WIRE BOND Search Results

VW-1 H

Abstract: electromagnets wh series
Contextual Info: H OOK-U P WIRE Automotive Wire Teflon Wire 300V Solid Wire 300V Stranded Wire 600V Stranded Wire Speaker Wire Black/Red Bonded Speaker Wire Magnet Wire NEw! Features: • Broad Line – Over 500 Types • Packaged in a variety of lengths, gauges and colors

Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.

copper wire datasheet

Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.

precap

Contextual Info: Manufacturing Flow KIT FORMATION KIT INSPECTION DIE & COMPONENT ATTACH - WITH EPOXY CURE EPOXY CUSTOMER SOURCE INSPECTION IF APPLICABLE VACUUM BAKE HERMETIC SEAL MARK WIRE BOND QUAL/DESTRUCT WIRE PULL TEMPERATURE CYCLE WIRE BOND CONSTANT ACCELERATION WIRE BOND

E024A

Abstract: E018A E240D E240B E960B E040A WIRES bonding E025A E1200A
Contextual Info: Excelics Semiconductor, Inc. Recommended Wire Bonding For Excelics FETs E018A E024A Drain Bonding Wire Grounded Source Bonding Wires Gate Bonding Wire E025A E030C Drain Bonding Wire Drain Bonding Wires Grounded Source Grounded Source Bonding Wires Bonding Wires

Contextual Info: Product Specification 108-2059 02Mar11 Rev B Vertical Screwless Wire Connector 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics Vertical Screwless Wire Connector designed to terminate 16 and 18 AWG solid wire, and 18 AWG bonded wire

5724 ALPHA

Contextual Info: FIT Wire Management Alpha Wire | www.alphawire.com | 1-800-52 ALPHA Specifications subject to change. For complete specifications and availability, visit www.alphawire.com. 481 FIT® Wire Management Better wire management means better harnesses B ringing order to wire

Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:

MVB4080X104ZGH5R3

Abstract: MVL3030 MVL3030X103 MVB3030X103M2 MVL3080X104MGH5R MVB2741X104MG MVL2020X102M2H5R MVL2020X103MEH5R EIA-469 Presidio Components
Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile High Capacitance Multi-Layer

MVB3030X103M2

Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:

MVL3030X103M2H5R

Abstract: MVL3030 MVB4080X104MG
Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:

MVL2741X104MGH5C

Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:

Presidio Components Vb

Abstract: MVL4080X303M2H5R-
Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:

Presidio Components VL

Abstract: MVL3030X103M2H5R MVB4080X104ZGH5R3 MVB4080X104MG
Contextual Info: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:

MXP400X

Abstract: 7400 family bonder 150-degree
Contextual Info: Application Note - MXP400x Wire bond InGaAs/InP PIN Photo Diode Family OPTO-ELECTRONIC PRODUCTS W W W. Microsemi .COM Guideline for wire bond to MXP400x bare die. Recommend Wedge Bond used. Wedge detail informations: * 45 degee wire feed angle. * .0015 in. hole size.

Contextual Info: Primary Wire INCLUDING OEM APPLICATIONS General Cable’s Carol ® Brand primary wire is ideal for general purpose wiring for automobiles, boats, trucks, buses, tractors, trailers and other motordriven equipment. Carol Brand single, duplex and bonded parallel/multi-conductor primary wire

Contextual Info: MTT www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Resistance range: 1.1 k to 275 k • Chip size: 0.038" x 0.038" • Case: 0404 • Resistor

Contextual Info: This push-wire contact clamps the following copper conductors: solid wire PUSH-WIRE connections are suitable for applications where solid wire is used exclusively - for example in lighting, building installations, telecom­ munications and security. PUSHWIRE is

Contextual Info: Catalog 1307612 AMPU-BOND Insulated Terminals Product Facts • Designed to accommodate wire gauges 8 AWG through 4/0 AWG ■ The first large wire terminal to feature vinyl insulation bonded to the terminal sleeve ■ Terminals for wire sizes 8 AWG through 4/0 AWG

Contextual Info: MTR www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Chip size: 0.030" x 0.030" • Case: 0303 • Standard resistance range: 100  to 24 k or 800  to

Contextual Info: MTT www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Resistance range: 1.1 k to 275 k • Chip size: 0.038" x 0.038" • Resistor material tantalum nitride, self-passivating

Contextual Info: MTR www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Chip size: 0.030" x 0.030" • Standard resistance range: 100  to 24 k or 800  to 240 k

bonding

Abstract: VG-50
Contextual Info: Application Note for Dual-Gate FETs Bonding Diagram bonding wires are 1-mil diameter Au wires Drain Bonding Wire "Gate 2" Bonding Wires (2 plcs, 1 wire per pad) Source Bonding Wires (2 plcs, 2 wires per pad) Gate Bonding Wire Single Bias Configuration Dual Bias Configuration

Contextual Info: MTR www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Chip size: 0.030" x 0.030" • Case: 0303 • Standard resistance range: 100  to 24 k or 800  to