DSA0017124.pdf by Microsemi

Partial File Text Application Note - MXP400x Wire bond InGaAs/InP PIN Photo Diode Family OPTO-ELECTRONIC PRODUCTS W W W. Microsemi .COM Guideline for wire bond to MXP400x bare die. Recommend Wedge Bond used.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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150-degree 7400 family bonder MXP400X

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