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    BA1 46 Search Results

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    BA1 46 Price and Stock

    3M Interconnect M3BBA-1460K

    IDC CABLE - MSR14A/MC14F/MSR14A
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey M3BBA-1460K Bulk 1
    • 1 $15.53
    • 10 $11.942
    • 100 $9.3232
    • 1000 $7.43483
    • 10000 $7.43483
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    Integrated Silicon Solution Inc IS46TR16128D-125KBLA1

    DRAM Automotive (Tc: -40 to +95C), 2G, 15V, DDR3, 128Mx16, 1600MT/s a. 11-11-11, 96 ball BGA (9mm x13mm) RoHS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IS46TR16128D-125KBLA1 190
    • 1 $6.7
    • 10 $6.11
    • 100 $5.14
    • 1000 $5.05
    • 10000 $4.93
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    Micron Technology Inc MTC16C2085S1SC48BA1

    Memory Modules DDR5 32GB SODIMM VFBGA Y32A
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MTC16C2085S1SC48BA1 153
    • 1 $239.48
    • 10 $209.11
    • 100 $209.08
    • 1000 $209.08
    • 10000 $209.08
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    Integrated Silicon Solution Inc IS46TR16256B-125KBLA1

    DRAM Automotive (Tc: -40 to +95C), 4G, 15V, DDR3, 256Mx16, 1600MT/s a. 11-11-11, 96 ball BGA (9mm x13mm) RoHS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IS46TR16256B-125KBLA1 148
    • 1 $10.35
    • 10 $9.59
    • 100 $8.21
    • 1000 $7.71
    • 10000 $7.71
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    Micron Technology Inc MTC8C1084S1UC48BA1

    Memory Modules DDR5 16GB UDIMM VFBGA Y32A
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MTC8C1084S1UC48BA1 124
    • 1 $124.82
    • 10 $109.67
    • 100 $103.79
    • 1000 $103.79
    • 10000 $103.79
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    BA1 46 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: ESMT M52S32162A Revision History : Revision 1.0 Oct. 31, 2006 - Original Revision 1.1 (Mar. 02, 2007) - Modify VOH and VOL - Delete BGA ball name of packing dimensions Revision 1.2 (Apr. 27, 2007) - Rename BGA pin name (BA1 to NC ; BA0 to BA) - Modify DC Characteristics


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    PDF M52S32162A M52S32162A 16Bit

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    Abstract: No abstract text available
    Text: 144PIN PC100 Unbuffered SO-DIMM 256MB With 16Mx8 CL2 TS32MSS64V8D2 Description Pin Identification Symbol The TS32MSS64V8D2 is a 32M bit x 64 Synchronous Function A0~A11 Address inputs TS32MSS64V8D2 consists of 16 pieces of CMOS BA0, BA1 Banks Select 4Mx8bitsx4banks Synchronous DRAMs in TSOP-II 400mil


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    PDF 144PIN PC100 256MB 16Mx8 TS32MSS64V8D2 TS32MSS64V8D2 400mil 144-pin

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    Abstract: No abstract text available
    Text: 144PIN PC133 Unbuffered SO-DIMM 256MB With 16M X 8 CL3 TS32MSS64V6L Pin Identification Description The TS32MSS64V6L is a 32M bit x 64 Synchronous Dynamic RAM high-density memory modules. Symbol The Function A0~A11 Address inputs BA0, BA1 Select Bank serial EEPROM on a 144-pin printed circuit board. The


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    PDF 144PIN PC133 256MB TS32MSS64V6L TS32MSS64V6L 144-pin JEP-108E 100MHZ

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    Abstract: No abstract text available
    Text: AS4C64M16MD1 1 Gb 64M x 16 bit 1.8v High Performance Mobile DDR SDRAM Confidential Advanced (Rev. 1.0, Mar. /2014) Features Description 4 banks x 16M x 16 organization - Data Mask for Write Control (DM) - Four Banks controlled by BA0 & BA1 - Programmable CAS Latency: 2, 3


