ZO 103 MN Search Results

73D23

Abstract: 73D2248 73D2248A D2248 Bell-103 handshake 73k224l-28ih
Contextual Info: &TDK. 73 D2248A/2348A MNP5, V.42bis Datacom Modem Device Set TDK SEMICONDUCTOR CORP. February 1998 DESCRIPTION FEATURES The 73D2248A/2348A Device Sets consists of two CMOS integrated circuits which provide the data pump and protocol functions required to implement a

73D22

Abstract: Bell-103 handshake demodulator psk 73K224
Contextual Info: SILICON SYSTEMS INC 4bE 3> m 0253*31*5 DOOSb*}? 2 « S I L SSI 73D2247 M ic o n s ifs k m MNP5, V.42bis Datacom Modem Device Set s ’ A TDK Group/Company Advance Information “ - 7 5 - 3 3 - * 7 0 November 1991 FEATURES DESCRIPTION The SSI 73D2247 Chip Set consists of two CMOS

Contextual Info: SSI 73D2407 m m M h n MNP5 Controller and Modem Device Set s Advance Information July, 1990 FEATURES DESCRIPTION Multi-mode V.22bis/V.22/V.21 & Bell 212A/103 com­ patible device set for Intelligent modem designs The SSI 73D2407 consists of four CMOS integrated

QAM modulator demodulator

Abstract: FSK modulator and demodulator 256 QAM modulator demodulator modem psk modulator demodulator
Contextual Info: SILICON SYSTEMS INC MbE D • ÔSSB'ïbS D D 0S 70S Ö SSI 73D2247-F cM M M b t l S MNP5, V.42bis Daiacom and FAX Modem Device Set ’ A TDK Group/Company Advance Information ~T-7S-33~05 November 1991 DESCRIPTION FEATURES The SSI 73D2247-F Chip Set consists of two CMOS

USR24

Abstract: ssi protocol 73D2248
Contextual Info: SSI 73D2248/2348 & MNP5, V.42bis Datacom Modem Device Set i k m M s l m s ' A TDK Group/Company Advance Information January 1993 FEATURES DESCRIPTION The SSI 73D2248/2348 Chip Sets consists of two CMOS integrated circuits which provide the data pump and protocol functions required to implement a high

Contextual Info: HÄ»- SSI 73D2248/2348 MNP5, V.42bis Datacom Modem Device Set ciim iM k m s ' A TDK G roup/C om pany Advance Information January 1993 DESCRIPTION FEATURES The SSI 73D2248/2348 Chip Sets consists of two CMOS integrated circuits which provide the data pump

Ablebond 74-1

Contextual Info: Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier Data Sheet Features • Frequency Range: 6 - 20 GHz • High Gain: 19 dB Typical • Output Power: 15dBm Typical • Input and Output Return Loss: < -10 dB Chip Size: 1410 x 1010 µm 55.5 x 39.7 mils Chip Size Tolerance:± 10µm (± 0.4 mils)

Contextual Info: m r a e PM150CVA060 r Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 724 925-7272 In t G lH r n O d M o d u lB Three Phase IGBT Inverter Output 150 Amperes/600 Volts TERMINAL CODE W fo 11. Up Vwpc 12. Vupt Wp 13. NC Vwpi 14. Fo

AMMC-5620

Abstract: AMMC-5620-W10 AMMC-5620-W50
Contextual Info: Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier Data Sheet Features • Frequency Range: 6 - 20 GHz • High Gain: 19 dB Typical • Output Power: 15dBm Typical • Input and Output Return Loss: < -10 dB Chip Size: 1410 x 1010 µm 55.5 x 39.7 mils Chip Size Tolerance:± 10µm (± 0.4 mils)

Ablebond 74-1

Contextual Info: Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier Data Sheet Features • Frequency Range: 6 - 20 GHz • High Gain: 19 dB Typical • Output Power: 15dBm Typical • Input and Output Return Loss: < -10 dB Chip Size: 1410 x 1010 µm 55.5 x 39.7 mils Chip Size Tolerance:± 10µm (± 0.4 mils)

Contextual Info: AMMC - 5620 6 - 20 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features Avago Technologies’ AMMC-5620 MMIC is a GaAs wideband amplifier designed for medium output power and

2348A

Abstract: 73D2248A
Contextual Info: S S I 73D2248A/2348A MNP5, V.42bis Datacom Modem Device Set ¿ i l i m s u s i m s ' A TDK Group 1 Company Advance Information September 1994 DESCRIPTION FEATURES The S S I 73D2248A/2348A Chip Sets consists of two C M O S integrated circuits which provide the data pump

ytm401

Abstract: V23 FSK Japan
Contextual Info: APR 2 9 1993 quorum technical sales 4 7 0 1 p a tr ic k h e n ry d r., b ld g . 1 2 Y A M A H A L S I s a n t a c la r a , ca. 9 5 0 5 4 4 0 8 9 8 0 - 0 8 1 2 tw x 5 1 0 - 6 0 1 - 3 9 8 2 YTM4GT MD96DX (9600 bps FAX MODEM LSI with HDLC) • OUTLINE MD96DX is a one-chip MODEM LSI of 9600 bps, which is upper compatible with our

