TSOP-II 44 RECOMMENDED PCB FOOTPRINT Search Results

NCP380

Contextual Info: NCP380, NCV380 Fixed/Adjustable Current- Limiting Power‐Distribution Switches The NCP380 is a high side power-distribution switch designed for applications where heavy capacitive loads and short-circuits are likely to be encountered. The device includes an integrated 55 mW DFN

amd 15h power

Abstract: TSOP-48 pcb LAYOUT TSOP 48 LAYOUT AM29LV640 TSOP-48 FOOTPRINT
Contextual Info: Implementing a Common Layout for AMD MirrorBit and Intel StrataFlash™ Memory Devices Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ

amd 15h power

Abstract: AM29LV640
Contextual Info: Implementing a Common Layout for AMD MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with AMD MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both AMD and

sample code read and write flash memory spansion

Abstract: AMD29LV SPANSION date code format spansion S29GL064 sample code write buffer spansion intel MLC flash Intel 56 TSOP PL32LM amd 15h power S29GL
Contextual Info: Implementing a Common Layout for Spansion MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with Spansion MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both

ic 6116 datasheet from texas instruments

Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Contextual Info: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

Est 13003

Abstract: Aries Electronics transistor E 13009 cup 10019 tsop 48 PIN SOCKET pin identification plcc thru hole socket 20 32 pin zif connector aries all transistor 13009 torlon transistor 13009
Contextual Info: 8 E DI N TH O EI G H T I INTERCONNECTION & PACKAGING SOLUTIONS SHORTFORM CATALOG For more than a quarter century, Aries has helped solve interconnection and packaging problems with an unusual range of standard, programmed, and custom products. Welcome to Aries!

enamelled copper wire swg table

Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Contextual Info: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .

Contextual Info: Data Sheet Rev.1.0 02.04.2009 1024MB DDR – SDRAM DIMM 184PIN DIMM Features: SDU01G64H3BE2HY-50R 1024MB PC-3200 in TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 1 Module densities 1024MB with 16 dies and 2 ranks

Contextual Info: Data Sheet Rev.1.1 22.02.2010 512MB DDR1 – SDRAM SO-DIMM Features: Features: 1 200-pin 64-bit Small Outline, Dual-In-Line Double 200 PIN SO-DIMM SDN06464K1BE1HY-50R 1 512MB DDR PC3200 1 1 TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3

MT46V32M16P

Contextual Info: Data Sheet Rev.1.0 26.05.2008 512MB DDR – SDRAM SoDIMM 200PIN SoDIMM Features: SDN06464E1C62MT-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 1 Module densities 512MB with 8 dies and 2 ranks

Contextual Info: Data Sheet Rev.1.0 13.01.2010 512MB DDR – SDRAM DIMM 184PIN DIMM Features: SDU06464B5BE1HY-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 1 Module densities 512MB with 8 dies and 1 rank

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

Contextual Info: Data Sheet Rev.1.0 21.05.2008 512MB ECC DDR – SDRAM DIMM 184PIN ECC DIMM Features: SDU06472B5BF1MT-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: ̇ Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 ̇ Module densities

Contextual Info: Data Sheet Rev.1.0 09.04.2008 512MB DDR – SDRAM DIMM 184PIN DIMM Features: SDU06464B5B61MT-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 1 Module densities 512MB with 8 dies and 1 rank

LG color tv Circuit Diagram schematics

Abstract: hp laptop MOTHERBOARD pcb CIRCUIT diagram la 4440 amplifier circuit diagram 300 watt hp laptop ac adapter schematics diagram schematic led screen billboard METAL DETECTOR PROGRAM PIC16F84 megamax-4g pic 220v light dimmer hydraulic lift project microcontroller based billboard display system
Contextual Info: Section 1: Introduction Introduction . 1-1 Third Party Support by Product . 1-3 Emulators . 1-3

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

Contextual Info: cP August 1996 Revision 2 .0 DATA SHEET EDC2UV6482- 60/70 (J/T)G-S 16MByte (2Mx64) CMOS EDO DRAM Module-3.3V General Description The EDC2UV6482-(60/70)(J/T)G-S is a high performance, EDO (Extended Data Out) 16-megabyte dynamic RAM module orga­ nized as 2M words by 64 bits, in a 168-pins, dual-in-line (DIMM) memory modules.

CBG064-052A

Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Contextual Info: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

s29jl064j60

Abstract: jl032j
Contextual Info: S29JL064J 64 Megabit 8M x 8-Bit/4M x 16-Bit CMOS 3.0 Volt-Only, Simultaneous Read/Write Flash Memory Data Sheet S29JL064J Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information,

xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

Contextual Info: SM5362000TP 8MByte 2M x 36 CMOS DRAM Module - Thin Profile General Description Features The SM 5362000TP is a high performance, 8-megabyte dynam ic RAM m odule organized as 2M words by 36 bits, in a thin profile, 72-pin, leadless, single-in-line memory m odule (SIM M ) package.

xilinx part marking

Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the