Power MOSFET Basics
Abstract: MOSFETs MOS-006 10-15V
Text: Source Gate Power MOSFET Basics N+ P-body Table of Contents 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. N- Epi Basic Device Structure Breakdown Voltage On-State Characteristics Capacitance Gate Charge Gate Resistance Turn-on and Turn-off Body Diode Forward Voltage
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220oC,
MOS-006]
Power MOSFET Basics
MOSFETs
MOS-006
10-15V
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stacked transistor shunt switch
Abstract: stacked transistors SOI RF Peregrine 2000 stacked diplexer and duplexer for GSM and DCS ultra high frequency FETs or transistors SOI series shunt stacked FETs soi stacked FETs circulator s band switching circulator
Text: 18| www.wirelessdesignmag.com COVER STORY| Integrating UltraCMOS Designs in GSM Front Ends G L O S S A RY O F A C R O N Y M S ASM - Antenna switch module BVDSS - Breakdown voltage drain-to-source, gate shorted CDMA - Code-division multiple access CMOS - Complimentary metal oxide semiconductor
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2sk410
Abstract: Hitachi DSA00382
Text: 2SK410 Silicon N-Channel MOS FET Application HF/VHF power amplifier Features • • • • • • • High breakdown voltage You can decrease handling current. Included gate protection diode No secondary–breakdown Wide area of safe operation Simple bias circuitry
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2SK410
2sk410
Hitachi DSA00382
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Hitachi DSA002779
Abstract: 2SK410
Text: 2SK410 Silicon N-Channel MOS FET Application HF/VHF power amplifier Features • • • • • • • High breakdown voltage You can decrease handling current. Included gate protection diode No secondary–breakdown Wide area of safe operation Simple bias circuitry
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2SK410
D-85622
Hitachi DSA002779
2SK410
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pepi c
Abstract: DM100 pepi pepi N HV100 HV300 ISO14000 DM-300 pepi b PEPI N-1
Text: 2.0 µm 5V/100V/300V Analog CMOS Process Parameters Technology outline • • • • • • • • Standard 2 Micron 5V control logic 100V & 300 V N & P channels transistors Low On-Resistance Epi wafers Thin gate oxide State of the art double metal technology [Ti/TiN/Al/TiN
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V/100V/300V
pepi c
DM100
pepi
pepi N
HV100
HV300
ISO14000
DM-300
pepi b
PEPI N-1
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10mhz mosfet
Abstract: an7244 conventional bipolar
Text: Harris Semiconductor No. AN7244.2 Harris Power MOSFETs September 1993 Understanding Power MOSFETs Author: Tom McNulty Power MOSFETs Metal Oxide Semiconductor, Field Effect Transistors differ from bipolar transistors in operating principles, specifications, and performance. In fact, the
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AN7244
10MHz.
10mhz mosfet
conventional bipolar
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HFS3N80
Abstract: hfs3n
Text: BVDSS = 800 V RDS on typ = 4.0 Ω HFS3N80 ID = 3.0 A 800V N-Channel MOSFET TO-220F FEATURES Originative New Design 11 2 Superior Avalanche Rugged Technology Robust Gate Oxide Technology 3 1.Gate 2. Drain 3. Source Very Low Intrinsic Capacitances
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HFS3N80
O-220F
47max
54typ
HFS3N80
hfs3n
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HFU3N80
Abstract: No abstract text available
Text: BVDSS = 800 V RDS on typ = 4.0 Ω HFD3N80/HFU3N80 ID = 2.5 A 800V N-Channel MOSFET D-PAK I-PAK 2 FEATURES 1 1 2 3 Originative New Design 3 HFD3N80 Superior Avalanche Rugged Technology Robust Gate Oxide Technology HFU3N80 1.Gate 2. Drain 3. Source
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HFD3N80/HFU3N80
HFD3N80
HFU3N80
O-252
O-251
HFU3N80