ABLEBOND 84-3

Abstract: Ablebond 74-1
Contextual Info: Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier Data Sheet Features • Frequency Range: 6 - 20 GHz • High Gain: 19 dB Typical • Output Power: 15dBm Typical • Input and Output Return Loss: < -10 dB Chip Size: 1410 x 1010 µm 55.5 x 39.7 mils Chip Size Tolerance:± 10µm (± 0.4 mils)

73K224L

Abstract: 73D2248 73D2248A 73D2348 73K324L 93C66 SSI 7200 V22BL static ram 8K 73D2910
Contextual Info: ¿ ia m s v s k m S S I 7 3 D 2 2 4 8 A /2 3 4 8 A MNP5, V.42bis Datacom Modem Device Set s A TDK G roup/C om pany Advance Information Septem ber 1994 FEATURES DESCRIPTION Combines modem and protocol controller The SSI 73D 2248A /2348A Chip Sets consists of two

Contextual Info: 3ë GEC P L E S S E Y o c t o b e r i 995 S E M I C O N D U C T O R S DS4272-2.2 TF440.C FAST SWITCHING THYRISTOR APPLICATIONS KEY PARAMETERS V DRM 2000V 400A ^T RMS 4000A ^TSM dV/dt 200V/fis 500A/(iS dl/dt 50|as • High Power Inverters And Choppers. ■

Contextual Info: rm mn SC660E i » M « § w iir tfe s a f f C System Clock Buffer for Mobile Applications Approved Product PRODUCT FEA TURES PRODUCT DESCRIPTION • 10 output buffers for high clock fanout applications ■ Each output can be internally disabled for EMI and

ablebond 88-1

Abstract: ABLEBOND 84-3 AMMC-5620 AMMC-5620-W10 AMMC-5620-W50 Ablebond 911 0528e
Contextual Info: AMMC-5620 6 - 20 GHz High Gain Amplifier Data Sheet Chip Size: 1410 x 1010 µm 55.5 x 39.7 mils Chip Size Tolerance: ± 10 µm (± 0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger) Description

BFG590

Contextual Info: BFG590; BFG590/X NPN 5 GHz wideband transistors Rev. 04 — 12 November 2007 Product data sheet IMPORTANT NOTICE Dear customer, As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets together with new contact

73D2247

Abstract: 73K224LZ-CP mod 8 ring counter YTM401D YTM401J YTM401-D 73D631-CP 73D630
Contextual Info: blE D S I L I CO N S Y S T E M S INC • 0253^3 0 0 D Ö 025 2G4 ■ SSI 73D2247-F ó m m j si Mv àt mm s MNP5, V.42bis Datacom and FAX Modem Device Set ■ A TDK Group/Company ~ T - 1 ^ - 3 5 - 9 0 January 1993 FEATURES DESCRIPTION The SSI 73D2247-F Chip Set consists of two CMOS

Contextual Info: BFG590; BFG590/X NPN 5 GHz wideband transistors Rev. 04 — 12 November 2007 Product data sheet IMPORTANT NOTICE Dear customer, As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets together with new contact

Contextual Info: T HI RD 州 LE 問。 JE 川~ ALTERATION I S S U E CAP ITEM CODE F ヰ ECWH8103HAB H 8123HAB 0.010 (103) 0.012(123) H 8153HAB 1 / 0.015(153) 0.018 (183) H 8183HAB 8223HAB 1 8273HAB 1 / H 1 / 8333HAB 8393HAB 8473HAB DIMENSIONS T H S L 15 .4 5 .4 9 .8 7

RJ13 jack

Abstract: RJ41S jack rj13 73D2417-CP
Contextual Info: SILICON SYSTEMS 4bE D INC • Ô S S B T b S 00G57fc.3 Q « S I L SSI 73D2417 ¿ m c m s v s fm MNP5 Datacom/FAX Modem Device Set ts ' A TDK Group/Company Preliminary Data -7 5 -3 3 -9 0 DESCRIPTION FEATURES The SSI 73D2417 is a 4-chip CMOS device set that

WHA103

Contextual Info: T HI R D州 G L EP R O J E C TI O N I ALTERATION I S S U E CAP . ITEM CODE F DIMENSIONS * L ECWH8103HAC 0.010(103) / 1 8123HAC H 8153HAC 8183HAC 8223HAC 8273HAC 8333HAC 8393HAC 8473HAC 0.012 (123) 0.015 (153) 0.018 (183) 0.022 (223) H / 1 H H H H l T