A0311 Search Results

power supply ic 1507

Abstract: MWA0370
Contextual Info: MOTOROLA S E M IC O N D U C T O R TECHNICAL DATA M W A0304 M W A0311L M W A0370 M o n o lit h ic M ic r o w a v e In t e g r a t e d C ir c u it . . . designed for narrow or wideband IF and RF applications in industrial and commercial systems up to 3 GHz.

Contextual Info: < 111 SMT a0311 5" H m m SPECIFICATIONS D E Hn Choice of post heights Mates with: CLE FTE SERIES Low profile 1,70mm) .067" For complete specifications see www.samtec.com?FTE Insulator Material: Black Liquid Crystal Polymer T O P OPTION Terminal Material:

Contextual Info: NECES001 C P20K 0 .8 -M IC R O N NEC Electronics Inc. fpgas February 1993 Description Figure 1. CP20K FPGAs NEC Electronics Inc. and Crosspoint Solutions, Inc. have joined forces to offer to system designers an expedient way to prototype in Field Programmable Gate Arrays

2.2NF

Contextual Info: MAINS FILTERS Base Mounting and Bulkhead BASE MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating ᔢ 3 Alternative Circuits ᔢ Optional Additional Components ᔢ 2.8 or 6.3mm tabs Base Mounting PS02/A BULKHEAD MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating IEC CONNECTORS

VN0104

Contextual Info: Supertex inc. VN0104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description

HV57708

Contextual Info: Supertex inc. HV57708 Die Specification Pad Layout 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 0,0 23 42 22 43 21 44 20 45 19 46 18 47 17 48 16 49 15 50 14 51 13 52 12 53 11 54 10 55 9 56 8 57 7 58 6 59 5 60 4 61 3 62 2 63 1 64 65 80 79 78 77 76 75

81 221

Abstract: HV583 HVOUT116
Contextual Info: Supertex inc. HV583 Die Specification Pad Layout 70 71 0,0 74 75 72 73 69 • • • • • • • • • • • • • • • • • • • • • • • • • 5 4 3 2 1 78 79 76 77 80 • • • • • • • • • • • • • •

VN0109

Contextual Info: Supertex inc. VN0109 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0109 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description

HV514

Abstract: Bl 370
Contextual Info: Supertex inc. HV514 Die Specification Pad Layout 5 6 7 8 9 10 11 12 13 4 14 3 2 16 0,0 17 1 25 24 23 22 21 20 19 18 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 134 91 19 - 28 None 1 (mils) HV514 1 (mils) 2 Back

inkjet module

Abstract: piezoelectric transducer printer inkjet ultrasound transducer circuit driver HV2301 HV2301FG-G HV2301PJ-G HV232
Contextual Info: HV2301 Low Charge Injection, 8-Channel, High Voltage, Enhanced Analog Switch with Bleed Resistors Features General Description ► ► ► ► ► ► ► ► ► ► ► ► ► The Supertex HV2301 is a low charge injection, 8-channel, high voltage analog switch integrated circuit IC with bleed

B101x

Contextual Info: Netzfilter Netzfilter Dieses umfassende Sortiment, das für die Reduzierung leitungsgeführter EMS entwickelt wurde, bietet viele Lösungen für das EMS-Problem. Um individuellen Konstruktionsanforderungen zu entsprechen, sind die Filter mit drei Dämpfungsoptionen erhältlich - Standard, Hochleistung

INTEL 87C196 USER MANUAL

Abstract: intel 87C196 PROGRAMMER GUIDE INSTRUCTION RF 300eh 87C196 Assembler Users guide 270646 intel 8XC196 PROGRAMMER GUIDE INSTRUCTION A3055 8xc196 programming support C814 RF 300CH
Contextual Info: 8XC196NT Microcontroller User’s Manual 8XC196NT Microcontroller User’s Manual June 1995 Order Number 272317-003 Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions

RESISTOR VDR

Abstract: a0311 PS-02
Contextual Info: Mains Filters Base Mounting and Bulkhead ᔢ Base Mounting ᔢ 1, 3, 6 or 10 Amp Current Rating ᔢ 3 Alternative Circuits ᔢ Optional Additional Components ᔢ 2.8 or 6.3mm tabs Base Mounting PS02/A ᔢ Bulkhead Mounting ᔢ 1, 3, 6 or 10 Amp Current Rating

2.2NF

Contextual Info: MAINS FILTERS Base Mounting and Bulkhead BASE MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating ᔢ 3 Alternative Circuits ᔢ Optional Additional Components ᔢ 2.8 or 6.3mm tabs Base Mounting PS02/A BULKHEAD MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating IEC CONNECTORS

Contextual Info: B TO^GìKratio ' zijja®; B aoD iE coasE \ Base Mounting PS02/A Bulkhead Mounting PS03/A Series N* 1 f —f Hoeo^i Cx Oc L *— R R I VDR, 1— L/C Circuit Additional Version Components XX X l A = Ol Ver 1 = 1 PS02/A 3 A = 03 Ver 2 = 2 PS 03/A 6 A = 06

Contextual Info: SPM3314 Ordering number : A0311 SPM3314 RF SPDT Switch MMIC Features • • • • • Ultrasmall package ECSP . Middle power (Pin0.1dB=29dBm). Low insertion loss. Control voltage +2.7 / 0V. High isolation. Specifications Absolute Maximum Ratings at Ta=25°C

TN0110

Contextual Info: Supertex inc. TN0110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0110 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description

TN0104

Contextual Info: Supertex inc. TN0104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description

HV9808

Contextual Info: Supertex inc. HV9808 Die Specification Pad Layout 11 12 13 14 15 16 17 18 19 20 21 22 10 23 9 24 8 25 7 26 6 27 5 28 4 29 3 30 2 31 1 0,0 41 40 39 38 37 36 35 34 32 33 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal

VN0606

Contextual Info: Supertex inc. VN0606 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0606 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description

HV57009

Contextual Info: Supertex inc. HV57009 Die Specification Pad Layout 0,0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 37 39 40 41 42 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 43 56 55 54

Contextual Info: Supertex inc. DN1509 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) DN1509 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description

LP0701

Contextual Info: Supertex inc. LP0701 Die Specification Pad Layout 1 2 3 0,0 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness (mils) Back Side Metal 50 70 11 ± 1.5 None (mils) LP0701 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si

TN0106

Contextual Info: Supertex inc. TN0106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0106 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description