139-5K
Abstract: 1395B 139-5J SCR Saddle clamp SCR 214
Text: Wakefield Engineering Precision Clamp Systems Series 139 Wakefield Engineering compression pack heat sinks and clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation and heat dissipation
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139-5E
139-5F
139-5G
139-5H
139-5J
139-5K
139-5L
139-5M
139-5N
139-5P
139-5K
1395B
139-5J
SCR Saddle clamp
SCR 214
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Untitled
Abstract: No abstract text available
Text: Micrel Semiconductor Designing With LDO Regulators Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA. Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,
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MIL-STD-275E:
ManufactuL-STD-275E:
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95012N2
Abstract: connector "N" 60X60 40x40x10mm mmH2O
Text: DC Brushless Fans From Wakefield Engineering, Inc. Applying over 40 years experience in thermal management solutions, Wakefield Engineering, Inc. is offering a complete line of DC brushless fans. F E AT U R E S A N D B E N E F I T S • Compact hub enables exceptional air-flow
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MM-H20)
912012N3
912012D3
95012N2
connector "N"
60X60
40x40x10mm
mmH2O
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IN2222A
Abstract: transitron catalog TCR43 TM106 IN443 1n9448 sv4091 IN4868 diode 3N68 IN536
Text: ron Tro nsitron electronic corporation e I ron 168 Albion Street . Wakefield. Massachusetts 01881 WAKEFIELD, MASSACHUSE TTS BOSTON, MASSACHUSETTS MELROSE, MASSACHUSETTS NUEVO LAREDO, MEXICO BERKSHIRE, ENGLAND PARIS, FRANCE AMSTERDAM, THE NETHERLANDS ~ ciectl'onic corpOI'atioll
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Wakefield Engineering
Abstract: Muffin
Text: CORPORATE HEADQUARTERS Wakefield Thermal Solutions 33 Bridge Street • Pelham NH 03076 T: 603-635-2800 • F: 603-635-1900 www.wakefield.com ISO 9001:2000 and QS 9000 REGISTERED Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks
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D146D
Abstract: C 9072 130-B 130-C 143e 146d 143H
Text: Precision Compression Clamp Systems PRECISION COMPRESSION MOUNTING CLAMP SYSTEMS Wakefield Engineering compression pack heat sinks and clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation
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amd Power and Thermal
Abstract: k5 amd Chomerics T710 amd catalog "electrical connector"
Text: THERMAL MANAGEMENT SOLUTIONS FOR AMD K5 and K6 Active heat sinks for high performance microprocessors PASSIVE Wakefield Engineering heat sinks are available for AMD’s K5 and K6 microprocessors. These processors are used in personal and networked computers
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Intel Celeron Covington
Abstract: Chomerics T710 mxt212
Text: THERMAL MANAGEMENT SOLUTIONS FOR THE INTEL CELERON PROCESSORS Passive 866 Passive Crosscut 866X Active 866F COVINGTON/MENDOCINO Passive and active heat sinks for the Intel Celeron Microprocessors Wakefield Engineering’s Attachment Clip 866SC Celeron
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866SC
866SC.
Intel Celeron Covington
Chomerics T710
mxt212
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ALPHA SEMICONDUCTOR 4459
Abstract: D146D 3000LB DATASHEET SCR 131-6 132119 139-5h 139-5L 130-B 130-C 132-10G
Text: Precision Compression Clamp Systems PRECISION COMPRESSION MOUNTING CLAMP SYSTEMS Wakefield Engineering compression pack heat sinks and clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation and
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heatsink
Abstract: 214-243-4321 3001 transistor diode 4151 Wakefield Engineering 4151 THERMALLOY Wakefield
Text: Support Components Heatsink Vendor List Heatsink Vendor List Intricast 2160 Walsh Avenue Santa Clara, CA 95050 Tel: 408 988-6200 Fax: (408) 988-0683 Wakefield Engineering 27901 Front Street Temucula, CA 92590 Tel: (909) 676-4151 Fax: (909) 676-3031 Thermalloy
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Wakefield Thermal Solutions TYPE 120
Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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ebonol
Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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BERGQUIST softface
Abstract: 61995AB124D1
Text: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety
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619rev2
61995AB124D1S4
61995AB124D1
