1X36 Search Results

tsl 337

Abstract: natel engineering synchro natel engineering synchros application natel resolver to synchro
Contextual Info: r-i ' NAT EL E N G I N E E R I N G M ATEL TSL. 1X36 /' CO INC Û2 ¿e"| b M 4 7 2 E M aDDOâSS 7 I v ^ ^ - TWO Speed Synchro Data Processor 3-State 20-bit Data Output Features • Small size 1.3 x 2.6 x 0.35 inch • High resolution • (20 bits) : v .

mems

Contextual Info: MEMS 1XN SWITCH MODULE CONFIGURABLE UP TO 1X36 DiCon’s MEMS 1xN Optical Switch Module is based on DiCon’s MEMS 1x8 and 1x4 Optical Switch components. Up to five of the MEMS 1x8 switch components can be configured to provide a compact 1x36 switch. Each MEMS component is based on a

1X36

Abstract: natel engineering synchro tsl 625 natel resolver to synchro
Contextual Info: ATEL 1Y^ TWO Speed Synchro Data Processor 3-State 20-bit Data Output Features Description M odel TS_ 1X36 accepts 2 binary w ord inputs from two synchro or re so lver -to -d ig ital converters in a m ech an ically or e le ctrica lly g eared c o a rs e /fin e system and

2x58

Abstract: 1x58 2x36 1X36 quicktronic OSRAM quicktronic qt 2X18 quicktronic qt 2x36 IEC929 2x18/230-240 quicktronic qtp 2x18/230-240
Contextual Info: Q UICKTRONIC PROFESSIONAL QTP 1x18/230-240 QTP 1x36/230-240 QTP 1x58/230-240 QTP 2x18/230-240 QTP 2x36/230-240 QTP 2x58/230-240 Bei SK I-Leuchten: Erdung über das EVG-Gehäuse mittels Zahnscheibe erforderlich gem. IEC 598 . Bei SK II-Leuchten: keine Erdung erforderlich.

Contextual Info: EKA Headers Standard .025" Square Posts .100" x .100" Matrix Single and Double Row Straight Ordering Information General Information Part Number Codes • Single & double row • Single row available in 1x36 position double row available m 2x36 position • .100" centerline spacing; double row headers are

2x36

Abstract: quicktronic 1X36 quicktronic qtp8 qtp8 quicktronic professional qtp8 2x36 ecg circuit SFF2 ECG book QTP82X36
Contextual Info: QUICKTRONIC PROFESSIONAL T8 ECG for T8/∅ ∅26mm fluorescent lamps QTP8 1x36 QTP8 2x36 Technical information Edition: September 2006 Subject to change Features: • • • • • • • • • • 50,000 hours lifetime with 10% max. failure rate at tc = 75°C max.

pj 69 SMD diode

Abstract: RX-2B RX2C RX2b bs3-1000 Monitor VD58 smd diode pj 72 c8051f320-gq VD58 ISL54100
Contextual Info: ISL54100AHDMI-EVALZ, ISL54105ACRZ-EVALZ Operation Manual for Intersil’s 4:1 and 1:1 TMDS HDMI Regenerator Evaluation Kits Application Note April 1, 2009 AN1453.2 Thank you for requesting Intersil’s high-performance TMDS signal multiplexor/regenerator/retimer evaluation kit. This

Contextual Info: IBM11N32645B IBM11N32735B IBM11N32645C IBM11N32735C 32M x 64/72 DRAM MODULE Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • System Performance Benefits: - Non buffered for increased performance - Reduced noise 35 VSs/V cc P^s

Contextual Info: IBM13T2649JC 2M x 64 S D R A M SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: 10 CAS Latency J Units j 3 jfcK I Clock Frequency j 100 j MHz ! jtcK

Contextual Info: IB M 1 1 M 8 8 4 5 H B 8M x 72 Chipkill Correct DRAM Module Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for ECC applications • System Performance Benefits: • 8Mx72 Chipkill Correct EDO DIMM -Buffered inputs except RAS, Data

Contextual Info: IBM13T2649NC 2M x 64 SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: 10 CAS Latency § Units 3 jfcK I Clock Frequency I 100 j MHz jtcK j Clock Cycle

Contextual Info: Customer Information Sheet DRAWING No.: SHEET M20-786XXXX 2 OF 2 IF IN D O U B T - ASK NOT TO SCALE THIRD ANGLE PROJECTION ALL TO 1x 1 0 0 . 1 2mm MAX I x l 1 TO 1x15 0 . 1 5mm MAX 1x16 TO 1x 20 0 . 1 5mm MAX 1x21 TO 1x25 0.20mm 1x26 TO 1x 30 0 . 2 5m m MAX

