BGA 6X8 Search Results

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

9803

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M10 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M10 48-pin plastic BGA (BGA-48P-M10) Note: The actual shape of coners may differ from the dimension.

led matrix circuits

Abstract: bga48 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

BGA-48P-M01

Abstract: 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M01 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M01 48-pin plastic FBGA (BGA-48P-M01)

fujitsu

Abstract: 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M03 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M03 48-pin plastic FBGA (BGA-48P-M03)

fujitsu

Abstract: 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M02 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M02 48-pin plastic FBGA (BGA-48P-M02)

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

MSM8200

Contextual Info: Issue 1.0 March 2002 Description The MSM82000CB is a 2M x 8 SRAM device available in Chip Size BGA Ball Grid Array package, with access times of 15 and 20ns. The device is available to commercial and industrial temperature grades. The Chip Size BGA provides an ultra high density

bga 6x8 Package

Abstract: DIP40 package 28F008 DIP40 DIP30 a5 gnd 700
Contextual Info: M4229 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 404001BG6YAM AS-40-40-01BG-6YAM-8/16 REPLACEMENT SOCKET: S-BGA-6X8-048-A Call Emulation Technology for a replacement socket price and delivery quote. CONNECTION TABLE:

intel C4 package

Abstract: F4334 DIP40 a5 gnd 700
Contextual Info: M4334 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 484001BG6YAMNS AS-48-40-01BG-6YAM-8/16 REPLACEMENT SOCKET: S-BGA-6X8-48-A Call Emulation Technology for a replacement socket price and delivery quote. CONNECTION TABLE:

intel 28f160

Abstract: bga 6x8 Package 48440 bga 6x8 28F160
Contextual Info: M4226 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: REPLACEMENT SOCKET: 484401BG6YAM8/16 AS-48-44-01BG-6YAM-8/16 S-BGA-6X8-048-A CONNECTION TABLE: Call Emulation Technology for a replacement socket price and delivery quote.

IC63LV1024-8BI

Contextual Info: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error September 12,2001

IC63LV1024

Abstract: IC63LV1024-10B IC63LV1024-8B IC63LV1024-8J IC63LV1024-8K IC63LV1024-8T IS63LV1024
Contextual Info: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error Obsolete "H" type

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

g10 fr4 7mm

Abstract: FR4 substrate 1.6mm FR4 1.6mm substrate pitch 0.75mm BGA SF-BGA48G-B-03 bga 6x8 0.3mm pitch BGA
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 7mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

FR4 1.6mm substrate

Abstract: SF-BGA46D-B-03 FR4 substrate 1.6mm pitch 0.75mm BGA
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 6.5mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 7.91mm 0.75mm pitch typ. Top View 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

0.35mm BGA

Abstract: FR4 1.6mm substrate 0.35mm pitch BGA SF-BGA48C-B-03 FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8
Contextual Info: Compatible BGA Footprint 16mm [0.630"] 13.5mm [0.531"] 13.2mm [0.520"] 7.29mm [0.287"] 11mm [0.433"] 10.72mm [0.422"] 10.85mm [0.427"] 0.75mm 0.35mm [0.014"] 7.4mm [0.291"] Top View 9.8mm [0.386"] D 0.8 mm x4 0.38mm [0.015"] 9.75mm [0.384"] End View 0.75mm pitch typ.

FR4 substrate 1.6mm

Abstract: FR4 1.6mm substrate SF-BGA46B-B-03 bga 6x8 0.3mm pitch BGA pitch 0.75mm BGA
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7.286mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 6.964mm Top View 0.75mm pitch typ. 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

FR4 substrate 1.6mm

Abstract: FR4 1.6mm substrate bga 6x8 SF-BGA48H-B-03 pitch 0.75mm BGA g10 fr4 7mm
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 8.5mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

CS16LV20493

Contextual Info: High Speed Super Low Power SRAM 128K-Word By 16 Bit CS16LV20493 Revision History Rev. No. History Issue Date 1.0 Initial issue Jan.17, 2005 1.1 Add 48 CSP-6x8mm Sep. 16, 2005 1.2 Revise DC characteristics Apr. 11, 2008 1.3 Remove 48 Mini BGA 6*8 mm package type

FR4 1.6mm substrate

Abstract: SF-BGA46C-B-03 FR4 substrate 1.6mm pitch 0.75mm BGA
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7.58mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 9.81mm Top View 0.75mm pitch typ. 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

FR4 1.6mm substrate

Abstract: SF-BGA47A-B-03 bga 6x8 FR4 substrate 1.6mm pitch 0.75mm BGA G10 FR4
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7.286mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 10.85mm Top View 0.75mm pitch typ. 6.5mm [0.256"] 9.8mm [0.386"] R0.8 x4 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

Contextual Info: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and

SG-BGA-6076

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer