25929 Search Results

Contextual Info: PXI GSM/EDGE Measurement Suite The GSM/EDGE measurement suite is a collection of software tools for use with Aeroflex PXI 3000 Series RF modular instruments for characterising the performance of GSM/HSCSD/GPRS and EGPRS mobile devices in accordance with the methods described in 3GPP 51-010-1.

Contextual Info: Extract from the online catalog MSTB 2,5/ 4-ST BK AU Order No.: 1752292 Plug component, Nominal current: 12 A, Number of positions: 4, Pitch: 5 mm, Connection method: Screw connection

Contextual Info: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010

25929

Abstract: CDBC
Contextual Info: 计算机应用 嵌入式系统中的 +,-. 接口编程技术 中 国 科 学 院 声 学 研 究 所（ #"""8" ） 何 希 顺 清 华 大 学 自 动 化 系（ #"""85 ） 张 跃 何 荣 森 摘 要 ： 分 析 了 嵌 入 式 系 统 开 发 中 常 用 的 三 种 芯 片 编 程 方 法 ，介 绍 了 ’ & 接 口 的 标 准 工 作 原

Contextual Info: Extract from the online catalog MSTB 2,5/ 4-ST BK AU Order No.: 1752292 Plug component, Number of positions: 4, Pitch: 5 mm Product notes WEEE/RoHS-compliant since: 01/01/2003

JSTD-020

Abstract: DM035 26438
Contextual Info: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7

dallas date code ds1230

Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00

173681-2

Abstract: 25365.123.211 25325.123.211 Hartmann 221 GHW Connectors
Contextual Info: GHWmGROTI & HARTMANN '7 VERBiNDUNGSTECHNIK Flachstecktechnik 2,8 mm Flat connectors 2.8 mm 411 T Flachsteckhulsen Receptacles fur Steckerbreite 2,8 mm DIN 46330 und ahnliche Ausfuhrungen for tab width 2.8 mm DIN 46330 and similar types Typ 1 Schnttt A-B Typ

S12G48

Abstract: regulator 17-33 MC9S12G128 S12G64 S12GA96 S12GA128 9S12G128 S12GN48 S12GN16 0N51A
Contextual Info: MC9S12G Family Reference Manual S12 Microcontrollers MC9S12GRMV1 Rev.1.12 May 7, 2012 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information

CGS HSA25

Abstract: "Humidity Sensors" his-06 CGS HSA50 CGS SBCHE 15 Humidity Sensors resistances his-06 NEOHM RESISTORS HSA2522KJ 2-1625971-5 schrack ra 900 HDP-07 5w resistor 0.1Ohm
Contextual Info: Passive Components Resistor Catalogue Passive Components Introduction Tyco Electronics is the world’s largest passive electronic components manufacturer, and a world leader in cutting-edge wireless technologies, fibre optic active components, and complete power systems. The company has facilities located in 51 countries serving

Contextual Info: 24 23 21 22 19 20 17 IB 16 15 14 12 13 10 11 7 8 7E SYMBOL D E F I N I T I O N M IS S IN G SYMBOLS A D IM ENSIO N WITHOUT AN IN S P E C T IO N REPORT SYMBOL C D OR < D DOES NOT R EQ U IR E IN S P E C T IO N . IT MAY BE CONTROLLED ON THE IN D IV ID U A L COMPONENT DRAWING.

Contextual Info: 24 23 22 21 20 19 18 17 16 15 14 12 13 11 8 10 7 SYMBOL DEFINITION A DIMENSI ON WITHOUT AN I N S P E C T I O N REPORT SYMBOL DOES NOT R EQ U IR E I N S P E C T I O N . IT MAY BE CONTROLLED ON THE I N D I V I D U A L COMPONENT DRAWING. M M ISSING TOTAL NO OF

25821

Abstract: dallas date code ds12887 25854
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC

SPLC502B

Abstract: orise LCD driver
Contextual Info: SPLC502B 132 x 65 Dot Matrix LCD Driver MAR. 30, 2007 Version 1.0 ORISE Technology reserves the right to change this documentation without prior notice. Information provided by ORISE Technology is believed to be accurate and reliable. However, ORISE Technology makes no warranty for any errors which may appear in this document. Contact ORISE Technology to

26705.201.185

Abstract: 13551.669.699 26659.330.185 14650.669.696 16695627642 KOMAX 40 flachstecker lear 26649.330.186 14730.598.696 26591.331.185
Contextual Info: Introduction MSK Page / Seite 5-8 Micro Connector Systems 0.63 mm x 0.63 mm VEK 9 - 16 17 - 26 27 - 54 55 - 68 69 - 76 77 - 98 99 - 108 109 - 122 123 - 140 141 - 152 Connector Systems PPGLDPHWHU Relaissockel $QZHQGXQJHQIU Flachstecksysteme 2,8 / 4,8 / 6,3 / 9,5 mm

OTS Couplings

Abstract: Couplings STB-34 STB 34 r2s3 STS-44 25847 R-FLEX R2S35 PFS11
Contextual Info: OTS COUPLINGS Off-The-Shelf Couplings FLEXIBLE SHAFT COUPLINGS Senior Aerospace Metal Bellows designs, engineers, and assembles a broad line of flexible shaft couplings that deliver precise positioning and control of machine components. Featuring all welded stainless steel construction, SAMB couplings are highly resistant to corrosion,

25804

Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1

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