B617 Search Results

BB-B6171-C

Contextual Info: BRIGHT LED ELECTRONICS CORP. BB-B6171-C SINCE 1981 ● Features: ●Package dimensions 1. Chip material: AlGaAs/GaAs 3.00 .118 2. Emitted color : Super Red 3. Lens Appearance :Red diffused 4. Pulse Rate 2.4 Hz (VDD=5V) 5. Operating Voltage：5V~12V (DC) 6. Easily be driven by TTL & C-MOS

Contextual Info: BRIGHT LED ELECTRONICS CORP. BL-B6174 SINCE 1981 ● Features: ● Package dimensions 1. Chip material: AlGaAs/GaAs 2. Emitted color : Super Red 5.0 .197 3. Lens Appearance : Red Diffused 4. Low power consumption. 5. High efficiency. Yellow Cathode 8.62(.339)

BB-B6174

Contextual Info: BRIGHT LED ELECTRONICS CORP. BB-B6174 SINCE 1981 ● Features: ●Package dimensions 1. Chip material: AlGaAs/GaAs 5.0 .197 2. Emitted color : Super Red 3. Lens Appearance :Red diffused 4. Pulse Rate 2.4 Hz (VDD=5V) 5. Operating Voltage：5V~12V (DC) 6. Easily be driven by TTL & C-MOS

Contextual Info: BRIGHT LED ELECTRONICS CORP. SINCE 1981 BB-B6171-C Features: Package dimensions 1. Chip material: AlGaAs/GaAs 3.00 .118 2. Emitted color : Super Red 3. Lens Appearance :Red diffused 4. Pulse Rate 2.4 Hz (VDD=5V) 5. Operating Voltage 5V~12V (DC) 5.30(.209)

Contextual Info: BRIGHT LED ELECTRONICS CORP. SINCE 1981 BB-B6174 Features: Package dimensions 1. Chip material: AlGaAs/GaAs 5.0 .197 2. Emitted color : Super Red 3. Lens Appearance :Red diffused 4. Pulse Rate 2.4 Hz (VDD=5V) 5. Operating Voltage 5V~12V (DC) 8.6(.339) 1.0(.04)

Contextual Info: Ge Photodiodes Cooled Types Achieves higher S/N ratio by cooling • Optimized for low level infrared photometry • Lower temperature detection limit: Approx. 200 °C By cooling Ge photodiodes, the dark current can be reduced effec­ tively and the S/N ratio improved.

A72D SMD

Abstract: A72D B62000 gbr relais CC225B HC11 68HC24 A600 B600 B606
Contextual Info: Hip Hop HC11 1. Assembler-Tricks für den 68HC11 von Oliver Thamm Assembler-Tricks für den 68HC11 Hip Hop HC11 1.1. Über die Kunst, ein Byte herbeizuzaubern Die geschickte Ausnutzung vorhandener Ressourcen, das Sparen von Speicherplatz und die Minimierung von Ausführungszeiten war das Bestreben der Programmierer seit der

PEC 4179 DIODE

Abstract: 327879-001US
Contextual Info: Intel Communications Chipset 89xx Series Datasheet October 2012 Order Number: 327879-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

LTN150XG-L05

Abstract: ZD600 c828* npn W316 bag c836 BA59-01664A 1608 F 100nF cpu fan sepa LTN150XG R756
Contextual Info: Main System Option SESC code Location 0902-001841 1105-001609 3903-000055 BA31-00025A BA31-00026A BA39-00527A BA39-00528A BA39-00533A BA39-00540A BA41-00568A BA41-00569A BA42-00161A BA42-00162A BA43-00155A BA44-00132A BA44-00162A BA44-00205A BA44-00209A BA44-00211A

54B2

Abstract: HH-1M1608-600JT 20B3 diode tp807 TP889 hh-1m1608 RC410M IR 30D1 7E TP828 t9504
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS

8C710

Abstract: 7111-C
Contextual Info: 1 1 1 1 1 1 1 234562781 1 1 1 1 AEF8C812 58 9 9 9 ABCDE9759F7E9 9

TTK SG 2368

Abstract: BV EI 303 3628 7 segment LD 1106 BS LM 6863 D I8253 yx 8018 0308 082c ez 422 BV EI 304 3083 0429 01 2701 00 RELE 12,8 mhz e 4895 lf
Contextual Info: AP-55A APPLICATION NOTE i n t e i A u g u s t 1979 S.A. Distributor E l e c t r o n ic \ \ B u il d in g E l e m e n t s p t y l t d PURVEYORS OF a l l ELECTRONIC COMWNENTS Tel eph on e 7 8 - 9 2 2 1 / 6 P O B o x 4 6 0 9 , Pretoria T e l e x 3 01 8 1 S A