Contextual Info: IB M 1 3 T 1 6 4 9 N C Preliminary 1M x 64 1 Bank SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: I 10 CAS Latency 3 ! 12 j Units ! 3 jfcK I Clock Frequency

Contextual Info: IBM11M32735B IBM11M32735C 32M x 72 DRAM Module Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • System Performance Benefits: - Buffered inputs except RAS, Data - Reduced noise (32 VSs/V cc P^s) - 4 Byte Interleave enabled - Buffered PDs

Contextual Info: IBM13V25649AP IBM13V51649AN IBM13V25649AN IBM13V51649AP 256K/512K x 64 SGRAM SO DIMM Features 144 Pin Graphics JEDEC Standard, 8 Byte Synchro­ nous Small Outline Dual-In-line Memory Module Performance: Speed Grade 7R5 ! 10 ! Units I I Clock Frequency 133 ! 100 ! MHz

Contextual Info: IBM11M1640L 1M X 64 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for byte-write non-parity applications • System Performance Benefits: -Buffered inputs except RAS, Data -Reduced noise (32 VSsA /cc P^s)

Contextual Info: IBM13V25649AN IBM13V51649AN 256K /512K x 64 S G R A M SO DIMM Features • 144 Pin Graphics JEDEC Standard, 8 Byte Syn­ chronous Small Outline Dual-In-line Memory Module • Performance: Speed Grade 7R5 j Clock Frequency 133 j Clock Cycle 7.5 j Clock Access Tim e

Contextual Info: IB M 1 1 M 1 6 7 3 5 B IB M 1 1 M 1 6 7 3 5 C 16M x 72 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for ECC applications • 16Mx72 Extended Data Out EDO Mode DIMMs • System Performance Benefits: - Buffered inputs (except RAS, Data)

Contextual Info: 10 3 \ + ( ~ ' 1 A CKT DIM, ' A" DIM." B ' C-+00 .4 5 SCKT S IZE IZE -.018 IX / (2.54) . too 1X21 IX 2 (2.54> . 100 ( 5 . 0 8 ) . 200 1X22 IX 3 ( 5 . 0 8 ) ,200 ( 7 . 6 2 ) . 300 1X23 IX 4 ( 7 . 6 2 ) , 300 (10, 16 ) ,400 EX24 IX 5 ( 1 0 ,1 6 ) .400 ( 1 2 ,7 0 )

G17 amphenol

Abstract: box header 2x10 right angle 1x2 pin header 2.54mm pitch G55H 2.54mm HEADER 2X7 2.54MM 1x5 pin header 2.54mm pitch G800 amphenol Post 2.54mm dual row straight pin header 2x40 G89011030020 AMPHENOL G821
Contextual Info: Amphenol Miniature Box Interconnects G800/1 2.54mm Pin Headers PCB Mount This series was designed to offer both Board to Board B2B and Board to Wire (B2W) solutions. The headers can be cut to size and are modular. Materials Contact Finish/Durability Housing

smd code r55

Abstract: schematic diagram of laptop inverter schematic diagram vga 15-pin ic rgb to vga schematic diagram vga to rgb cable connector circuit diagram vga to video cable SN74HC14D schematic diagram vga smd rgb smd 4-pin DUAL DIODE
Contextual Info: ISL59481EVAL1Z Evaluation Board User’s Guide Application Note Introduction The ISL59481EVAL1Z evaluation board contains the ISL59481 Dual 4:1 RGB MUX amp and associated components needed to implement an 8:1 RGB+H/V sync video multiplexer. The 8 video input ports, and single output

8735C

Contextual Info: IBM11N8645B IBM11N8735B IBM11N8645C IBM11N8735C 8M x 64/72 DRAM MODULE Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • System Performance Benefits: -Non buffered for increased performance • 8Mx64, 8Mx72 Dual Bank Extended Data Out

1X359

Contextual Info: IBM11M1645L 1M X 64 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • 1 Mx64 Extended Data Out Page Mode DIMM • Performance: -60 -70 tRAC ; RAS Access Tim e 60ns ; 70ns tcAC ! CAS Access Tim e 20ns ! 25ns W | Access Tim e From Address

Contextual Info: Application Note 1932 ISL28023 Precision Digital Power Monitor Evaluation Kit User Guide Introduction ISL28023 Generic Board ISL28023EVAL1Z The Precision Digital Power Monitor (DPM) Evaluation Kit is a three evaluation board design that demonstrates the