BGA14 Search Results

ST BGA

Abstract: SF-BGA144A-B-11
Contextual Info: D Package Code: BGA144A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.5mm [0.059"] 16.51mm [0.650"] X 1.5mm [0.059"] Top View reference only 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 5.33mm 3.74mm [0.147"] [0.210"]

SF-BGA140B-B-11

Contextual Info: D Package Code: BGA140B C See BGA pattern code to the right for actual pattern layout Y 13.97mm [0.550"] 1.27mm [0.050"] X 13.97mm [0.550"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 5.33mm 3.74mm [0.147"] [0.210"]

SF-BGA144B-B-11

Contextual Info: D Package Code: BGA144B C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

1mm pitch BGA 144

Abstract: 12X12 SF-BGA144C-B-11 BGA144C
Contextual Info: C Package Code: BGA144C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 11.00mm [0.433"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 0.508 mm [0.020"]

BGA 14 TRAY

Abstract: JEDEC TRAY DIMENSIONS jedec bga tray BGA package tray tray bga JEDEC tray standard
Contextual Info: TRAY CONTAINER 24.40 23.30 14.35 135°C MAX A' 12.75 A BGA14x22A-1 18.40 NEC 135.9 110.4 PPE 7×12=84 UNIT : mm 22.30 268.4 315.0 322.6 SECTION A – A' 6.12 (6.35) 7.62 22.30 Applied Package Quantity (pcs) 119-pin Plastic BGA (14×22) MAX. 84 BGA14×22A-1

SF-BGA140A-B-11

Contextual Info: D Package Code: BGA140A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.5mm [0.059"] 16.51mm [0.650"] X Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 5.33mm 3.74mm [0.147"] [0.210"]

Samsung EOL

Abstract: IS42S81600F is42s16320 IS43DR16320 IS42S32200L IS49NLC36800 IS43R32400E IS46R Mobile SDRAM IS42S32200E
Contextual Info: Industrial Grade Memory Products Selecting the Right ISSI Industrial Grade Memory Fastest Random Access Access <20ns 288-576Mb Memory No DRC* Lower cost/bit 18-72Mb RLDRAM 10-20ns Easy Interface, Low Power Higher Density Ultra Low Power Synch SRAM <5ns Asynch SRAM

AT91SAM3U4

Abstract: at91sam3 1N1308 MAR 735 REGULATOR IC 7912 pin identify AT91SAM3U4E SAM3u1 AT91SAM3U 3961 G.E 0x20180
Contextual Info: Features • Core • • • • • • – ARM Cortex®-M3 revision 2.0 running at up to 96 MHz – Memory Protection Unit MPU – Thumb®-2 instruction set Memories – From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

BGA144 13x13 package

Abstract: DesignWare Hi-Speed USB On-The-Go Controller SCR trickle charger circuit trickle battery charger circuit using scr 7476 up down counter Palmchip designware usb otg IHI-0011A M25PXX hitachi elko
Contextual Info: AS3525-A/-B C22O22 Data Sheet, Confidential å Datasheet, Confidential AS3525 Advanced Audio Processor System 1 Description This highly flexible and fully integrated audio processor system AS3525 combines strong calculating power, high performance audio features with system power management options for battery

CMP14

Contextual Info: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM71-10134-1E FR 60 32-BIT MICROCONTROLLER MB91470/480 Series HARDWARE MANUAL FR 60 32-BIT MICROCONTROLLER MB91470/480 Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

STM32F103xC

Abstract: STM32F103xC ADC1 CF 4093 N STM32F103xC boot STM32F103Rx STM32F103xE STM32F103xx STM32F103VC g717 stm32f103ve
Contextual Info: STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features FBGA • Core: ARM 32-bit Cortex -M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz Dhrystone 2.1

arm stm32 f103

Abstract: stm32f103z STM32F103VG STM32F103VF STM32F103ZG stm32f103xg stm32 f103 100 pin STM32F103Rx LQFP100 LQFP144
Contextual Info: STM32F103xF STM32F103xG XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces Preliminary data Features FBGA • Core: ARM 32-bit Cortex -M3 CPU with MPU – 72 MHz maximum frequency,

ba37

Abstract: 48FBGA K8D1716U K8D1716UBC K8D1716UTC samsung nor flash BA251
Contextual Info: K8D1716UTC / K8D1716UBC FLASH MEMORY Document Title 16M Bit 2M x8/1M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft July 25, 2004 Advance 0.1 Support 48TSOP1 Lead Free Package Sep 16, 2004 Preliminary

OCS32

Abstract: FBGA DDR4 FPT-144P-M08 FR30 LQFP-144 MB91133 MB91F133 PGA-299C-A01 D2950
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS07-16308-1E 32-Bit RISC Microcontroller CMOS FR30 Series MB91133/MB91F133 • DESCRIPTION The MB91133/MB91F133, a standard single-chip microcontroller featuring various I/O resources and bus control mechanisms to incorporate the control required for high-performance high-speed CPU processes, is the core unit

shinano stepper motor

Abstract: microstepping L6203 L298N BTB16-600CW UNIVERSAL MOTOR SPEED CONTROL CIRCUIT zoo607ma fast diode transil 247 T1635H-6T L6393 PMSM stm32 L297D
Contextual Info: Motor control Selection guide January 2009 www.st.com Contents Microcontrollers 8-bit microcontroller families 32-bit microcontroller familes Development tools 4 4 7 15 Power Power MOSFETs IGBTs IGBT modules AC switches Triacs Diacs Ultrafast rectifiers Protection devices - Transil

SAMSUNG MCP

Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
Contextual Info: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary

Contextual Info: STR71xFxx STR710RZ ARM7TDMI 32-bit MCU with Flash, USB, CAN, 5 timers, ADC, 10 communication interfaces Features • ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash LQFP64 10 x 10 Memories – Up to 256 Kbytes Flash program memory

64-pin BGA thermal resistance

Abstract: arm Str711f TQFP144 TQFP64 ISO7816-3 LFBGA144 LFBGA64 STR710F AN1781 diode p115
Contextual Info: STR71xF ARM7TDMI 16/32-BIT MCU WITH FLASH, USB, CAN 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES PRELIMINARY DATA • ■ ■ ■ ■ Memories – Up to 256+16 Kbytes Flash memory 100,000 cycles endurance, 20 yrs retention – Up to 64 Kbytes RAM – External Memory Interface (EMI) for up to 4

7476 counter

Abstract: pin diagram of ttl 7476 7476 PIN DIAGRAM pin diagram of 7476 ttl 7476 datasheets EMR1 7476 ttl datasheets LM393D-SO8 APPLICATION NOTES 7476 st9 technical manual
Contextual Info: ST92F150-EMU2 HDS2V2 Emulator User Manual Release 1.1 July 2001 Ref: DOC-ST92F150-EMU2 INSTRUCTIONS FOR USE—WARNING This product is conform to the 89/336/EEC Directive. It complies with the ITE EN55022 standard for EMC emissions and generic 50082-1 1992 edition immunity standards.

Contextual Info: Features • Utilizes the ARM7TDMI ARM® Thumb® Processor Core • • • • • • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – Embedded ICE In-circuit Emulation

AVR32UC3A3

Abstract: 32122B AT32UC3A3 AVR32787 AT32UC3A3x PGB0010603MR AVR32 BGA144 QFP144 avr32-uc3
Contextual Info: AVR32787: AVR32 AT32UC3A3 High Speed USB Design Guidelines 1. Introduction 32-bit AVR Microcontroller This document provides guidelines for integrating an AVR®32 AT32UC3A3x high speed USB device controller onto a 4-layer PCB. The material covered can be broken