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    DSADA0023190.pdf by Philips Semiconductors

    • PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A
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    LFBGA144 MO-205
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