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    Parade Technologies Ltd PS8926BGA354GTR-A2

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    Parade Technologies Ltd PS8926AABGA354GTR-A2-S

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    Parade Technologies Ltd PS8936BGA354GTR-A1

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    Parade Technologies Ltd PS8926AABGA354GTR-A2

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    Fischer Elektronik GmbH & Co KG ICK BGA 35X35

    Heat Sink, For Ball Grid Array, Bga, 17 C/W, 6 Mm, 35 Mm, 35 Mm Rohs Compliant: Yes |Fischer Elektronik ICK BGA 35X35
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    Newark ICK BGA 35X35 Bulk 1,519 1
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    Avnet Abacus ICK BGA 35X35 13 Weeks 50
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    BGA35 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA352 OT581-1 OT581-1

    BGA352

    Abstract: sot581
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E


    Original     		PDF BGA352: OT581-1 BGA352 sot581

    SF-BGA352A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA352A C 31.75mm [1.250"] 0.64mm [0.025"] typ. See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] typ. 31.75mm [1.250"] X 1.27mm [0.050"] Top View reference only 2 Ø 0.40mm [Ø 0.0156"] tooling hole X2 (optional)


    Original     		PDF BGA352A SF-BGA352A-B-11

    SF-BGA357A-B-11

    Abstract: No abstract text available
    Text: D BGA357A C 22.86mm [0.900"] Ø 0.0156" tooling hole X2 See BGA pattern code to the right for actual pattern layout Y 22.86mm [0.900"] 1.27mm [0.050"] X Top View reference only 0.36mm [0.014"] dia. 2 0.66mm [0.026"] 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm [Ø 0.025"]


    Original     		PDF BGA357A SF-BGA357A-B-11

    PAL 007 E

    Abstract: PAL 007 c PAL 007 B PAL 007 A PAL 007 BGA356 LS-BGA356A-11 BGA-356
    Text: BGA356A Tooling hole X2 Y See BGA pattern code to the right for actual pattern layout Ø 0.508mm pad 1.27mm 31.75mm Top View (reference only) X Variable 1 5.33mm [0.210"] 3.75mm [0.147"] 31.75mm 0.36mm±0.03mm 2 Top View of Land Pattern Scale: 2:1 Side View


    Original     		PDF BGA356A 508mm FR4/G10 LS-BGA356A-11 PAL 007 E PAL 007 c PAL 007 B PAL 007 A PAL 007 BGA356 BGA-356

    353512

    Abstract: No abstract text available
    Text: P-BGA352-3535-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 3.90 TYP. 2/Oct. 28, 1996


    Original     		PDF P-BGA352-3535-1 353512

    PBGA352

    Abstract: BGA352 P-BGA-352 PBGA3523535
    Text: P-BGA352-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF P-BGA352-3535-1 PBGA352 BGA352 P-BGA-352 PBGA3523535

    tray datasheet bga

    Abstract: JEDEC TRAY DIMENSIONS BGA-35
    Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 76.0 38.00 BGA35×35B 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 SECTION A-A' (5.57) 7.62 (6.35) 35.35 35.00 Applied Package Quantity (pcs) 629-pin Plastic BGA (35×35) (FLIP CHIP TYPE) 24 MAX.


    Original     		PDF BGA35 629-pin SSD-A-H7768 tray datasheet bga JEDEC TRAY DIMENSIONS BGA-35

    SF-BGA352B-B-11

    Abstract: No abstract text available
    Text: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads


    Original     		PDF BGA352B FR4/G10 26X26 SF-BGA352B-B-11

    BGA356

    Abstract: BGA-356 SF-BGA356A-B-11
    Text: D Package Code: BGA356A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] X 31.75mm [1.250"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA356A FR4/G10 SF-BGA356A-B-11 BGA356 BGA-356

    BGA352

    Abstract: MS-034 ED-7311-9A
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W


