WAKEFIELD THERMAL SOLUTIONS Search Results

Aham

Abstract: MIL-STD-275E
Contextual Info: Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA.Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,

Contextual Info: Micrel Semiconductor Designing With LDO Regulators Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA. Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,

95012N2

Abstract: connector "N" 60X60 40x40x10mm mmH2O
Contextual Info: DC Brushless Fans From Wakefield Engineering, Inc. Applying over 40 years experience in thermal management solutions, Wakefield Engineering, Inc. is offering a complete line of DC brushless fans. F E AT U R E S A N D B E N E F I T S • Compact hub enables exceptional air-flow

Wakefield Engineering

Abstract: Muffin
Contextual Info: CORPORATE HEADQUARTERS Wakefield Thermal Solutions 33 Bridge Street • Pelham NH 03076 T: 603-635-2800 • F: 603-635-1900 www.wakefield.com ISO 9001:2000 and QS 9000 REGISTERED Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks

Contextual Info: Catalog 2 THERMAL MANAGEMENT | TECHNICAL PRODUCTS | INDUSTRIAL APPS | MACHINING SERVICES | NEWS | CONTACT US | ABOUT US Part # or Keyword New 500 Ton Extrusion Press Heat Sinks | Heat Frames | Thermal Accessories | Thermal Modeling | Inventory | MSDS Wakefield Thermovations TM

Wakefield Thermal Solutions

Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Contextual Info: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:

amd Power and Thermal

Abstract: k5 amd Chomerics T710 amd catalog "electrical connector"
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR AMD K5 and K6 Active heat sinks for high performance microprocessors PASSIVE Wakefield Engineering heat sinks are available for AMD’s K5 and K6 microprocessors. These processors are used in personal and networked computers

Intel Celeron Covington

Abstract: Chomerics T710 mxt212
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR THE INTEL CELERON PROCESSORS Passive 866 Passive Crosscut 866X Active 866F COVINGTON/MENDOCINO Passive and active heat sinks for the Intel Celeron Microprocessors Wakefield Engineering’s Attachment Clip 866SC Celeron

Wakefield Thermal Solutions TYPE 120

Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

ebonol

Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

pentium II xeon

Abstract: pentium II Xeon 400 2118 intel Chomerics T710
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR INTEL PENTIUM II Active 862F Xeon Slot II Passive Crosscut 862X Passive and active heat sinks for Pentium II Xeon (Slot II) Microprocessors Wakefield Engineering Passive 862 FEATURES AND BENEFITS heat sinks are • Both Passive and Active solutions are available

extrusion Heatsinks

Abstract: Muffin 0024C
Contextual Info: Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks assemblies. Configurable in a variety of ways, they are reliable, cost effective, and highly efficient thermal management

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

Cyrix 6x86

Abstract: DC Centaur BERGQUIST softface media gx cyrix
Contextual Info: Thermal Solutions for Intel: Pentium, Pentium MM X AMD: K6, K6-2 Cyrix: 6x86, Media GX Features and Benefits : Centaur: W inChip C6 ♦ Compact design heat sinks can comfortably fit a variety of Robust Socket 7 – based PC boxes. ♦ Works with Sockets 5 & 7 processors

Wakefield Thermal Solutions TYPE 120

Abstract: Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL75XX EL7556C EL7560C
Contextual Info: Application Note EL75XX Thermal Design Considerations Thermal Design Considerations EL75XX by Vijay Soman 1 0 Introduction The typical power applications requirement for microprocessors is either a VRM Voltage Regulator Module or a direct mother board solution

elina fan

Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of

Heat Sinks

Contextual Info: HEAT SINKS FOR LEDs Preliminary JTI – HEAT SINKS FOR POWER LEDs 882 SERIES – RADIAL FIN HEAT SINK FOR “STAR” LED PACKAGES Wakefield's new 882 series heat sinks can be used with LEDs in the star package from Lumileds, Osram, and others. The radial design and

DAP 07

Abstract: Power Supply Control IC dap 07 smd Power Supply Control IC dap 07 DAP 07 8 Pin SMD IC VIA 1394 TAS3001 TAS5110 TAS5110DAD TAS5110DAP Power Supply Control IC dap 08
Contextual Info: TAS5110 SLES028A – MAY 2002 – REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)

Power Supply Control IC dap 08

Abstract: Power Supply Control IC dap 07 TAS5110IDAPR TAS3001 TAS5110 TAS5110DAD TAS5110DAP TAS5110DAPR TAS5110IDAP DAP 07 power supply
Contextual Info: TAS5110 SLES028A – MAY 2002 – REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)

Power Supply Control IC dap 08

Abstract: Power Supply Control IC dap 07 DAP 07 power supply DAP 07
Contextual Info: TAS5110A SLES079 – APRIL 2003 PurePath Digital AMPLIFIER TAS5110A 50-W DIGITAL AMPLIFIER POWER STAGE FEATURES D 50 W RMS Power Into 6 Ω at 10% THD D 40 W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)

DAP 07 power supply

Abstract: DAP 07 Power Supply Control IC dap 07 50 watt subwoofer circuit diagram 500 watt audio subwoofer tas*5110 100 watt subwoofer circuit diagram PWM Control IC dap 07 car subwoofer power amplifier circuit Power Supply Control IC dap 07 smd
Contextual Info: TAS5110 SLES028 – MAY 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 4 Ω D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System) D Power Efficiency > 90% Into 8-Ω Load D Low Profile, SMD 32-Pin PowerPAD Package

2.1 channel subwoofer amplifier circuit diagram

Contextual Info: TAS5110 SLES028A − MAY 2002 − REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)

DAP 6A

Abstract: Power Supply Control IC dap 015 d DAP+6A
Contextual Info: TAS5110 SLES028A − MAY 2002 − REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)

DAP 018

Abstract: free home theater circuit diagram Power Supply Control IC dap 08 Power Supply Control IC dap 015 d TAS3001 TAS5110 TAS5110DAD TAS5110DAP TAS5110DAPR TAS5110IDAP
Contextual Info: TAS5110 SLES028A − MAY 2002 − REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)