A0130 Search Results

LND150

Contextual Info: LND150 Die Specification Pad Layout 2 3 1 0,0 Backside: Source Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 11 ± 1.5 None 1 (mils) LND150 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Source

HV5530

Contextual Info: HV5530 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133

pocket Scale block diagram

Contextual Info: HV9903 White LED Driver IC Features ► Power efficiency of up to 85% ► Drives up to six white LEDs ► 2.6 - 4.6V supply power stage can operate at 1.8V see page 7 ► Built-in soft start ► DC and PWM dimming control ► Built-in open LED protection

Contextual Info: VP0550 P-Channel Enhancement-Mode Vertical DMOS FETs Features General Description ► ► ► ► ► ► ► The Supertex VP0550 is an enhancement-mode normallyoff transistor that utilizes a vertical DMOS structure and Supertex’s well-proven silicon-gate manufacturing

sivp

Abstract: VP0808L-G 125OC VP0808
Contextual Info: VP0808 Features ► ► ► ► ► ► ► P-Channel Enhancement-Mode Vertical DMOS FETs General Description Free from secondary breakdown Low power drive requirement Ease of paralleling Low CISS and fast switching speeds High input impedance and high gain

B101x

Contextual Info: Netzfilter Netzfilter Dieses umfassende Sortiment, das für die Reduzierung leitungsgeführter EMS entwickelt wurde, bietet viele Lösungen für das EMS-Problem. Um individuellen Konstruktionsanforderungen zu entsprechen, sind die Filter mit drei Dämpfungsoptionen erhältlich - Standard, Hochleistung

Contextual Info: bulgin a brand of Elektron Technology Mains Filters Designed to reduce conducted mains borne EMI, this extensive range provides many solutions to EMI problems. To meet individual design requirements the filters are available with two attenuation options –

XORB

Abstract: 8XC196kc 8XC196KC instruction set AD0-AD15 8XC196KC/KD
Contextual Info: I/O Ports 6 CHAPTER 6 I/O PORTS I/O ports provide a mechanism to transfer information between the device and the surrounding system circuitry. They can read system status, monitor system operation, output device status, configure system options, generate control signals, provide serial

Contextual Info: MAINS FILTERS tSBU LG IN IEC Power Inlets Single Fused in 1, 3, or 6 Amp Current Rating Single Fused 2 Alternative Circuits 2.8 or 6.3mm tabs 41.5 1, 3, or 6 Amp Current Rating 3 4 .5 ^ 3 3 .2 5 Min c 2 uD1 C\l oi CNI' _ o n - a Single Fused IEC CONNECTORS

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

LP0701

Contextual Info: LP0701 Die Specification Pad Layout 1 2 3 0,0 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 50 70 11 ± 1.5 None 1 (mils) LP0701 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain

HV4622

Contextual Info: HV4622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material Bond Wire Bond Wire Size VSS Al/Cu/Si Au 1.3 36 Die Specifications

HV5122

Contextual Info: HV5122 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133

PS21

Abstract: PS20 PX0587 PX0588 A0130
Contextual Info: FiltersSection - 2010:FiltersSection - 2010 8/6/10 16:57 Page 140 MAINS FILTERS IEC Power Inlets Single Fused PANEL MOUNTING ᔢ 1, 3, or 6 Amp Current Rating ᔢ Single Fused ᔢ 2 Alternative Circuits ᔢ 2.8 or 6.3mm tabs PS20/A SNAP FIT ᔢ 1, 3, or 6 Amp Current

LT3973-3.3

Abstract: 0829A LT3971-3.3
Contextual Info: SERIES 3 5 0 0 i i DESCRIPTION FEATURES Philips Components Series 3500 A.C. motor-start capacitor is an electrochemical device consisting of compactly wound aluminum foil separated by layers of paper, which are impregnated with a conducting electrolyte. Etching of the foil prior to

PS01

Abstract: PS20 PS22 PS25 PS26
Contextual Info: Designed to reduce conducted mains borne EMI, this extensive range provides many solutions to EMI problems. To meet individual design requirements the filters are available with two attenuation options – standard and medical. Current ratings are from 1 to 10 amps with single

Contextual Info: Mains Filters Mains Filters Designed to reduce conducted mains borne EMI, this extensive range provides many solutions to EMI problems. To meet individual design requirements the filters are available with three attenuation options – standard, high performance and

GC400

Abstract: MUlti-Strand Wire GC400-ND H9916 A0137-ND A0139-ND 1-604152-1 A0131-ND GC401-ND A0135-ND
Contextual Info: NEW! Barrier Blocks HR31 Series Connectors Fig. 1 Fig. 2 35.5 Fig. 3 35.5 28.3 4.3 35.5 12 12 10.2 8.6 8.6 3.3 Features: • Crimped and connected to terminal then fastened simply by inserting into housing • High density mounting • Prevention of connection errors • No need for screws, built-in locking pin secures connector to the board

Contextual Info: コマンドリファレンス コマンドリファレンス コンソールtelnet または AUX（FNX0532 / 0532A のみ使用可能） で本装置に接続することで、設定の変更や現在の状態の表示な どの作業ができます。接続後、コマンドを入力することで、設

Contextual Info: RU8-S040031 01 コマンドリファレンス コマンドリファレンス コンソールtelnet で本装置に接続することで、設定の変更や現在の状 態の表示などの作業ができます。接続後、コマンドを入力することで、

2.2NF

Abstract: 65mH PS20 PS21 BVA02 BZV02 BZH01 BZH02 BZV01 A0320
Contextual Info: POLYSNAP POWER INLET MODULES C14 Inlet Single Fuse - Standard Filter EMI FILTER OPTIONS ᔢ For Polysnap modules BZV01, BZV02, BZH01, BZH02, BZH11, BZH12, BZH19, BZH20, BVA01, BVA02, BVB01, BVB02 ᔢ PF0011 style single fuse IEC inlet ᔢ Using PS21/A style filter

PS01

Abstract: PS20 PS25 PS26 B0630 PS-20
Contextual Info: FiltersSection - 2010:FiltersSection - 2010 8/6/10 16:56 Page 131 Mains Filters Designed to reduce conducted mains borne EMI, this extensive range provides many solutions to EMI problems. To meet individual design requirements the filters are available with two attenuation options –

HV5622

Contextual Info: HV5622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133

HV3418

Contextual Info: HV3418 Die Specification Pad Layout 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 25 42 24 43 23 44 22 45 21 46 20 47 19 48 18 49 17 50 16 51 15 52 14 53 13 54 12 55 11 56 10 57 9 58 8 59 7 60 6 61 5 62 4 63 3 64 2 65 1 76 0,0 75 74 73 72 71 70 69 68 66