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    PDF AS4C64M16MD1 cycles/64ms 25ns/ Mar/2014

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    Abstract: No abstract text available
    Text: 144PIN PC133 Unbuffered SO-DIMM 256MB With 16M X 8 CL3 TS32MSS64V6L Pin Identification Description The TS32MSS64V6L is a 32M bit x 64 Synchronous Dynamic RAM high-density memory modules. Symbol The Function A0~A11 Address inputs BA0, BA1 Select Bank serial EEPROM on a 144-pin printed circuit board. The


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    PDF 144PIN PC133 256MB TS32MSS64V6L TS32MSS64V6L 144-pin JEP-108E 100MHZ

    MT48LC16M16A2 rev B

    Abstract: mclf MPC8XX MT48LC8M16A2 MT48LC MPC8xx pin MT48LC8M16A2TG-75 mpc860 users manual "mpc860 users manual" *48lc16m16a2
    Text: TN-48-12 Interfacing with Motorola’s MPC8XX TECHNICAL NOTE INTERFACING SDRAM DEVICES WITH MOTOROLA’S MPC8XX The addressing for the MCP8xx uses A0 as the Most Significant Bit MSB , while the MSB for the SDRAM are the bank address lines BA1 and BA0 followed by A11.


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    PDF TN-48-12 32-bit 16-bit MT48LC8M16A2 MPC860 TN4812 MT48LC16M16A2 rev B mclf MPC8XX MT48LC MPC8xx pin MT48LC8M16A2TG-75 mpc860 users manual "mpc860 users manual" *48lc16m16a2

    54PIN

    Abstract: M12L32162A M12L32162A-7BG M12L32162A-7TG
    Text: ESMT Preliminary M12L32162A Revision History Revision 0.1 Aug. 11 2006 - Original Revision 0.2 (Mar. 20 2007) - Add BGA package Revision 0.3 (Apr. 27 2007) - Rename BGA pin name (BA1 to NC; BA0 to BA) - Modify DC Characteristics Elite Semiconductor Memory Technology Inc.


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    PDF M12L32162A 16Bit M12L32162A 54PIN M12L32162A-7BG M12L32162A-7TG

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    Abstract: No abstract text available
    Text: 144PIN PC133 Unbuffered SO-DIMM 128MB With 16M X 16 CL3 TS16MMS64V6G Description Pin Identification The TS16MMS64V6G is a 16M bit x 64 Synchronous Dynamic RAM high-density memory module. The TS16MMS64V6G Symbol Function A0~A12 Address inputs BA0~BA1 Select Bank


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    PDF 144PIN PC133 128MB TS16MMS64V6G TS16MMS64V6G 144-pin JEP-108E

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    Abstract: No abstract text available
    Text: 144PIN PC133 Unbuffered SO-DIMM 256MB With 16MX8 CL3 TS32MSS64V6D Pin Identification Description The TS32MSS64V6D is a 32M bit x 64 Synchronous Dynamic RAM high-density memory module. The Symbol Function A0~A11 Address inputs BA0,BA1 Banks Select packages, a 2048 bits serial EEPROM and 1 piece of


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    PDF 144PIN PC133 256MB 16MX8 TS32MSS64V6D TS32MSS64V6D 144-pin JEP-108E

    M52S32162A

    Abstract: No abstract text available
    Text: ESMT M52S32162A Revision History : Revision 1.0 Oct. 31, 2006 - Original Revision 1.1 (Mar. 02, 2007) - Modify VOH and VOL - Delete BGA ball name of packing dimensions Revision 1.2 (Apr. 27, 2007) - Rename BGA pin name (BA1 to NC ; BA0 to BA) - Modify DC Characteristics


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    PDF M52S32162A 16Bit M52S32162A

    Untitled

    Abstract: No abstract text available
    Text: ESMT M12L32162A Revision History Revision 0.1 Aug. 11 2006 - Original Revision 0.2 (Mar. 20 2007) - Add BGA package Revision 0.3 (Apr. 27 2007) - Rename BGA pin name (BA1 to NC; BA0 to BA) - Modify DC Characteristics Revision 0.4 (Sep. 28 2007) - add speed –5 sepc.