BERGQUIST softface
61995AB124D1
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extrusion Heatsinks
Abstract: Muffin 0024C
Text: Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks assemblies. Configurable in a variety of ways, they are reliable, cost effective, and highly efficient thermal management
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8715Thermal
extrusion Heatsinks
Muffin
0024C
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Wakefield Thermal Solutions
Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:
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Untitled
Abstract: No abstract text available
Text: 901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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WTS001
p1-25
220486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
T405R
Bergquist BP-108
T410R
Chomerics* T405
658-35AB
T405
T410
T411
T412
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B 8936
Abstract: No abstract text available
Text: 4 REVISIONS ALL INFORMATION DISCLOSED BY THIS DOCUMENT IS CONSIDERED CONFIDENTIAL AND PROPRIETARY BY WAKEFIELD ENGINEERING INC. ALL DESIGN/ MANUFACTURE, USE, REPRODUCTION AND SALE RIGHTS ARE RESERVED BY WAKEFIELD ENGINEERING INC. REV A B D DESCRIPTION EC*
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20701ABT4E
B 8936
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Aham
Abstract: MIL-STD-275E
Text: Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA.Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,
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MIL-STD-275E:
R44-0800
Aham
MIL-STD-275E
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Wakefield Engineering
Abstract: 647-15ABP AR285
Text: Wakefield Engineering m Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEATSINKS Labor-Saving SpeedClip Heat Sinks for Vertical Board Mounting 667 S E R IE S Standard P/N Standoff Pin Plain Pin Height Above PC Board “A” in. mm 667-1OABSP A
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667-1OABSP
667-10ABPP
667-15ABSP
667-15ABPP
667-20ABSP
667-20ABPP
667-25ABSP
667-25ABPP
MODEL647-ioABP
Wakefield Engineering
647-15ABP
AR285
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LTN20069
Abstract: Wakefield Engineering LTN20069 a3911 T411
Text: I 2 REVISIONS tt£_ REV DESCRIPTION 391 1 3916 B RELEASED DATE 3/12/02 3/14/02 PER EC REVISED PER EC B APPROVED DB DB - .0 5 9 7 PL (.0 3 0 )8 PL B r (.0 6 0 ) .35 0 f 12^ |q |. ooT W ¡ ñ (.6 5 3 ) NOTES: 1. QÖÖD INDICATES A KEY PRODUCT WAKEFIELD 1 6 4 5 7 HEATSINK
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6063-T5
LTN20069
Wakefield Engineering LTN20069
a3911
T411
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transistor SMD p05
Abstract: 1981-R TRANSISTOR SMD 2X y 127 D TRANSISTOR 476 16q CP QUICK CONNECT L-398 LDA100 LDA101 LDA110
Text: I Solid State Current Sensors f H • I Engineering Specifications LDA100 LDA110 LDA101 LDA111 s l LDA200 LDA201 LDA210 LDA211 Output Characteristics Collector Current mA Typical Capacitance (pF) (Ve.= 1 0 V ;f = 1MHz) Collector Dark Current (nA) (Ve. = SV; lF= 0mA)
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LDA100
LDA101
LDA110
LDA111
LDA200
LDA201
LDA210
LDA211
transistor SMD p05
1981-R
TRANSISTOR SMD 2X y
127 D TRANSISTOR
476 16q
CP QUICK CONNECT
L-398
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Untitled
Abstract: No abstract text available
Text: I Solid State Current Sensors f H • I Engineering Specifications LDA100 LDA110 LDA101 LDA111 s l LDA200 LDA201 LDA210 LDA211 Output Characteristics Collector Current mA Typical Capacitance (pF) (Ve.= 1 0 V ;f = 1MHz) Collector Dark Current (nA) (Ve. = SV; lF= 0mA)
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LDA100
LDA101
LDA110
LDA111
LDA200
LDA201
LDA210
LDA211
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PC CLARE OFB 1202
Abstract: CP Clare RELAY OFB 2402 CP Clare RELAY, 1.5 amp, 2402 TL 7493 476 16q CP QUICK CONNECT T200 SSP15 J370 cp clare ofb 2402
Text: OptoFILM Solid State Switches O F * Engineering S pecifications 1202 O F (*) 2402 O F (') 1205D O F (*) 2405D O F (*) 1205-(X) O F (*) 2405-(X) O F (*) 1210-(X) O F (*) 2410-(X) O utput C haracteristics 400 500 400 500 400 500 400 500 1.5/120 1.5/240 3/120
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1205D
2405D
PC CLARE OFB 1202
CP Clare RELAY OFB 2402
CP Clare RELAY, 1.5 amp, 2402
TL 7493
476 16q
CP QUICK CONNECT
T200
SSP15
J370
cp clare ofb 2402
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