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    DSA00335796.pdf by NXP Semiconductors

    • AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 -- 22 January 2009 App... lication note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, more
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    0.65mm pitch BGA 1mm pitch BGA AN10778 BGA Ball Crack fine BGA thermal profile LFBGA32 LPC2220 LPC2292 LPC2364 LPC2368 LPC2458 LPC2468 LPC2468 pcb LPC2468 reflow solder profile LPC2470 LPC2478 LPC2478 pcb LPC2880 LPC2888 lpc3154 lpc3250 MO-275 nxp cross NXP LPC2368 SOT1018-1 sot930 sot950 SOT950-1 TFBGA208 TSOP 54 land pattern

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