VIA ANTIPAD PITCH Search Results

PCI express PCB footprint

Abstract: datasheet of BGA Staggered pins "differential via" via antipad pitch Geest UM5000
Contextual Info: DesignCon 2005 Connector footprint optimization enables 10 Gb+ signal transmission Jan De Geest, PhD Winnie Heyvaert Stefaan Sercu, PhD Dana Bergey FCI Communications, Data, Consumer Division FCI ’s-Hertogenbosch BV Victorialaan 1 5213 JG ’s-Hertogenbosch

bryan adams

Abstract: fg wilson generator prbs using lfsr hyperlynx dell monitor circuit diagram led based graphic equalizer ic matlab Seminar Microwave PIN diode spice 750um Design Seminar Signal Transmission
Contextual Info: DesignCon 2007 Pre-Emphasis and Equalization Parameter Optimization with Fast, WorstCase/Multibillion-Bit Verification Andy Turudic, Altera Corporation aturudic@altera.com Steven McKinney, Mentor Graphics Steven_McKinney@mentor.com Vladimir Dmitriev-Zdorov

vita 30.1

Abstract: 2mm wafer cable 973056 ERNI 973031 973011
Contextual Info: ERmet ZD www.erni.com Catalog E 074505 01/02 Edition 3 www.erni.com Catalog E 074505 01/02 Edition 3 Contents Introduction Daughter Card Connector 4 Pair Module Daughter Card Connector 3 Pair Module Daughter Card Connector 2 Pair Module Backplane Connector 4 Pair Module

connector pin contact

Abstract: 973028 2 pin male connector 2mm pitch via antipad pitch 973027 ERNI Electronics 973020 ERNI 973031 ERmet ZD
Contextual Info: ERmet ZD www.erni.com www.ERNI.com/contact/ Catalog E 074505 1 04/04 Edition 6 www.erni.com Catalog E 074505 04/04 Edition 6 Contents Introduction Daughter Card Connector 4 Pair Module Daughter Card Connector 3 Pair Module Daughter Card Connector 2 Pair Module

Contextual Info: ERmet ZD Application Note Version 1.1 Technical Features The ERmet ZD is specifically designed for high speed differential signaling in telecom applications at data rates of up to 5 Gbit/s. This robust, high performance, modular connector system is also designed to be used in conjunction with the 2mm

132-ball

Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
Contextual Info: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages

MEGTRON 6

Abstract: AN-672
Contextual Info: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission 2013.02.15 AN-672 Subscribe Feedback As transceiver data rates increase and the unit interval time UI decrease, the end-to-end link design of a transceiver channel becomes increasingly critical to the overall performance of the link. Consider an Altera

feature of ic UM 66

Abstract: rx tx
Contextual Info: DesignCon 2007 Improving System Performance by Reducing System Impedance to 85 Ohms Jan De Geest, FCI Jan.DeGeest@fciconnect.com Dana Bergey, FCI Dana.Bergey@fciconnect.com John Lynch, Intel John.M.Lynch@intel.com Dennis Miller, Intel Dennis.Miller@intel.com

UMN64

Abstract: 4000ZE 17x7 LC4256ZE MN64 via antipad pitch BN256
Contextual Info: 针 对 采 用 BGA封 装 的 可 编 程 逻 辑 器 件 设 计 的 低成本布板技术 莱迪思半导体白皮书 2010年7月 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

IPC-2221A

Abstract: IPC-2152 AN2747 IPC-275 hf Power Supplies MPC8641 MPC8641D DRN2 SC458 IRF7821
Contextual Info: Freescale Semiconductor Application Note AN3065 Rev. 0, 06/2007 Power Supply Design Guidelines for the MPC8641 and MPC8641D by Gary Milliorn DSD Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist in creating a

IPC-2221A

Abstract: IPC-2152 IPC-275 IPC2221A AN2747 IPC-2221 SMD Capacitor symbols tps5430pwp IPC2221 IPC2152
Contextual Info: Freescale Semiconductor Application Note AN3065 Rev. 2, 01/2010 Power Supply Design Guidelines for the MPC8641 and MPC8641D by Networking and Multimedia Group Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist in creating a

