0.4MM PITCH QFP Search Results

A 0540

Abstract: QFE120SC SF-QFE120SC-L-01
Contextual Info: Surface mountable QFP emulator foot; leadless version, sized to fit on 120 position 0.4mm. pitch land pattern. Ironwood Spec: QFE120SC. 0.4mm Typ. 0.600" 0.600" 0.018" 0.050" 0.250" 0.063" A compatible target board land dimensions A< 0.540" B> 0.660" B Substrate: FR4/G10, 0.0625"±0.007" thick.

IC51-2564-1668

Abstract: a 1668 LS-QFE256SA-Z-01 socket Yamaichi ic51 qfp IC51
Contextual Info: 0.075" X 0.008" SMT pad Top View 0.4mm typ. 1 Bottom View 0.075" 0.352" 1.215" 0.4mm pitch 1.920" 1.920" 1.272" 1.452" Side View 1.652" 0.122" 0.250" 1.852" 0.018" dia. typ. 2 Description: Land socket 256 position QFP surface mount pads to 256 position male terminal pins Yamaichi ZIF socket footprint, IC51-2564-1668 .

B1448

Abstract: A1702 ipc 620 BOX21151 SF-QFE80SD-L-01F
Contextual Info: RoHS COMPLIANT 15.7mm [0.620"] top and bottom pad width only see side view for side pad width 15.7mm [0.620"] 13.7mm SQR. [0.540"] 0.4mm typ. [0.017"] Top View 0.050" pitch typ. 0.5mm dia. typ. [0.018"] 2 6.4mm±0.254mm [0.250"±0.010"] Side View 1 0.4mm [0.016"]

ICP-120-2

Contextual Info: IC149 Series SMT QFP/TQFP - 120 Pins (30x30) 0.4mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

YAMAICHI ic357

Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

IC51-1284-1433

Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:

Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite

Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite

QFP 128 lead .5mm

Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M
Contextual Info: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series

CA-QFE128SD-M-S-01

Contextual Info: 17.78mm [0.700"] 0.4mm Pitch 17.78mm [0.700"] Top View 0.23mm [0.009"] typ. 13.46mm [0.530"] 17.02mm [0.670"] 1 Side View 6.35mm [0.250"] 4.76mm [0.188"] 3 2 13.21mm [0.520"] female interface UGA12/128A 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

PA-QFE128SD-P-S-01

Abstract: QFE128SD
Contextual Info: 1.400" 0.4mm pitch 0.670" 1.400" 0.550" Top View 1 0.250" 3 0.128" 2 0.100" typ. Side View 0.018" dia. typ. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .

qfp 0.4mm

Abstract: SC-82AB
Contextual Info: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2010-10-21 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm

SC-82AB

Contextual Info: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2010-05-06 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm

CU-106A

Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
Contextual Info: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT

SH7724

Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
Contextual Info: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced

Contextual Info: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact

100405-1

Abstract: TQPACK100SD Eletech Electronics AXS4643R195C AXS4803M19 IC61-0644-052 IC61-0644-053 IC61-080-079 IC61-080-081 IC61-0804-046
Contextual Info: Appendix A Reference Dimensional Drawing for Common 64-pin 0.8mm-pitch QFP Foot Pattern Package type name Manufacturer's name and package classification 64P6N-A Renesas MCU package type name IC61-0644-052 IC61-0644-053 Yamaichi Electronics Co., Ltd. IC socket type name

78K3

Abstract: uPD78365A uPD78355 uPD78368A uPD784025
Contextual Info: 1/2 16 BIT MICROCONTROLLERS 78K3 AND 78K4 SERIES • A DIVERSE RANGE OF 16 BIT MICROCONTROLLERS • UP TO 256K OF MASK PROGRAMABLE ROM AND 12.5K OF RAM • SEVERAL MICROCONTROLLERS HAVE MULTIPLE ADC CHANNELS AND 2 DAC CHANNELS • AVAILABLE IN QFP PACKAGES FOR OPERATION AS LOW AS 1.8V

MB2147-01

Abstract: F2MC-16
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71021-2E F2MC-16 FAMILY EMULATOR QFP-100P PROBE HEADER MB2147-580 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100P *1 probe header MB2147-580 for the F2MC *2 -16 family emulator. The QFP-100P probe header is used by the probe header to connect the F2MC-16L/LX emulator

Contextual Info: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble

Contextual Info: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble

pitch 0.4mm BGA

Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
Contextual Info: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology

0.3mm pitch BGA

Abstract: pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm
Contextual Info: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available