A013009 Search Results
A013009 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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LND150Contextual Info: LND150 Die Specification Pad Layout 2 3 1 0,0 Backside: Source Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 11 ± 1.5 None 1 (mils) LND150 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Source |
Original |
LND150 LND150 A013009 | |
HV5530Contextual Info: HV5530 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133 |
Original |
HV5530 HV5530 A013009 | |
pocket Scale block diagramContextual Info: HV9903 White LED Driver IC Features ► Power efficiency of up to 85% ► Drives up to six white LEDs ► 2.6 - 4.6V supply power stage can operate at 1.8V see page 7 ► Built-in soft start ► DC and PWM dimming control ► Built-in open LED protection |
Original |
HV9903 500nA DSFP-HV9903 A013009 pocket Scale block diagram | |
Contextual Info: VP0550 P-Channel Enhancement-Mode Vertical DMOS FETs Features General Description ► ► ► ► ► ► ► The Supertex VP0550 is an enhancement-mode normallyoff transistor that utilizes a vertical DMOS structure and Supertex’s well-proven silicon-gate manufacturing |
Original |
VP0550 DSFP-VP0550 A013009 | |
LP0701Contextual Info: LP0701 Die Specification Pad Layout 1 2 3 0,0 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 50 70 11 ± 1.5 None 1 (mils) LP0701 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain |
Original |
LP0701 LP0701 A013009 | |
HV4622Contextual Info: HV4622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material Bond Wire Bond Wire Size VSS Al/Cu/Si Au 1.3 36 Die Specifications |
Original |
HV4622 HV4622 A013009 | |
HV5122Contextual Info: HV5122 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133 |
Original |
HV5122 HV5122 A013009 | |
HV5622Contextual Info: HV5622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133 |
Original |
HV5622 HV5622 A013009 | |
HV3418Contextual Info: HV3418 Die Specification Pad Layout 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 25 42 24 43 23 44 22 45 21 46 20 47 19 48 18 49 17 50 16 51 15 52 14 53 13 54 12 55 11 56 10 57 9 58 8 59 7 60 6 61 5 62 4 63 3 64 2 65 1 76 0,0 75 74 73 72 71 70 69 68 66 |
Original |
HV3418 HV3418 1235plications, A013009 | |
HV514Contextual Info: HV514 Die Specification Pad Layout 5 6 7 8 9 10 11 12 13 4 14 3 2 16 17 1 0,0 25 24 23 22 21 20 19 18 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 134 91 20 ± 1.0 None 1 (mils) HV514 1 (mils) Back Side Bonding Pad |
Original |
HV514 HV514 A013009 | |
HV633Contextual Info: HV633 Die Specification Pad Layout 0,0 21 22 20 23 19 24 18 25 17 26 16 27 15 28 14 29 13 30 12 31 11 32 10 33 9 34 8 35 7 36 6 37 5 38 4 39 3 40 1 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 Die Specifications Die Dimensions Device Length Width |
Original |
HV633 HV633 A013009 | |
sivp
Abstract: VP0808L-G 125OC VP0808
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Original |
VP0808 VP0808 DSFP-VP0808 A013009 sivp VP0808L-G 125OC | |
HV583Contextual Info: HV583 Die Specification Pad Layout 70 71 72 73 69 • • • • • • • • • • • • • • • • • • • • • • • • • 5 4 3 2 1 0,0 74 75 78 79 76 77 80 • • • • • • • • • • • • • • • • • • |
Original |
HV583 HV583 A013009 | |
HV5522Contextual Info: HV5522 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133 |
Original |
HV5522 HV5522 A013009 | |
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HV574
Abstract: A0130
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Original |
HV574 HV574 A013009 A0130 |