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hfh7n80
Abstract: No abstract text available
Text: BVDSS = 800 V RDS on typ = 1.55 Ω HFH7N80 ID = 7.0 A 800V N-Channel MOSFET TO-3P FEATURES Originative New Design 1 2 3 Superior Avalanche Rugged Technology Robust Gate Oxide Technology 1.Gate 2. Drain 3. Source Very Low Intrinsic Capacitances
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HFH7N80
45typ
hfh7n80
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451 MOSFET
Abstract: ECG463 transconductance mosfet ECG2388 ECG2384 Depletion MOSFET ecg 2385 power mosfet 500 A mosfet to3 mosfet 452
Text: Power MOSFETS ECG Type Description and Application ECG2392 MOSFET, N-Ch, ▲ Enhancement Hi Speed Switch Drain to Gate to Continuous Gate to Transcon Source Source Drain Source Cutoff ductance Breakdown Breakdown Current Voltage Voltage Voltage gfs •d
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ECG2392
ECG2386
451 MOSFET
ECG463
transconductance mosfet
ECG2388
ECG2384
Depletion MOSFET
ecg 2385
power mosfet 500 A
mosfet to3
mosfet 452
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2SK318
Abstract: No abstract text available
Text: 44^205 2SK318- 0013D35 245 • HIT4 HITACHI/ OPTOELECTRONICS blE D SILICON N-CHANNEL MOS FET H F /V H F POWER AMPLIFIER ■ FEATURES • High Breakdown Voltage. • You Can Decrease Handling Current. • • Gate is Protected by Zenner Diodes. No Secondary-Breakdown.
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0013D35
l75MH
l75MHi;
2SK318
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2SK318
Abstract: "beryllium oxide" 20DRAM
Text: 44^205 2SK318- 0013D35 245 • HIT 4 HITACHI/ OPTOELECTRONICS blE D SILICON N-CHANNEL MOS FET H F /V H F POWER AMPLIFIER ■ FEATURES • High Breakdown Voltage. • You Can Decrease Handling Current. • • Gate is Protected by Zenner Diodes. No Secondary-Breakdown.
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0013D35
l75MH
69inv
l75MHi;
2SK318
"beryllium oxide"
20DRAM
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2SK317
Abstract: HF VHF power amplifier 2sk317 hitachi k317
Text: • 2SK317 4 4 ^ 2 0 5 0013033 472 ■ H I T 4 HITACHI/ OPTOELECTRONICS blE lT SILICON N-CHANNEL MOS FET HF/VHF POWER AMPLIFIER ■ FEATURES • High Breakdown Voltage. • You Can Decrease Handling Current. Gate is Protected by Zenner Diodes. No Secondary-Breakdown.
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2SK317
100MHz;
I75MH>
2SK317
HF VHF power amplifier
2sk317 hitachi
k317
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ecg mosfet
Abstract: ecg 222 451 MOSFET Depletion MOSFET ECG2382 ECG312 dual gate mosfet ecg 2385 Philips ECG ECG2380
Text: PHILIPS E C G INC SME D • bbS3^5fl 00071b7 bOO ■ ECÛ Pow er M OSFETS ECG Type Description and Application ECG2392 MOSFET, N-Ch, ▲ Enhancement Hi Speed Sw itch Gate to Continuous Drain to Source Drain Transcon Source ductance Breakdown Breakdown Current
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00071b7
ecg2392
ecg23s6
00D71tifl
ecg mosfet
ecg 222
451 MOSFET
Depletion MOSFET
ECG2382
ECG312
dual gate mosfet
ecg 2385
Philips ECG
ECG2380
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2N7000 021
Abstract: 25c021
Text: TELEDYNE COMPONENTS 3hE D fic117b02 00077^2 1 «TSC 'T Z S Z g WTELEDYNE COMPONENTS 2N7000 2N7002 N-CHANNEL ENHANCEMENT-MODE DMOS POWER FETS FEATURES ABSO LUTE MAXIMUM RATINGS _ _ . • High Gate Oxide Breakdown, ±40V min. ■ Low Output and Transfer Capacitances
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117b02
2N7000
2N7002
2N7000 021
25c021
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2N7002U
Abstract: 2N7000 021
Text: WTELEDYNE COMPONENTS 2N7000 2N7002 N-CHANNEL ENHANCEMENT-MODE DMOS POWER FETS FEATURES ABSOLUTE MAXIMUM RATINGS Ta - +25°C unless otherwise noted (TO-92 Package) • High Gate Oxide Breakdown, +40V min. ■ Low Output and Transfer Capacitances ■ Extended Safe Operating Area
