ST16-19HDSE
Abstract: ST16ST2G ST16 security algorithm
Text: ST16ST2G Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library DATA BRIEFING • 1 K Byte of T2G AUTHENTICATION LIBRARY ■ 1.5 K Byte of SYSTEM ROM ■ 384 Bytes of RAM ■ Up to 16352 Bytes of EEPROM, SECTOR COMBINATIVE 3 15 K Bytes of USER ROM SECTOR
|
Original
|
PDF
|
ST16ST2G
102b/DS
ST16-19HDSE
ST16ST2G
ST16
security algorithm
|
ST16
Abstract: ST16-19HDS ST16ST2G t2g memory
Text: ST16ST2G Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library DATA BRIEFING 1 KByte of T2G AUTHENTICATION LIBRARY • 1.5 KByte of SYSTEM ROM ■ 384 Bytes of RAM ■ Up to 16352 Bytes of EEPROM, SECTOR COMBINATIVE 2 ■ 2 15 KBytes of USER ROM SECTOR
|
Original
|
PDF
|
ST16ST2G
102b/DS
ST16
ST16-19HDS
ST16ST2G
t2g memory
|
micromodule
Abstract: ST16 ST16-19HDSE ST16ST2G
Text: ST16ST2G Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library + DATA BRIEFING • 1 K Byte of T2G+ AUTHENTICATION LIBRARY ■ 1.5 K Byte of SYSTEM ROM ■ 384 Bytes of RAM ■ Up to 16352 Bytes of EEPROM, SECTOR COMBINATIVE 3 15 K Bytes of USER ROM
|
Original
|
PDF
|
ST16ST2G
102b/DS
micromodule
ST16
ST16-19HDSE
ST16ST2G
|
bull cp8
Abstract: ST16xyz
Text: ST16ST2G CMOS MCU BASED SAFEGUARDED SMART CARD IC WITH 8176 Bytes EEPROM & T2G AUTHENTICATION LIBRARY PRELIMINARY DATA EXTENDED VOLTAGE OPERATION – Vcc Range : 2.7V to 5.5V • 8 BIT ARCHITECTURE CPU ■ 15 KBytes of USER ROM ■ 1 Kbyte of T2G AUTHENTICATION LIBRARY
|
Original
|
PDF
|
ST16ST2G
bull cp8
ST16xyz
|
ST16XY
Abstract: ST16SF48 ST16ST2G bull thomson ISO STANDARDS
Text: ST16ST2G CMOS MCU BASED SAFEGUARDED SMART CARD IC WITH 8176 Bytes EEPROM & T2G AUTHENTICATION LIBRARY BRIEF DATA • EXTENDED VOLTAGE OPERATION – VCC Range: 2.7V to 5.5V ■ 8 BIT ARCHITECTURE CPU ■ 15 KBytes of USER ROM ■ 1 KByte of ACF Library ■ 1.5 KBytes of SYSTEM ROM.
|
Original
|
PDF
|
ST16ST2G
ST16XY
ST16SF48
ST16ST2G
bull thomson
ISO STANDARDS
|
ST16
Abstract: ST16-19HDSE ST16ST2G security algorithm
Text: ST16ST2G Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library DATA BRIEFING 1 K Byte of T2G AUTHENTICATION LIBRARY • 1.5 K Byte of SYSTEM ROM ■ 384 Bytes of RAM ■ Up to 16352 Bytes of EEPROM, SECTOR COMBINATIVE 3 ■ Figure 1. Delivery Form
|
Original
|
PDF
|
ST16ST2G
102b/DS
ST16
ST16-19HDSE
ST16ST2G
security algorithm
|
ST1305B
Abstract: ST1331 ST1333 ST1335 ST1336 ST16ST2G ST1200 ST133X
Text: Memory with Security for Memory Cards PRE-PAYMENT, VENDING, TELEPHONE CARDS, ID, TOKENS The ST133x family is a new and better alternative to all current telephone pre-payment ICs. These devices can be implemented in current systems by using an appropriate security module
|
Original
|
PDF
|
ST133x
ST16ST2G)
ST1305B
FLSC9815/0998
ST1200
ST1331
ST1333
ST1335
ST1336
ST16ST2G
ST1200
|
TSOP40 Flash
Abstract: m48z32y M27V512 FDIP24W M27128A M2716 M27256 M2732A M27512 M2764A
