8-PIN DIP 8-PIN SOP Search Results

DS1425L-F5

Abstract: ds1480s F5 sot223 DS1868 DS75U ds1642-150 DS1669SN-10 DS1220Y-200IND ds1386-8-150 DS1251W-120
Contextual Info: DEVICE DS0621 DS1000 DS1000-IND DS1004 DS1005 DS1007 DS1010 DS1013 DS1020 PACKAGE TYPE OPERATING TEMPERATURORDERING RANGE CELSIUS NUMBER Software 8-Pin DIP 8-Pin SOIC 8-Pin SOIC T&R 8-Pin DIP 8-Pin SOIC 8-Pin SOIC T&R 8-Pin DIP 8-Pin DIP 8-Pin DIP 8-Pin DIP

4-PIN

Abstract: 8-Pin DIP 8-pin sop SOP-4 LH1529
Contextual Info: VISHAY Vishay Semiconductors Part Number Coding Coding Scheme LH1529 A AC 1 No dc contact for 6-pin package, at Pin 5 Package Configuration 1 or 2 Alpha Sufffix Designator - B = 8-pin DIP - D = 4-pin DIP - T = 6-pin DIP - AB = 6-pin - AC = 8-pin - CC = 8-pin "S" Bend

LH1529

Contextual Info: VISHAY Vishay Semiconductors Part Number Coding Coding Scheme LH1529 A AC 1 No dc contact for 6-pin package, at Pin 5 Package Configuration 1 or 2 Alpha Sufffix Designator - B=8-pin DIP - D=4-pin DIP - T=6-pin DIP - AB=6-pin - AC=8-pin - CC=8-pin "S" Bend

Contextual Info: OPTOCOUPLERS NUMBERING SYSTEM P s o o o o o 0-0 - t _ CTR Rank -Taping 'E3, E4S| Identification number f 3 , 25. 4 to 16 pin DIP Multi Type 26. 6 pin DIP 27. 4 to 16 pin SOP Pin pitch 2.54 mm 28. SOP (Pin pitch 1.27 mm) 86. 8 pin DIP (Analog output) 96. 8 pin DIP (Digital output)

Contextual Info: Part Numbering System P S X X X X X - X - X - X 25 = 4 to 16 pin DIP Multi Type 26 = 6 pin DIP Identification number CTR Rank 27 = 4 to 16 pin SOP Pin pitch 2.54 mm Taping 28 = SOP (Pin pitch 1.27 mm) E3, E4, F3, F4 86 = 8 pin DIP (Analog output) 96 = 8 pin DIP (Digital output)

TSSOP 8PIN MARK 21

Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Contextual Info: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP

8 pin relay datasheet

Abstract: 5 pin relay datasheet dc 5 pin relay data sheet 5 pin relay datasheet 5 pin relay 5 pin relay configuration relay 5 pin relay 8 pin "Solid State Relay" INFINEON
Contextual Info: Solid State Relay Part Number Coding CODING Coding Scheme LH1529 A AC 1 No dc contact for 6 pin package, at Pin 5 Package Configuration 1 or 2 Alpha Sufffix designator – B=8-pin DIP – D=4-pin DIP – T=6-pin DIP – AB=6-pin Gull Wing – AC=8-pin Gull Wing

5 PIN relay pin configuration

Abstract: dip relay 8 pin LH1529 317 SOP 4 pin relay configuration
Contextual Info: Solid State Relay Part Number Coding CODING Coding Scheme LH1529 A AC 1 No dc contact for 6-pin package, at Pin 5 Package Configuration 1 or 2 Alpha Sufffix Designator – B=8-pin DIP – D=4-pin DIP – T=6-pin DIP – AB=6-pin Gull Wing – AC=8-pin Gull Wing

footprint 24PIN DIP

Abstract: 1400E AF 239 TQFP 100 PACKAGE footprint dip Package dimension 100L J-10 J-12 J-13 TQFP 80 PACKAGE footprint
Contextual Info: DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information. J-4 DIP Packages

x27c

Contextual Info: MXIC MX27C256 256K-BIT 32K x 8 CMOS EPROM FEATURES • • • • • Completely TTL compatible Operating current: 30mA Standby current: 100|aA Package type: - 28 pin ceramic DIP, plastic DIP, plastic SOP - 32 pin PLCC - 28 pin 8 x 13.4mm TSOP(I) 32K x 8 organization

KM23C1010

Contextual Info: CMOS MASK ROM KM23C1000/1010 1M-Bit 128K X 8 CMOS MASK ROM FEATURES GENERAL DESCRIPTION • KM23C1000: 28-pin DIP (Polarity programmable chip enable pin) • KM23C1010: 32-pin DIP (Polarity programmable chip enable pin and output enable pin) • 131,072 x 8 bit organization

