C7025 ALLOY Search Results

Contextual Info: AMPMODU Interconnection System Short Point Crimp Snap-In Receptacle Contacts Material and Finish .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp

567297-2

Contextual Info: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp

104480-9 crimp tool

Contextual Info: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish: Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A—Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin-lead in

567297-2

Contextual Info: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,

Contextual Info: U SB Conn. Series USB Female 3 Ports A Type No. Name Q'ty 1 Housing 1 Material Finish Remarks & Thickness PBT □-L White/Black 2 Pin Term. 12 Copper Alloy NI:1~5u ; Tin:3u. Gold:1~3u" 3 Shell 1 Brass,0.3mm Tin:3~5u Tin Plated 4 Shell 1 Brass,0.3mm Tin:3~5u

sumitomo G700

Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Contextual Info: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

ALLOY leadframe C7025

Abstract: leadframe C7025 leadframe Cu C7025 C7025 alloy USBQNM50424C N03C QFN-143 USBQNM50403C C7025 TR7 SOT
Contextual Info: USBQNM50403C to USBQNM50424C 500W, Bi-directional TVS array Main product characteristics RoHS VWM 3.3V – 24.0V COMPLIANT VBR min / VBR(max) 4.0V / 26.7V HALOGEN CMAX 3pF PPP 500W FREE QFN-143 NON MAGNETIC FOR MRI Description and applications This Transient Voltage Suppressor (TVS) is assembled in a QFN143 package which is compatible (pin for pin)

QMI519

Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Contextual Info: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.

VIPER

Abstract: amphenol 203-743-9272 VIPER 06 VP773-00001 VP773 VP776-00001 3U VPX minimum wipe length engagement VP773-00002 VP776-00032
Contextual Info: Amphenol’s VIPER connector is a shielded, high-density, VIPER® Interconnect high-speed press-fit, modular interconnect system. Optimized for differential pair architectures on a 1.8mm x 1.35mm grid, the waferized daughtercard assembly also provides single-ended and power wafer

TM 1222

Abstract: 1092-HTA m9625 quick disconnect terminal 4na11 M6112 1262TH st 6062 tape IPC-4-45 IPC-4-45T
Contextual Info: Part Number Cross Reference Part Number 7/16 632 BET SC 7/16 SEMS SCREW 348 731 792 798 834 835 836 / 836-TAPE 892 893 894 895 901 906 926 927 928-No Screw 928 934 ST.S 934 ST. SC 934 MSS 948 949 953 953-MOD 956 / 956-No Hole 957 972 972-TAB 983 984 990 1021

Contextual Info: Catalog 296642 Focused Product Guide ampm odu .025 [0 .64] Revised 7-98 Printed Circuit Board Connectors Continued Interconnection System - Mod. IV Wire-Applied Housings, Double-Row,

Contextual Info: Ratioplast-Electronics Ratioplast-Electronics H.Wiedemann GmbH Jockweg 66, D-32312 Lübbecke Tel:+49 0 5741 23661-0 Fac:+49 (0) 5741 23661-20 USB Female 3 Ports A Type No. Name Q'ty 1 Housing 1 Material Finish Remarks & Thickness PBT White/Black 2 Pin Term.

Contextual Info: 1-104480-5 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we Chat with a Product Information Specialist Products Industries Resources About TE My Part Lists | S Support Center 1-104480-5 Product Details Share .100 AMPMODU Headers, Housings &

Contextual Info: 104480-9 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-9 Product Details Active Print Email Check Pricing & Availability

104480-9

Abstract: 567297-2
Contextual Info: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—

Contextual Info: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability

Contextual Info: AMPMODU Interconnection System Short Point, Crimp Snap-In Wire-Applied Contacts and Housings Product Facts • Short point of contact mates with .169 [4.29] to .259 [6.58] long post ■ Double-row housings are end-to-end and side-to-side stackable ■ Terminates 32-20 AWG

CDA 194

Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Contextual Info: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.

tsop 0038

Abstract: TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package C7025
Contextual Info: TSOP: THIN SMALL OUTLINE PACKAGE DRAWING A2 Z e SEE DETAIL B E Y A1 D1 D SEATING PLANE SEE DETAIL A A DETAIL A DETAIL B c b φ L Thin Small Outline Package TSOP Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch

LMISR4

Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Contextual Info: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com

TSG 3255

Abstract: ALLOY leadframe C7025 leadframe C7025 tsg 271 C7025 certificate c7025
Contextual Info: ‹ Index INDEX A alloy 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 B boxes intermediate see Q-PACK boxes outer (see outer container boxes) tubes, protection from . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2

ALLOY leadframe C7025 material property

Abstract: smd code marking 56L 20L SMD SOT-23 9l marking sot23 ALLOY leadframe C7025 lead frame cu C194 marking code 56l 100L C194 C7025
Contextual Info: A Structured Approach To Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin*, T. Koh*, YY Bong*, MC Chua*, S. Chuah*, JJ Yeoh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore

FLUX TYPE ROL0

Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Contextual Info: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract

ALLOY leadframe C7025

Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,