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    128P6D Search Results

    128P6D Datasheets Context Search

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    LQFP128

    Abstract: LQFP128-P-1420-0
    Contextual Info: 128P6D-D Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g MD e JEDEC Code – Lead Material Cu Alloy HD 128 102 b2 103 ME D 1 l2 Symbol HE E Recommended Mount Pad 38 65 64 39 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E


    Original     		128P6D-D 128pin LQFP128-P-1420-0 LQFP128 PDF

    LQFP128

    Abstract: LQFP128-P-1420-0 128P6D-A D1102
    Contextual Info: 128P6D-A Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g 0.85 Lead Material Alloy 42 MD e JEDEC Code – HD 103 b2 128 ME D 1 102 I2 E HE Recommended Mount Pad Symbol 65 38 39 64 L1 A F A1 c A2 e b y L Detail F A A1 A2 b


    Original     		128P6D-A 128pin LQFP128-P-1420-0 LQFP128 128P6D-A D1102 PDF

    LQFP128

    Abstract: LQFP128-P-1420-0
    Contextual Info: 128P6D-C Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD b2 128 103 1 ME D 102 l2 HE D Recommended Mount Pad Symbol 65 38 39 64 A L1 F b A1 c A2 e y L Detail F A A1 A2 b c D E


    Original     		128P6D-C 128pin LQFP128-P-1420-0 LQFP128 PDF

    432W6

    Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P


    Original     		240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G PDF

    100MHZ

    Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,


    Original     		136P6S-C 100P6S-C 80P6N-C 208P6Y-A 64P6N-B 160P6E-A 44P6N-B 100MHZ IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C PDF

    M5M410092AFP-13

    Abstract: M5M410092BRF-10 16SRAM 100P6S M5M4V4169CTP-15 m5m410092
    Contextual Info: 3 »jam w jiiM ^Kiaaw iaw •CACHED DYNAMIC RAMs Classification Memory capacity 4M Memory Configuration 256KX 16DRAM IKX16SRAM Cached Dynamic RAM 16M 1MX16DRAM 1K X 16SRAM Min. Cycle time fisi ■ Typ. power dissipation (mW - Package Outline Type No. 10


    OCR Scan     		M5M4V4169CTP-10 M5M4V4169CTP-12 M5M4V4169CTP-15 M5M4V16169TP-10 70P3S-L 70P3S-L M5M410092AFP-13 M5M410092BRF-10 16SRAM 100P6S m5m410092 PDF

    M54630P

    Abstract: M54630 n type laser diode APC RS 800 m5463 66515FP M54977 54975P M66515FP 16P2N
    Contextual Info: lAPPLICATION SPECIFIC IC CONTINUED Function Tyjse No. Packase Outiire WttfKXM Features • U sag e /F ie ld • Includes self APC c irc u it N -type Laser diode d rive r with M 66515FP self APC function 20P 2N -A H igh­ speed Bip • H igh-speed sw itching 40M bps


    OCR Scan     		66515FP M66rks 54972P M54974P 54975P M54977P S4992P/FP 54992AP 54995P M56620AP M54630P M54630 n type laser diode APC RS 800 m5463 M54977 M66515FP 16P2N PDF

    M65826

    Abstract: cd-rom ic signal 128P6D-A M65826FP
    Contextual Info: y MITSUBISHI SOUND PROCESSOR ICs M65826FP SINGLE CHIP CD-ROM DECODER DESCRIPTION The M65826FP is a single chip CD-ROM Decoder using CMOS technology. CD-DA Digital Signal Processor {DSP , CD-ROM Decoder and ATAPI. This IC can be used in CD-ROM, CD-I and Video CD.


    OCR Scan     		M65826FP M65826FP 128P6D-A M65826 cd-rom ic signal 128P6D-A PDF

    78Lxx voltage regulator

    Abstract: M5N317L 78xx voltage regulator M51204 regulator 78xx series m5n317 M64500AFP M5237ML M5233 M5237L
    Contextual Info: •DISPLAY CONTROLLER - — i ? Type No. Circuit function ! Supply ! voltage : ! M3S000AFP CRT & Color/Monochrome Flat Panel Control M64513AFP Interface for AX System with M64500AFP M64542FP Navigation Graphic Controller * M64545FP EI Typical electrical characteristics


    OCR Scan     		M3S000AFP M64513AFP M64542FP M64545FP M64500AFP 160P6 160P6C 128P6D 5I203TL/FP M51204TL/FP 78Lxx voltage regulator M5N317L 78xx voltage regulator M51204 regulator 78xx series m5n317 M5237ML M5233 M5237L PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.


    Original     		300mil 64P4B 16P2P 20P2N 375mil 28P2V 300mil 26P3D 400mil TSOP 48 thermal resistance TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V PDF

    48P4B

    Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
    Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P


    Original     		240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A PDF

    8 BIT ALU IC

    Contextual Info: MITSUBISHI LSIs M 5 M 4 1 0 0 9 2 A F P ,R F -1 0 ,-1 3 3D-RAM 10485760-BIT 327680-WQRD BY 32-BIT FRAME BUFFER MEMORY DESCRIPTION • Second-generation, 0.5 The M 5M 410092A FP.R F is a 10M-bit frame buffer memory which • 128-pin, plastic QFP integrates a 327680-word by 32-bit dynamic RAM array, 2048-bit


    OCR Scan     		10485760-BIT 327680-WQRD 32-BIT) 10092A 10M-bit 128-pin, 327680-word 32-bit 2048-bit 640-bit 8 BIT ALU IC PDF

    10C2

    Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension


    Original     		12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G PDF

    324pc

    Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension


    Original     		240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881 PDF