8200T Search Results

Contextual Info: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating

L05X

Abstract: LA2805 DIP24S MFP24 Voice Detector ML504
Contextual Info: Ordering number: EN3248Ç M onolithic Linear ÍC LA2805.2805M Telephone A nsw erin g M achine U se Overview The LA2805,2805M is a telephone answ ering m achine-use bipolar IC th a t perform s the basic functions required for telephone answ ering m achine and has the m icrocom puter interfaces and analog switches to

G770H

Abstract: JESD22-B105 G770HC Sumitomo G770HC
Contextual Info: 11/22/2005 PACKAGE RELIABILITY REPORT FOR NSEB, 2 SFN, 6x6x0.88um, Pb-Free Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292

SUMITOMO CRM1076

Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers

LMU112

Abstract: 12x12-bit
Contextual Info: LOGIC DEVICES INC TS M ^ S S t S l D S 0 0 0 0 ^ 1 3 T “^ " 07 LMU112 12 x 12-bit parallel multiplier general information The LMU112 is a high-speed, low power, 12-bit parallel multiplier built using advanced CMOS technology.The LMU112 is pin and functionally compatible with

g770HCD

Abstract: CRM1066C VFQFPN16 G770H G770 A0812 QMI519 crm1066 IDT5T9306NLGI CRM10
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0812-02 DATE: 9-Jan-2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: VFQFPN-16 and VFQFPN-28 (Standard and RoHS)

pd223

Abstract: pd 223 PI3EQX6801 PI2EQX6811ZDEX PI3EQX6801ZDE PI3EQX5701 PI3EQX4951ST ABLEBOND 8200T PI3EQX6701AZDE PI3EQX6741STZDE
Contextual Info: New Product Databrief PI3EQX6801 6.5Gbps, 1-port, 1.5V/3.3V SATA/SAS ReDriver with Analog/Digital Configuration Pericom Semiconductor’s PI3EQX6801 is a low power, 1.5V/3.3V, 6.5Gbps, SATA/SAS signal ReDriver™. The device provides programmable equalization, to optimize performance

Q3-6646

Contextual Info: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating

Contextual Info: DATE: 11 December, 2012 PCN #: 2089 PCN Title: Qualification of Alternate Lead Frame Type and Die Bond Material for A Selected Device Dear Customer: This is an announcement of change s to products that are currently being

JESD22-C101

Abstract: JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115
Contextual Info: 2/27/2008 RELIABILITY REPORT FOR DS1099, Rev A3 8" Maxim Integrated Products 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Maxim Integrated Products 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email: don.lipps@dalsemi.com

Contextual Info: Materials Declaration Data Sheet ASVM_ASVMB-Series QFN 7.0 x 5.0 mm 85.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating

CV-8710

Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Contextual Info:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010

JESD22-A118

Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers

Contextual Info: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating

JESD22-C101E

Abstract: JESD22-C101-E 8200T g770HCD JESD22-A114F JESD78B JESD22-A115F
Contextual Info: TS7003 Reliability Report Device Description The TS7003 – a single-supply, single-channel, 12-bit analog-to-digital converter ADC - is Touchstone Semiconductor’s 1st successive-approximation ADC that combines a high-bandwidth track-and-hold (T/H), a high-speed serial digital interface, an internal +2.5V reference, and low conversion-mode

La2805

Abstract: block diagram of answering machine
Contextual Info: Ordering number:ENN3248C Monolithic Linear IC LA2805, 2805M Telephone Answering Machine Use Overview Package Dimensions The LA2805, 2805M is a telephone answering machineuse bipolar IC that performs the basic functions required for telephone answering machine and has the microcomputer interfaces and analog switches to control these functions.

g770HCD

Abstract: a1009 Die attach CRM1076NS crm1076 CRM1076NS CRM1076N CRM*1076 G770H G770HC CRM-1076
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1009-02 Product Affected: DATE: October 28, 2010 4mm x 4mm VFQFP-N-28 (Green) MEANS OF DISTINGUISHING CHANGED DEVICES: Product Mark

sumitomo g770hcd

Abstract: G770H G770HC QMI519 Sumitomo G770HC g770HCD 8200T G770* sumitomo 9UMS9610BKLFT G770
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0907-03 DATE: 25-Aug-2009 Product Affected: 6mm x 6mm VFQFPN-48 (Green) Refer to Attachment II for the affected part numbers

LOGITECH trackman marble trackball

Abstract: teac fd 235hf m1606sau TEAC FLOPPY scsi fujitsu m1606sau teac fd-235hf FD-235HF glidepoint AC127 seagate ST32550W
Contextual Info: Intel AP450GX MP Server System Hardware/Operating Systems Test Cross-Reference List Revision -001 March,1997 The AP450GX system may contain design defects or errors known as errata which may cause the product to deviate from published s pecifications. Characterized errata that