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2N7000
2N7002
2N7002U
2N7000 021
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Untitled
Abstract: No abstract text available
Text: MQ8 Memory HandHng Guideline O K I Semiconductor MOS Memory Handling Guideline 1. Static Electricity Precautions The input impedance is generally high in MOS memories so that the voltage is controlled through the oxide film in a transition gate. This makes the insulation very susceptible to breakdown due
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FRW-17
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Untitled
Abstract: No abstract text available
Text: MOS Memory Handling Guideline O K I Semiconductor MOS Memory Handling Guideline 1. Static Electricity Precautions The input impedance is generally high in MOS memories so that the voltage is controlled through the oxide film in a transition gate. This makes the insulation very susceptible to breakdown due
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Topaz Semiconductor
Abstract: TO226AA 2n7000 sseb 2N700 52BL
Text: TOPAZ SEMICONDUCTOR OSE D g TüôSSEb □□□QTflS G | “* SEMICONDUCTOR T-29-25 2N7000 N-CHANNEL ENHANCEMENT-MODE D-MOS POW m FETs ORDERING INFORMATION TO-226AA TO-92 Plastic Package 2N700Û Description 60V, 5 ohm FEATURES APPLICATIONS • High Gate Oxide Breakdown, +40V min.
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T-29-25
O-226AA
2N700Ã
400mW
2N7000
Topaz Semiconductor
TO226AA
2n7000
sseb
2N700
52BL
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cleanthrough
Abstract: No abstract text available
Text: E2G0008-17-41 O K I Semiconductor MOS Memory Handling Guideline MOS Memory Handling Guideline 1. Static Electricity Precautions The input impedance is generally high in MOS memories so that the voltage is controlled through the oxide film in a transition gate. This makes the insulation very susceptible to breakdown due
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E2G0008-17-41
FRW-17
cleanthrough
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2SK317
Abstract: 2sk317 hitachi J-D4A rfpak zenner 10v D013Q3M
Text: • 2SK317 44‘ìbBDS 0013033 47S « H I T H blE J> HIT AGHI/ OPTOELECTRONICS SILICON N-CHANNEL MOS FET H F /V H F POWER AMPLIFIER ■ FEATURES • High Breakdown Voltage. • You Can Decrease Handling Current. • Gate is Protected by Zenner Diodes. •
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2SK317
D013Q3M
2SK317
2sk317 hitachi
J-D4A
rfpak
zenner 10v
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2SK317
Abstract: zenner 10v 2sk317 hitachi
Text: • 2SK317 HM'ìtSQS 0013033 47S ■ H I T 4 HI TA G H I / OPTOELECTRONICS LIE lT SILICON N-CHANNEL MOS FET H F /V H F POWER AMPLIFIER ■ FEATURES • • High Breakdown Voltage. You Can Decrease Handling Current. • Gate is Protected by Zenner Diodes.
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2SK317
D013Q3M
zenner 10v
2sk317 hitachi
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LTTG
Abstract: EM 257
Text: 4 4 ^ 2 0 5 0 G13 D35 245 • H I T 4 2SK318— HI TA CHI/ OP TO ELE CTR ON ICS blE » SILICON N-CHANNEL MOS FET H F /V H F POWER AMPLIFIER ■ FEATURES • High Breakdown Voltage. • You Can Decrease Handling Current. • Gate is Protected by Zenner Diodes.
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2SK318--
44Tb2G5
0D13D3L.
LTTG
EM 257
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DIODE T25 4 EO
Abstract: DIODE T25 4 Jo 2SK410
Text: 44 T b 20 S 0ni3DSfl Û 42 2SK410 HIT4 H I T A C H I / i O P T O E L E C T R O N I C blE D SILICON N-CHANNEL MOS FET HF/VHF POWER AMPLIFIER • FEATURES • High Breakdown Voltage. • You Can Decrease Handling Current. • Included Gate Protection Diode.
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2SK410
28MHz
DIODE T25 4 EO
DIODE T25 4 Jo
2SK410
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