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    PDF M12L32162A M12L32162A 16Bit

    M52D32162A

    Abstract: No abstract text available
    Text: ESMT M52D32162A Revision History : Revision 1.0 Aug.16, 2006 - Original Revision 1.1 (Aug. 31,2006) -Modify VDD; VDDQ; tSAC; ICC1; ICC2PS; ICC6 spec Revision 1.2 (Apr. 24,2007) - Delete BGA ball name of packing dimensions Revision 1.3 (Apr. 27,2007) - Rename BGA pin name (BA1 to NC ; BA0 to BA)


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    PDF M52D32162A 16Bit M52D32162A

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    Abstract: No abstract text available
    Text: HYMD2326468-K/H/L Revision History 1. Rev. 0.2 From Parameter Pin To Symbol Unit Min Max Min Max Input Capacitance A0 ~ A12, BA0, BA1 CIN1 58 72 58 72 pF Input Capacitance RAS, CAS, WE CIN2 58 72 58 72 pF Input Capacitance CKE0 CIN3 43 57 58 72 pF Input Capacitance


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    PDF HYMD2326468-K/H/L 32Mx64

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    Abstract: No abstract text available
    Text: 144PIN PC133 Unbuffered SO-DIMM 256MB With 16M X 8 CL3 TS32MSS64V6L Pin Identification Description The TS32MSS64V6L is a 32M bit x 64 Synchronous Dynamic RAM high-density memory modules. Symbol The Function A0~A11 Address inputs BA0, BA1 Select Bank serial EEPROM on a 144-pin printed circuit board. The


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    PDF 144PIN PC133 256MB TS32MSS64V6L TS32MSS64V6L 144-pin JEP-108E 100MHZ

    Untitled

    Abstract: No abstract text available
    Text: IC INFORMATION Function 128Mbit SDRAM CMOS Type K4S281632D-TL1L Model AVIC-ZH8017ZT VDD 1 54 VSS DQ0 2 53 DQ15 VDDQ 3 52 VSSQ DQ1 4 DQ2 5 VSSQ 6 DQ3 7 DQ4 8 VDDQ 9 DQ5 10 DQ6 11 VSSQ 12 DQ7 13 VDD 14 J 1/1 E 51 DQ14 A0-A11 : Address input BA0-BA1 : Bank select address


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    PDF 128Mbit K4S281632D-TL1L AVIC-ZH8017ZT A0-A11 DQ0-DQ15 A10/AP

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    Abstract: No abstract text available
    Text: IC INFORMATION Function 128Mbit SDRAM CMOS Type VDD K4S281632C-TL1L AVIC-H09 Model 1 54 VSS DQ0 2 53 DQ15 VDDQ 3 52 VSSQ DQ1 4 DQ2 5 VSSQ 6 DQ3 7 DQ4 8 VDDQ 9 DQ5 10 DQ6 11 VSSQ 12 DQ7 13 VDD 14 J 1/1 E 51 DQ14 A0-A11 : Address input BA0-BA1 : Bank select address


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    PDF 128Mbit K4S281632C-TL1L AVIC-H09 A0-A11 DQ0-DQ15 A10/AP

    Untitled

    Abstract: No abstract text available
    Text: HYMD116645A8-K/H/L Revision History 1. Rev. 0.2 From Parameter Pin To Symbol Unit Min Max Min Max Input Capacitance A0 ~ A11, BA0, BA1 CIN1 58 72 58 72 pF Input Capacitance RAS, CAS, WE CIN2 58 72 58 72 pF Input Capacitance CKE0 CIN3 43 57 58 72 pF Input Capacitance


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    PDF HYMD116645A8-K/H/L 16Mx64