23C1001

Contextual Info: KM23C1001/1011 CMOS MASK ROM 1M-Bit 128K x 8 CMOS MASK ROM FEATURES GENERAL DESCRIPTION • KM23C1001: 28 pin DIP (Polarity programmable output enable pin) • KM23C1011: 32-pin DIP (Polarity programmable output enable pin) • 131,072 x 8 bit organization

ds1480

Abstract: DS1480S DS1425L-F5 DS1867E-010 DS1775 DS1225Y-200 F5 sot223 DS1023S-100 DS2110 DS1267S-100
Contextual Info: OPERATING TEMP. RANGE CELSIUS ORDERING NUMBER DS0621-SDK SPEED OR VERSION 14-Pin DIP 8-Pin DIP 16-Pin SOIC 16-Pin SOIC T&R 8-Pin SOIC 8-Pin SOIC T&R 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 DS1000-xxx DS1000M-xxx DS1000S-xxx DS1000S-xxx/T&R DS1000Z-xxx

TQFP 100 PACKAGE footprint

Abstract: footprint 24PIN DIP 100L J-10 J-12 J-13 footprint dip 16 AD #0953
Contextual Info: ICS Standard Package Dimensions J-1 DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information.

CXL5001M

Abstract: 2SA1175 CXL5001P
Contextual Info: CXL5001M/P CMOS-CCD 1H Delay Line for NTSC Description The CXL5001M/P are general-purpose CMOS-CCD delay line ICs that provide 1H delay time for NTSC. CXL5001M 8 pin SOP Plastic CXL5001P 8 pin DIP (Plastic) Features • Low power consumtion 80mW (Typ.) • Small size package (8-pin SOP, DIP)

Contextual Info: M X27C2000 2M-BIT [256K x 8] CMOS EPROM FEATURES • 256Kx 8 organization • Operating current:30mA • Single +5V power supply • Standby current: 100uA • +12.5V programming voltage • Package type: - 32 pin ceramic DIP, plastic DIP - 32 pin SOP - 32 pin PLCC

LH52256C-70LL

Abstract: LH52256C
Contextual Info: LH52256C/CH FEATURES • 32,768 x 8 bit organization • Access time: 70 ns MAX. CMOS 256K (32K × 8) Static RAM PIN CONNECTIONS TOP VIEW 28-PIN DIP 28-PIN SK-DIP 28-PIN SOP • Supply current: Operating: 45 mA (MAX.) 10 mA (MAX.) (tRC, tWC = 1 µs) Standby: 40 µA (MAX.)

unit inch sdip28

Abstract: LH52256C lh52256c-70ll
Contextual Info: LH52256C/CH FEATURES • 32,768 x 8 bit organization • Access time: 70 ns MAX. CMOS 256K (32K × 8) Static RAM PIN CONNECTIONS TOP VIEW 28-PIN DIP 28-PIN SK-DIP 28-PIN SOP • Supply current: Operating: 45 mA (MAX.) 10 mA (MAX.) (tRC, tWC = 1 µs) Standby: 40 µA (MAX.)

EPROM sop 40

Contextual Info: D IN IF O M Ä T Q Ü IN ] m A M X 2 7 C 8 1 O O MACRONIX, INC. 8M-BIT 1 M x 8/5*1 2K x IB CMOS EPROM FEATURES • • • • • • • MASK ROM pin out compatible Package type: - 42 pin ceramic DIP - 42 pin plastic DIP - 44 pin SOP 1M x 8 or 512K x 16 organization

xt_3

Abstract: 636 8pin SG-8002CA
Contextual Info: Applications guide Dimensions • Unit: mm DIP 16-pin (SPG series) SIP 3-pin (SG-10) . 16.0 max. I 3.0 min. 4.5 max. XT • DIP 14-pin (SG-51 series, SG-8002DB series) • DIP 14-pin (MG-3020) o rF9o*=to 1—*i. DIP 8-pin (SG-531 series, SG-8002DC series,

M/AHD-05-0500

Contextual Info: LH5164A/AH FEATURES • 8,192 x 8 bit organization • Access times: 80/100 ns MAX. CMOS 64K (8K x 8) S ta tic RAM PIN CONNECTIONS 28-PIN DIP 28-PIN SK-DIP 28-PIN SOP TOP VIEW r • Low-power consumption: Operating: 303 mW (MAX.) LH5164A/D/N @ 80 ns 248 mW (MAX.) LH5164A/D/N/T

1519B

Abstract: P4C1256 P4C1256L
Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK

Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK

S24C MARK

Abstract: tsop 3602 9020 8-pin SOP SIP 400B nec 1251 P100G thomson 462 t P5VP-340B3-2 J 80222 P28D-100-600A1-1
Contextual Info: Packages Plastic DIP Dual In-line Package Units in mm 8-pin plastic DIP (300mil) 8 5 1 4 14-pin plastic DIP with TAB (300mil) 14 8 1 7 20.32 MAX. 7.62 10.16 MAX. 24.60 MAX. 7.62 4.31 MAX. 6.4 0.9 MIN. 6.4 5.08 MAX. 5.08 MAX. 4.31 MAX. 2.54 0.51 MIN. 2.54