IPC-2221A

Abstract: IPC-275 IPC-2152 IPC-2221 AN2747 via antipad pitch MPC8641D tps5430pwp IRF7832 MBR0530
Contextual Info: Freescale Semiconductor Application Note AN3065 Rev. 1, 01/2008 Power Supply Design Guidelines for the MPC8641 and MPC8641D by Gary Milliorn DSD Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist in creating a

fr4 rlgc

Contextual Info: HNAL NCtf" DESIGN TOOLS To m ake high sp eed connectors e as ier to specify a n d use, Sam tec has extended the concept o f m anufacturer supplied P C B p a d layouts a n d connector S P /C E m odels. Sam tec now supplies “reference designs” fo r one o f the

PCB layout guidelines for NXP MCUs in BGA packages

Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,

Contextual Info: ERmet ZD www.erni.com Catalog E 074505 04/07 Edition 7 www.erni.com Catalog E 074505 04/07 Edition 7 ERmet ZD High Speed Differential Hard Metric Connector System Table of Contents ERmet ZD High Speed Differential Hard Metric Connector System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

973046

Abstract: 973031 973056 DXSN2285 973028 973019 973080 ERmet ZD E83005 IEC60512
Contextual Info: ERmet ZD www.erni.com Catalog E 074505 04/07 Edition 7 www.erni.com Catalog E 074505 04/07 Edition 7 ERmet ZD High Speed Differential Hard Metric Connector System Table of Contents ERmet ZD High Speed Differential Hard Metric Connector System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

IPC-2152

Abstract: sdrx2 IPC-2221A vsc8244hg TP153 11C6 74alvch32973kr RGMII trace mils SMD CAPACITOR L27 tp107
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3535 Rev. 0, 2/2008 A Strategy for Routing the MPC8544E in a Six-Layer PCB by Michael George NMG Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist the customer

IPC-2221A

Abstract: 12b3 diode IPC-2152 vsc8244hg TP168 3b6 it manufacture smd 1a5 smd 9A5 TP-114 nc02
Contextual Info: Freescale Semiconductor Application Note AN3444 Rev. 0, 10/2007 A Strategy for Routing the MPC8536E in a Six-Layer PCB by Michael George DSD Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist the customer

SPEAr300

Abstract: SPEAr310 0402 land pattern ddr pcb layout DDR2 pcb layout spear SPEAr320 ARM926 LFBGA289 DL1 327
Contextual Info: AN2674 Application note PCB layout guidelines for SPEAr3xx Introduction SPEAr3xx is a 15 x15 mm LFBGA289 device family with 0.8 mm ball pitch. The SPEAr3xx family includes SPEAr300, SPEAr310 and SPEAr320. SPEAr3xx devices all feature the ARM926 core running at up to 333 MHz, an external

DDR2 pcb layout

Abstract: AA10 AN2797 ARM926 PBGA420
Contextual Info: AN2797 Application note PCB layout guidelines for SPEAr600 Introduction SPEAr600 is a 23 x 23 mm PBGA420 device with 1 mm ball pitch. It is a member of the SPEAr family of 32-bit embedded MPUs. The device features dual ARM926 cores running at up to 333 MHz, an external DDR2 memory interface and a full set of powerful on-chip

SPEAr300

Abstract: SPEAR320 SPEAr310 AN2674 DDR2 pcb layout ARM926 LFBGA289 0402 land pattern DSASW003738
Contextual Info: AN2674 Application note PCB layout guidelines for SPEAr3xx Introduction SPEAr3xx is a 15 x15 mm LFBGA289 device family with 0.8 mm ball pitch. The SPEAr3xx family includes SPEAr300, SPEAr310 and SPEAr320. SPEAr3xx devices all feature the ARM926 core running at up to 333 MHz, an external

Contextual Info: Titl IDT Tsi577 Serial RapidIO Switch  Hardware Manual May 18, 2012 GENERAL DISCLAIMER Integrated Device Technology, Inc. “IDT” reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or

tundra srio switch

Abstract: BGA PACKAGE thermal profile chn 037 tsi576
Contextual Info: Title Tsi576 Serial RapidIO Switch Hardware Manual Preliminary October 2007 80B804A_MA002_01 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi576, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.