ADVANCED INFORMATION DESCRIPTION: The 512 Megabit LP-Stack modules DPDD32MX16WSCY5, based on 256 Megabit devices, has been designed to fit in the same footprint as the 16 Meg x 16 DDR SDRAM TSOP monolithic. This allows for

Contextual Info: 512 Megabit CMOS DDR SDRAM DPDD64MX8WSBY5 DESCRIPTION: The 512 Megabit LP-StackTM module DPDD64MX8WSBY5, based on 256 Mbit devices, has been designed to fit the same footprint as the 32 Meg x 8 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or

Contextual Info: 256 Megabit CMOS DDR SDRAM DPDD16MX16TSBY5 PIN-OUT DIAGRAM DESCRIPTION: The 256 Megabit LP-Stack modules DPDD16MX16TSBY5, based on 128 Megabit devices, has been designed to fit in the same footprint as the 16 Meg x 8 DDR SDRAM TSOP monolithic. This allows for

TSOP 56 LAYOUT

Abstract: TSOP 48 LAYOUT Dense-Pac Microsystems dm 0256
Contextual Info: 128 Megabit CMOS DDR SDRAM DPDD16MX8RSAY5 DESCRIPTION: The 128 Megabit LP-StackTM module DPDD16MX8RSAY5, based on 64 Mbit devices, has been designed to fit the same footprint as the 16 Meg x 4 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or

TSOP

Abstract: tsop 48 PIN SOCKET TSOP 56 socket TSOP 48 socket weller soldering tip TSOP 44 Pattern TSOP 54 SOCKETS weller MT1500 TSOP 32 socket TSOP 50 socket
Contextual Info: TSOP. SSOP. PSOP. PLCC. microBGA. BGA. Extenders. C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com

TSOP 48 Pattern

Abstract: 980020 TSOP 54 SOCKETS TSOP 54 SOCKETS smt mount ALPTEX 32TSOP 56TSOP SOCKET p PINOUT 980020-XX-XX TSOP 48 socket
Contextual Info: C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com Copyright ALPTEX, Inc. 1998 TSOP FlexProbes 0,50mm (.0197") Pitch

SOP 8 200MIL

Abstract: serial flash 256Mb fast erase spi TM 1628 IC SOP Micron 512MB NOR FLASH HN29V1G91T-30 HN58C1001FPI-15 M5M51008DFP-70HI 256mb EEPROM Memory CSP-48 TSOP 28 SPI memory Package flash
Contextual Info: Renesas Memory General Catalog 2003.11 Renesas Memory General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with

tsop 0038

Abstract: TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package C7025
Contextual Info: TSOP: THIN SMALL OUTLINE PACKAGE DRAWING A2 Z e SEE DETAIL B E Y A1 D1 D SEATING PLANE SEE DETAIL A A DETAIL A DETAIL B c b φ L Thin Small Outline Package TSOP Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch

AMD AM28F010 ca

Abstract: AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002
Contextual Info: Flash Memory Quick Reference Guide Summer ’98 Package Migration Low-Voltage Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B 2 Mb 4 Mb 8 Mb 16 Mb Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B Am29LV104B 1 Mb 2 Mb 4 Mb Am29LV200 Am29DL400B Am29LV400

QFN11T040-006

Abstract: WA200 QFN11T032-003 QFN11T048-008 IC51-1284-1433 QFN11T024-002 IC189-0282-042 IC189 IC51-0804-819-2 IC51-0242-367-1
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

QFN11T048-008

Abstract: NP445-064-002 QFN11T032-003 NP445-048-001 ic191-0482-004 pin details IC51-0202-912 IC51-0282-165 WA200 IC51-0302-914 IC51-1844-1148
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

TSOP-48 pcb LAYOUT

Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions