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    BL2012 Price and Stock

    TAIYO YUDEN CBL2012T220M

    FIXED IND 22UH 250MA 2.73OHM SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CBL2012T220M Reel 12,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.06875
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    CBL2012T220M Cut Tape 5,069 1
    • 1 $0.16
    • 10 $0.123
    • 100 $0.0956
    • 1000 $0.07419
    • 10000 $0.07419
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    Avnet Americas CBL2012T220M Reel 7 Weeks 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.09974
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    Mouser Electronics CBL2012T220M 1,368
    • 1 $0.16
    • 10 $0.104
    • 100 $0.081
    • 1000 $0.075
    • 10000 $0.069
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    Newark CBL2012T220M Cut Tape 3,328 1
    • 1 $0.062
    • 10 $0.062
    • 100 $0.062
    • 1000 $0.062
    • 10000 $0.062
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    CBL2012T220M Reel 4,000
    • 1 -
    • 10 -
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    • 10000 $0.092
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    CBL2012T220M Reel 4,000
    • 1 -
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    Chip1Stop CBL2012T220M Cut Tape 5,740
    • 1 -
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    • 100 $0.0621
    • 1000 $0.0482
    • 10000 $0.0446
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    TAIYO YUDEN CBL2012T2R2M

    FIXED IND 2.2UH 590MA 507MOHM SM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CBL2012T2R2M Reel 7,958 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.08295
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    CBL2012T2R2M Cut Tape 1
    • 1 $0.16
    • 10 $0.123
    • 100 $0.0956
    • 1000 $0.07419
    • 10000 $0.07419
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    CBL2012T2R2M Digi-Reel 1
    • 1 $0.16
    • 10 $0.123
    • 100 $0.0956
    • 1000 $0.07419
    • 10000 $0.07419
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    Avnet Americas CBL2012T2R2M Reel 7 Weeks 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.09974
    		Buy Now
    Mouser Electronics CBL2012T2R2M 2,334
    • 1 $0.16
    • 10 $0.104
    • 100 $0.081
    • 1000 $0.075
    • 10000 $0.068
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    Newark CBL2012T2R2M Reel 4,000
    • 1 $0.116
    • 10 $0.116
    • 100 $0.116
    • 1000 $0.116
    • 10000 $0.096
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    Ameya Holding Limited CBL2012T2R2M 4,000
    • 1 -
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    Chip1Stop CBL2012T2R2M Cut Tape 2,630
    • 1 -
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    • 100 $0.0357
    • 1000 $0.0302
    • 10000 $0.0293
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    TAIYO YUDEN CBL2012T1R0M

    FIXED IND 1UH 950MA 195 MOHM SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CBL2012T1R0M Cut Tape 5,374 1
    • 1 $0.23
    • 10 $0.175
    • 100 $0.136
    • 1000 $0.10554
    • 10000 $0.10554
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    CBL2012T1R0M Reel 4,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.08378
    		Buy Now
    Avnet Americas CBL2012T1R0M Reel 7 Weeks 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.09974
    		Buy Now
    Mouser Electronics CBL2012T1R0M 3,928
    • 1 $0.23
    • 10 $0.147
    • 100 $0.114
    • 1000 $0.104
    • 10000 $0.075
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    Newark CBL2012T1R0M Cut Tape 4,000
    • 1 -
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    • 100 $0.154
    • 1000 $0.154
    • 10000 $0.154
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    Bristol Electronics CBL2012T1R0M 3,725
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    Chip1Stop CBL2012T1R0M Cut Tape 3,136
    • 1 -
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    • 100 $0.0912
    • 1000 $0.074
    • 10000 $0.0714
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    TAIYO YUDEN CBL2012T470M

    FIXED IND 47UH 140MA 5.46OHM SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CBL2012T470M Cut Tape 1,520 1
    • 1 $0.23
    • 10 $0.175
    • 100 $0.136
    • 1000 $0.10554
    • 10000 $0.10554
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    Avnet Americas CBL2012T470M Reel 9 Weeks 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.09974
    		Buy Now
    Mouser Electronics CBL2012T470M 4,023
    • 1 $0.23
    • 10 $0.147
    • 100 $0.114
    • 1000 $0.104
    • 10000 $0.075
    		Buy Now
    Newark CBL2012T470M Reel 4,000
    • 1 $0.116
    • 10 $0.116
    • 100 $0.116
    • 1000 $0.116
    • 10000 $0.096
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    CBL2012T470M Reel 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.091
    		Buy Now
    CBL2012T470M Cut Tape 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.116
    		Buy Now
    TTI CBL2012T470M Reel 4,000
    • 1 -
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    • 100 -
    • 1000 -
    • 10000 $0.074
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    Chip1Stop CBL2012T470M Cut Tape 710
    • 1 -
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    • 100 $0.00424
    • 1000 $0.00232
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    Component Electronics, Inc CBL2012T470M 90
    • 1 $0.31
    • 10 $0.31
    • 100 $0.23
    • 1000 $0.2
    • 10000 $0.2
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    New Advantage Corporation CBL2012T470M 4,056 1
    • 1 -
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    • 1000 $0.105
    • 10000 $0.105
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    TAIYO YUDEN CBL2012T4R7M

    FIXED IND 4.7UH 490MA 858MOHM SM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CBL2012T4R7M Reel 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.09051
    		Buy Now
    CBL2012T4R7M Cut Tape 1
    • 1 $0.23
    • 10 $0.175
    • 100 $0.136
    • 1000 $0.10554
    • 10000 $0.10554
    		Buy Now
    CBL2012T4R7M Digi-Reel 1
    • 1 $0.23
    • 10 $0.175
    • 100 $0.136
    • 1000 $0.10554
    • 10000 $0.10554
    		Buy Now
    Avnet Americas CBL2012T4R7M Reel 7 Weeks 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.09974
    		Buy Now
    Mouser Electronics CBL2012T4R7M
    • 1 $0.23
    • 10 $0.147
    • 100 $0.114
    • 1000 $0.095
    • 10000 $0.081
    		Get Quote
    Newark CBL2012T4R7M Reel 4,000
    • 1 $0.116
    • 10 $0.116
    • 100 $0.116
    • 1000 $0.116
    • 10000 $0.096
    		Buy Now
    CBL2012T4R7M Cut Tape 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $0.124
    • 10000 $0.124
    		Buy Now
    Bristol Electronics CBL2012T4R7M 4,000
    • 1 -
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    		Get Quote
    Find more BL2012 price and stock on Findchips.com

    BL2012 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    BL2-012-S460-11/1 E-tec Interconnect Connector: DIP Socket: F: 12: 1.27: THRU Original PDF

    BL2012 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ACX balun

    Abstract: ACX Multilayer Chip multilayer GHz
    Text: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		PDF BL201205B1600_ ACX balun ACX Multilayer Chip multilayer GHz

    BL201205B1850

    Abstract: BL2012-05B ACX balun ACX Multilayer Chip multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		PDF BL201205B1850_ BL201205B1850 BL2012-05B ACX balun ACX Multilayer Chip multilayer GHz

    ACX Multilayer Chip

    Abstract: B551-2 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B5512_ ACX Multilayer Chip B551-2 ACX balun multilayer GHz

    BL201210B1600

    Abstract: ACX balun ACX Multilayer Chip multilayer GHz
    Text: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		PDF BL201210B1600_ BL201210B1600 ACX balun ACX Multilayer Chip multilayer GHz

    BL2012

    Abstract: BL201205L2450 ACX balun ACX Multilayer Chip multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201205L2450_ 75ical BL2012 BL201205L2450 ACX balun ACX Multilayer Chip multilayer GHz

    ACX Multilayer Chip

    Abstract: BL2012-05B3700 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201205B3700_ ACX Multilayer Chip BL2012-05B3700 ACX balun multilayer GHz

    ACX balun

    Abstract: ACX Multilayer Chip multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B5250_ ACX balun ACX Multilayer Chip multilayer GHz

    ACX Multilayer Chip

    Abstract: BL2012 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		PDF BL201220A1440_ ACX Multilayer Chip BL2012 ACX balun multilayer GHz

    ACX Multilayer Chip

    Abstract: ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.1 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210H0465_ ACX Multilayer Chip ACX balun multilayer GHz

    BL2012-05B2450

    Abstract: AN5000 BL2012 SGN5010 IS11LV5010 QFN48 S0805 uPG158TB 10nf capacitor ISSI38
    Text: ISSI IS11LV5010 BluetoothTM Transceiver PRELIMINARY INFORMATION JUNE 2003 FEATURES • A component of ISSI’s family of complete hardware and software BluetoothTM Solutions • Complete 2.45GHz radio transceiver in lowest-cost CMOS silicon • Complete Bluetooth GFSK data modem


    Original     		PDF IS11LV5010 45GHz 40dBc BL2012-05B2450 AN5000 BL2012 SGN5010 IS11LV5010 QFN48 S0805 uPG158TB 10nf capacitor ISSI38

    ACX Multilayer Chip

    Abstract: BL2012-20R0850 BL2012 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc.


    Original     		PDF BL201220R0850_ ACX Multilayer Chip BL2012-20R0850 BL2012 ACX balun multilayer GHz

    ACX Multilayer Chip

    Abstract: BL201210 BL2012-10 BL2012-10B5800 BL2012-10B ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B5800_ ACX Multilayer Chip BL201210 BL2012-10 BL2012-10B5800 BL2012-10B ACX balun multilayer GHz

    BL2012-05B2450

    Abstract: ACX Multilayer Chip bl2012 ACX balun multilayer GHz BL201205B2450
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201205B2450_ BL2012-05B2450 ACX Multilayer Chip bl2012 ACX balun multilayer GHz BL201205B2450

    BL201210B1850

    Abstract: ACX balun ACX Multilayer Chip multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B1850_ BL201210B1850 ACX balun ACX Multilayer Chip multilayer GHz

    BL2012

    Abstract: ACX Multilayer Chip BL2012-10B3301 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B3301_ BL2012 ACX Multilayer Chip BL2012-10B3301 ACX balun multilayer GHz

    BL201205B0900

    Abstract: 05b0900 ACX balun ACX Multilayer Chip multilayer GHz
    Text: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.


    Original     		PDF BL201205B0900_ BL201205B0900 05b0900 ACX balun ACX Multilayer Chip multilayer GHz

    ACX Multilayer Chip

    Abstract: BL2012-20B3700 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201220B3700_ ACX Multilayer Chip BL2012-20B3700 ACX balun multilayer GHz

    ACX Multilayer Chip

    Abstract: BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B3700_ ACX Multilayer Chip BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz

    BL2012-05B2450

    Abstract: JEP106-K Signia Technologies JEP-106K AN5000 D908 HMC190 bl2012 D707 D709
    Text: SGN5010 Bluetooth Transceiver PRELIMINARY SPECIFICATION Key Features: Product Description: The Signia SGN5010 IC is a low-cost, fully integrated CMOS radio frequency RF transceiver and GFSK data modem optimized for use in Bluetooth™ communications applications


    Original     		PDF SGN5010 SGN5010 BL2012-05B2450 JEP106-K Signia Technologies JEP-106K AN5000 D908 HMC190 bl2012 D707 D709

    ACX Multilayer Chip

    Abstract: 15B24 BL2012-15B2450 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201215B2450_ ACX Multilayer Chip 15B24 BL2012-15B2450 ACX balun multilayer GHz

    BL201220B5388

    Abstract: BL2012-20B5388 ACX Multilayer Chip C 5388 equivalent C 5388 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201220B5388_ BL201220B5388 BL2012-20B5388 ACX Multilayer Chip C 5388 equivalent C 5388 ACX balun multilayer GHz

    BL2012-10

    Abstract: ACX Multilayer Chip BL201210 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210K2450_ BL2012-10 ACX Multilayer Chip BL201210 ACX balun multilayer GHz

    bl2012

    Abstract: BL2012-10B2450 BL201210 BL201210B2450 ACX balun ACX Multilayer Chip multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201210B2450_ bl2012 BL2012-10B2450 BL201210 BL201210B2450 ACX balun ACX Multilayer Chip multilayer GHz

    BL201205K5388

    Abstract: BL2012-05K5388 ACX Multilayer Chip C 5388 ACX balun multilayer GHz
    Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,


    Original     		PDF BL201205K5388_ BL201205K5388 BL2012-05K5388 ACX Multilayer Chip C 5388 ACX balun multilayer GHz