    Original     		PDF BGA352: OT581-1 MS-034 ED-7311-9A BGA352 MS-034 ED-7311-9A

    LS-BGA352B-11

    Abstract: No abstract text available
    Text: Tooling hole X2 BGA352B Ø 0.0156" (2x) (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] Top View (reference only) 1.00mm [0.039"] pitch typ. X Variable 0.508 mm [0.020"] dia pads 0.50mm [0.020"] 1 5.33mm [0.210"]


    Original     		PDF BGA352B FR4/G10 LS-BGA352B-11

    PRBG0352DA-A

    Abstract: No abstract text available
    Text: JEITA Package Code P-BGA352-35x35-1.27 RENESAS Code PRBG0352DA-A D MASS[Typ.] 3.6g A A D1 ZD A1 b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 352F7X-A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26


    Original     		PDF P-BGA352-35x35-1 PRBG0352DA-A 352F7X-A PRBG0352DA-A

    PBGA352

    Abstract: No abstract text available
    Text: P-BGA352-3535-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 3.90 TYP. 2/Aug. 12, 1996


    Original     		PDF P-BGA352-3535-1 PBGA352

    19X19

    Abstract: No abstract text available
    Text: Relative orientations for adapter assembly PGA A1 2.100" BGA A1 Motorola is a registered trademark of Motorola Inc. A1 0.100" typ. Top View 2.100" 1 0.466" 4 2 0.050" 3 0.145" (assembled) 0.270" Surface mount BGA emulator foot (included) (see SF-BGA357A-B-01 drawing for greater detail)


    Original     		PDF SF-BGA357A-B-01 FR4/G10 finish10µ 19X19 PC-PGA/BGA-68360-B-01 19X19

    Lead Free reflow soldering profile BGA

    Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
    Text: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109


    Original     		PDF 8833he 485mm) 241mm) Lead Free reflow soldering profile BGA BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework

    SAMSUNG MCP

    Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
    Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)


    Original     		PDF KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor

    Untitled

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		PDF K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX

    IEC968

    Abstract: Equator BSP-15 sad transistor A11b BSP-15-400 DRGB 001 A ac3 decoder toslink PAL to ITU-R BT.601/656 Decoder BSP15 BSP-15 IEC958
    Text: Datasheet BSP-15 Processor Datasheet Equator Technologies, Inc. Revision H September 6, 2002 Document Number: HWR.BSP15.DS.REV.H Datasheet BSP-15 Processor Datasheet Revision H September 6, 2002 Copyright 2002 Equator Technologies, Inc. All rights reserved.


    Original     		PDF BSP-15 BSP15 128-bit IEC968 Equator BSP-15 sad transistor A11b BSP-15-400 DRGB 001 A ac3 decoder toslink PAL to ITU-R BT.601/656 Decoder IEC958

    Untitled

    Abstract: No abstract text available
    Text: E-BGA352-3535-1.27D4 Uniti nn - - H - - 1 April 2004


    OCR Scan     		PDF E-BGA352-3535-1

    Untitled

    Abstract: No abstract text available
    Text: BGA352-T-3535-1.27C4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo


    OCR Scan     		PDF TW92X

    Untitled

    Abstract: No abstract text available
    Text: E-BGA352-3535-1.27D4


    OCR Scan     		PDF E-BGA352-3535-1 27D4E-BGA352-3535-1

    Untitled

    Abstract: No abstract text available
    Text: BGA352-T-3535-1.27D4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo


    OCR Scan     		PDF TW92X

    Untitled

    Abstract: No abstract text available
    Text: T-BGA352-3535-1.27-4 Unit : mm T-BGA352-3535-1.27-4 j»0.75±0.15 l ^ jÿ 0 i m [S [ ABI C1.0 10.635 I OOOOOOOOOOOO OIOOOOOOOOOOOOO o o o o o o o o o o o o olo o o o o o o o o o o o o OOOOOOOOOOOO O'Oo o o o o o o o o o o o o o o o o o o o o o o o olo o o o o o o o o o o o o


    OCR Scan     		PDF T-BGA352-3535-1