Text: MEMORY PRODUCTS SELECTOR GUIDE A C) NMOS UV EPROM, 5V Operation Size 16 Kb 32 Kb 64 Kb 128 Kb 256 Kb 512 Kb Ref M2716 M2732A M2764A M27128A M27256 M27512 Description 16 Kb x8), 350 - 450ns, NMOS 32 Kb (x8), 200 - 450ns, NMOS 64 Kb (x8), 180 - 450ns, NMOS
|
Original
|
PDF
|
M2716
M2732A
M2764A
M27128A
M27256
M27512
450ns,
TSOP40 Flash
m48z32y
M27V512
FDIP24W
M27128A
M2716
M27256
M2732A
M27512
M2764A
|
SMARTCARD micromodule assembly
Abstract: emv 7816 smartcard
Text: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
|
Original
|
PDF
|
|
EEPROMs
Abstract: eeprom RAM memory 64 KB ST1200 ST1305 ST1331 ST1336 ST14C02C st16rf42 ST1335
Text: MEMORIES and SMARTCARD PRODUCTS SMARTCARD PRODUCTS STANDARD MEMORY Ref ST14C02C M14C04-W M14C16-W M14C32-W M14C64-W M14128-W M14256-W NV Memory Size VCC Range Features Package 2 Kb EEPROM 4 Kb EEPROM 16 Kb EEPROM 32 Kb EEPROM 64 Kb EEPROM 128 Kb EEPROM 256 Kb EEPROM
|
Original
|
PDF
|
ST14C02C
M14C04-W
M14C16-W
M14C32-W
M14C64-W
M14128-W
M14256-W
ST1200
ST1305
ST1331
EEPROMs
eeprom
RAM memory 64 KB
ST1200
ST1305
ST1336
ST14C02C
st16rf42
ST1335
|
ST1335
Abstract: ST13 ST1333 ST16 ST16SF41 ST16SF42 ST16SF44 ST16SF48 ST16SF4F ST16ST2G
Text: New System Solution for Telephone Cards ST13 TELEPHONE CARD AND ST16 MCU IC PROVIDE COMPLETE SOLUTION STMicroelectronics pioneered the Telephone Card IC with mass application of the France Telecom Phonecard T1G starting in 1986. This was followed by the Deutsche Telecom Phonecard in 1992.
|
Original
|
PDF
|
FLSC9810/0998
ST1335
ST13
ST1333
ST16
ST16SF41
ST16SF42
ST16SF44
ST16SF48
ST16SF4F
ST16ST2G
|
SMARTCARD micromodule assembly
Abstract: MICROMODULES SMARTCARD ST16CF54 ST16SF42 ST16600 ST16601 ST16SF41 ST16SF44 ST16SF48
Text: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
|
Original
|
PDF
|
|
footprint so44
Abstract: 9977 IC SOCKET TSOP48 TSOP32 FOOTPRINT ST1355 52 pin plcc socket ST19GF34 PSDSoft ST19AF08 serial flash 256Mb fast erase spi
Text: MEMORY SELECTOR Leading Edge Memories • 1999 GO Why a Broad Range? Leading Edge Memories OTP and UV EPROMs Flash Memories Serial and Parallel EEPROMs ASM and Memory Card ICs Memory Systems and NVRAMs BROAD RANGE STMicroelectronics is a world leader in non-volatile memories, manufacturing a broad
|
Original
|
PDF
|
operat911)
D-90449
BRMEMSEL/0699
footprint so44
9977
IC SOCKET TSOP48
TSOP32 FOOTPRINT
ST1355
52 pin plcc socket
ST19GF34
PSDSoft
ST19AF08
serial flash 256Mb fast erase spi
|
SMARTCARD micromodule assembly
Abstract: ST14C02 M14C04 M14C16 M14C32 M14C64 ST1200 ST1305B ST1331 ST1333
Text: SUPER 35 MM MICROMODULES Super 35 mm Micromodules for Smartcards and Memory Cards DATA BRIEFING • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side 1 1 1 1 1 1 – Support for the chip
|
Original
|
PDF
|
|
|
|
