TSOP-II TRAY Search Results

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Contextual Info: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)

TSOP 62 Package

Abstract: TSOP-II 44 TSOP package tray
Contextual Info: UNIT : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 PP 137.5±0.5 A A' 13.1 180±1.0 21.25±0.5 32±0.1 NEC LA–2541B–1 HEAT PROOF 24.3 SECTION A – A' 24.3 6.2 5.8 8.8 21.3 Applied Package 28-pin Plastic TSOP II (400mil) 44-pin Plastic TSOP (II)(400mil)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Contextual Info: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

TSOP package tray

Abstract: 300mil JEDEC TRAY DIMENSIONS tsop 1230
Contextual Info: UNIT : mm HEAT PROOF 111.3 7 PPE NEC 135°C MAX 11.13 12.30 TSOP 2 300MIL17 135.9 11x16=176 A A' 9.2 16.4 19.14 13.95 287.1 315.0 (322.6) SECTION A-A' 16.4 (6.35) 7.62 12.0 5.62 Applied Package Quantity (pcs) 26-pin Plastic TSOP(II)(300mil) MAX. 176 Tray

TSOP 86 Package

Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E P detail of lead end 1 14 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 1 P E F detail of lead end 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

TSOP 54 tray

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

S44G5-80-7KF2

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

0038 tsop

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

44PINTSOP

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 300MIL17 26 pin TSOP (II) (300 mil) 26 14 1 P E F detail of lead end 13 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J C D N M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

TRAY TSOP

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 26 14 F P E detail of lead end 1 A D M 13 M L B C G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 26 14 E P F detail of lead end 1 A 13 H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 F E P detail of lead end 1 22 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

TRAY TSOP

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 15 28 F P E detail of lead end 14 1 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.