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    Abstract: No abstract text available
    Text: HYMD2646468-K/H/L Revision History 1. Rev. 0.2 From Parameter Pin To Symbol Unit Min Max Min Max Input Capacitance A0 ~ A12, BA0, BA1 CIN1 93 107 90 104 pF Input Capacitance RAS, CAS, WE CIN2 93 107 90 104 pF Input Capacitance CKE0, CKE1 CIN3 63 77 58 72 pF


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    PDF HYMD2646468-K/H/L 64Mx64

    DPDD192MX8XSBY5

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 1.5 Gigabit CMOS DDR SDRAM DPDD192MX8XSBY5 • • R I T FEATURES: O • • • • • VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC NC VDDQ NC A13 VDD DNU CS2 WE CAS RAS CS0 CS1 BA0 BA1 A10/AP A0 A1 A2 A3 VDD 1


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    PDF DPDD192MX8XSBY5 A10/AP 30A254-03 DPDD192MX8XSBY5

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    Abstract: No abstract text available
    Text: IC INFORMATION Function SDRAM CMOS Type J 1/1 E GEX-FM903XM/UC K4S640832E-TL1H Model VDD 1 54 VSS DQ0 2 53 DQ7 VDDQ 3 52 VSSQ NC 4 DQ1 5 VSSQ 6 NC 7 DQ2 8 VDDQ 9 NC 10 DQ3 11 VSSQ 12 NC 13 51 NC A0-A11 : Address input BA0-BA1 : Bank select address DQ0-DQ7 : Data input/output


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    PDF GEX-FM903XM/UC K4S640832E-TL1H A0-A11 A10/AP

    Untitled

    Abstract: No abstract text available
    Text: IC INFORMATION Function 128Mbit SDRAM CMOS Type M2V2840ATP-7L AVIC-H09 Model VDD 1 54 VSS DQ0 2 53 DQ15 VDDQ 3 52 VSSQ DQ1 4 DQ2 5 VSSQ 6 DQ3 7 DQ4 8 VDDQ 9 DQ5 10 DQ6 11 VSSQ 12 DQ7 13 J 1/1 E 51 DQ14 A0-A11 : Address input BA0-BA1 : Bank select address DQ0-DQ15 : Data input/output


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    PDF 128Mbit M2V2840ATP-7L AVIC-H09 A0-A11 DQ0-DQ15 A10/AP

    K4S280832B

    Abstract: No abstract text available
    Text: K4S280832B CMOS SDRAM PIN CONFIGURATION Top view VDD DQ0 VDDQ N.C DQ1 VSSQ N.C DQ2 VDDQ N.C DQ3 VSSQ N.C VDD N.C WE CAS RAS CS BA0 BA1 A10/AP A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54 53 52 51 50 49 48 47


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    PDF K4S280832B A10/AP 54Pin 400mil 875mil) A10/AP K4S280832B

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    Abstract: No abstract text available
    Text: MITSUBISHI ELECTRIC 64MSDRAM Pin Configuration x4 x8 xl6 \ Vdd 54 Vss o DQO DQO 2 53 DQ15 i n NC NC DQO NC NC NC DQ1 NC NC VddQ NC DQ1 DQ1 DQ2 VssQ NC DQ3 DQ2 DQ4 VddQ NC DQ5 DQ3 DQ6 VssQ NC DQ7 Vdd NC DQML /WE /CAS /RAS /CS BA0 A13 BA1(A12) AIO A0 Al A2


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    PDF L-21029-01 64MSDRAM 54Pin 400mil

    Untitled

    Abstract: No abstract text available
    Text: — 5 ? • 5 / — h - NEC C o m p o u n d T ran sistor m ^ T t v r x BA1 L3M i t <8 O / ^ T è l * J i i L t i - 'i t o R, =4.7 kQ, R2= 4.7 k iJ O BN 1L3M > 3 > -r Ij / > ? IJ f T" è i 1“ ( T a = 25 ° o fé # » * :* :* # n m «ft H't 7/ tì: XM W &


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    PDF iii25