B2538-05

Abstract: B6175-05
Contextual Info: Ge Photodiodes Cooled Types Spectral Response Range: 0.8 to 1.8 urn Achieving higher S/N by cooling T h e c h a rcte ristics of dark cu rrent and S / N can be im proved effectiviely by cooling Ge photodiodes. When cooled, it should be noted that the spectral response of Ge pho­

B2538-05

Abstract: B6175-05
Contextual Info: Ge Photodiodes Cooled Types Achieves higher S/N ratio by cooling • Optimized for low level infrared photometry • Lower tem perature detection limit: Approx. 200 °C By coo lin g G e photo d io d es, the dark c u rre n t can be reduced e ffe c ­ tively and the S/N ratio im proved.

b617

Abstract: b649 b605 transistor b647 B647 b649 transistor transistor b647 bb pressure sensor circuit transistor B633 b63e
Contextual Info: Signal Acquisition and Conditioning With Low Supply Voltages SLAA018 August 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

MAC7100RM

Abstract: transistor B595 btm 110 bluetooth eim 630 466 BLUETOOTH MODULE BTM B605 transistor equivalent bluetooth btm 330 Btm 220 bluetooth L38Y ovc Bluetooth
Contextual Info: MAC7100 Microcontroller Family Reference Manual Devices Supported: MAC7101 MAC7111 MAC7116 MAC7122 MAC7131 MAC7141 MAC7106 MAC7112 MAC7121 MAC7126 MAC7136 MAC7142 MAC7100RM Rev. 2 02/2009 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support

Contextual Info: 1 back IT S E M IK R D N zurück Absolute Maximum Ratings Symbol VcES VcGR lc ICM Vges Ptot Tj, Tstg Visol humidity climate Values Units Conditions ' 1200 1200 300 / 220 600 / 440 ±20 1660 - 4 0 .+ 1 5 0 (125) 2 500 Class F 40/125/56 Rge = 20 k£2 Tease = 25/80 °C

Contextual Info: s e MIKRO n Absolute Maximum Ratings Conditions ' Values Symbol VcES VcGR lc ICM V ges = 20 k£2 Tease = 25/80 °C Rge Tease = 25/80 °C; tp = 1 ms p e r IG BT, Tease = 25 °C AC, 1 min. DIN 40 040 DIN IEC 68 T.1 Diodes If= - lc IfM= - IcM Tease = 25/80 °C

842 317 SO8

Contextual Info: Intel Communications Chipset 89xx Series Datasheet June 2013 Order Number: 327879-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

burndy Y750

Abstract: burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20
Contextual Info: BURNDY Grounding TABLE OF CONTENTS HYGROUND® IRREVERSIBLE COMPRESSION GROUNDING AND INSTALLATION TOOLING ® HYGROUND Features Type YGIB . . . . . . . . . . E-20 - E-21 and Benefits . . . . . . . . . E-5 - E-6 E-1 Type YGL-C . . . . . . . . . . . . . . . . E-7

Burndy PAT750-18V parts breakdown

Abstract: BURN GI CONDUIT lp 1610 for door bell Burndy Y35 hypress parts breakdown ci an 7591 NEC c317 KPC 45 94V SAE-AS7928 burndy Y35 Hypress owner manual burndy patriot pat750-18v replacement parts
Contextual Info: Master Catalog Solutions for the Electrical Industry Experience. Technology. Answers. TM Customer Service Department 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 1-603-647-5299 International Canada 1-800-361-6975 (Quebec) 1-800-387-6487 (All other provinces)

B4404

Abstract: BS-2028 BS 5419 B1329 B589 B938 b2498 B1276 B549 BS-2021
Contextual Info: BURNDYWeld BCC-1 TYPE MOLDS Horizontal End to End BCC-1 Type Molds are used for horizontal end to end cable connections. Size range is #6 through 1000 MCM solid or concentric stranded copper conductors. Contact BURNDY Products for information on molds for

skm 152 ga 123

Abstract: semikron skm 152 ga 123 skm 152 ga 1502C SKM 300 GA 102 D 1502R
Contextual Info: Absolute Maximum Ratings Symbol VCES VCGR IC ICM VGES Ptot Tj, Tstg Visol humidity climate Diodes IF= – IC IFM= – ICM Conditions Values 1) RGE = 20 kΩ Tcase = 25/80 °C Tcase = 25/80 °C; tp = 1 ms per IGBT, Tcase = 25 °C AC, 1 min. DIN 40 040 DIN IEC 68 T.1

2SD618

Abstract: MOTHERBOARD INTEL G31 ICH7 SCHEMATIC DIAGRAM BC615 DIODE 20B2 samsung u252 20b1 diode TP-107-02 SAMSUNG R60 plus S3F94 SLB9635TT1.2
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents SEDONA_plus Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS