BGA 8X8 100 Search Results

Contextual Info: Product Number: 599-11-054-04-005428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 054-04-005 8X8 #

BGA 8x8 100

Contextual Info: Product Number: 599-11-064-04-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 064-04-000 8X8 #

BGA 8x8 100

Contextual Info: Product Number: 599-11-063-04-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 063-04-001 8X8

Contextual Info: Product Number: 599-11-064-04-000428 Description: BGA Socket 1mm BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 064-04-000 8X8 # Of Pins

Contextual Info: Product Number: 599-10-064-04-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 064-04-000 8X8 # Of Pins Mill-Max Part Number 64 599-10-064-04-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

BGA 8x8 100

Contextual Info: Product Number: 599-10-063-04-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 063-04-001 8X8 # Of Pins Mill-Max Part Number 63 599-10-063-04-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: Product Number: 599-10-054-04-005429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 054-04-005 8X8 # Of Pins Mill-Max Part Number 1 599-10-054-04-005429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

NP351

Abstract: NP351-064-148 NP351-180-139 212207 NP351-21653 NP351-064-227 X3640 np351-532 AC-28179 ac14425
Contextual Info: Series NP351 BGA / CSP 0.80mm Pitch TH - Open Top Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Mating Cycles: 1,000MΩ min. at 100V DC 100V AC for 1 minute

BGA 64 PACKAGE thermal resistance

Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

56 pin BGA IC Socket

Abstract: bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310
Contextual Info: IC274 Series Test Contactor SMT - Spring Probe Contact Style Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +100°C

8X8 INC

Abstract: 8x8 vcp LVP 47-10-43 LD8213 8x8 vcp tse 1885 40BS CCIR601 YUV422 8x83404
Contextual Info: 8x8, Inc. 8x83404 LVP DATASHEET 8x8 LVP Lowbitrate Videophone Processor OVERVIEW The 8x8 LVP i a single-chip programmable low bitrate video phone processor. A member of 8x8's MPA Multimedia Processor Architecture family, it forms the heart of either a PC-based or stand-alone

ARC M3D

Abstract: 6845 8bit vga controller cga to vga circuits CRTC 6845 HGC hercules 6845 crt controller cga video 6845 TTL sync video CGA to vga ega to vga circuits cga to vga monitor circuits
Contextual Info: 'CIRRUS LOGIC PRELIMINARY DATA SHEET July, 1988 CL - GD 510A!520A FEATURES • Hardware implementation of VGA, EGA, CG A, MDA and Hercules HGC Enhanced VGA Compatible Graphics Chip Set • Fast host access to video memory • 32-bit video memory RAM access

132-ball

Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
Contextual Info: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages

064d

Abstract: 28F320 640J3 28F320J3A 28FxxxJ3A 1mm pitch BGA AN1573 BGA64 TSOP56 pin-to-pin drop-in compatibility with the
Contextual Info: AN1573 APPLICATION NOTE How to Design-in the M58LW032D/64D Flash Memories, Ensuring Compatibility with the 28F320J3A/640J3A CONTENTS • INTRODUCTION ■ HARDWARE FEATURES AND COMPATIBILITY – Package Mechanical – AC Characteristics and Program/Erase Times

COOLRUNNER-II examples

Abstract: 245RL CPLD XC2C64 from Xilinx CoolRunner-II family CP132 equivalent 8x8 keyboard and microcontroller interfacing EPM240Z M100 XC2C128 XC2C256 XC2C64
Contextual Info: White Paper Reduce Total System Cost in Portable Applications Using Zero-Power CPLDs Introduction Traditionally, portable system designers have used ASICs and ASSPs to implement memory interfaces, I/O expansion, power-on sequencing, discrete logic functions, display, and other functions in portable systems. Cost

C2121M cts

Abstract: bdn10-3cba01 BDN21-3CB
Contextual Info: CTS Series BND Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

bga 7x7

Abstract: BDN21-3CB C2121M cts T412 0.3mm qfp
Contextual Info: CTS Series BDN Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

CABGA 6x6

Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
Contextual Info: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is