FBGA10 Search Results

fBGA package tray 12

Abstract: JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA 236-PIN fBGA package tray FBGA-10 FBGA10 236PIN 277-PIN
Contextual Info: TRAY CONTAINER NEC A' 10.65 7 135°C MAX. 12.80 A FBGA10x10ESP 10.35 135.9 115.2 PPE 10×24=240 UNIT : mm 10.65 12.80 10.30 294.4 315.0 322.6 SECTION A – A' 10.65 (5.95) (5.62) 7.62 10.00 Applied Package Quantity (pcs) FBGA10×10 ESP Tray 113-pin Plastic FBGA (10×10)

clc014aje

Abstract: LMV8244 Video sync splitter lm DS34C86 LMH0074SQ DS8921 HV servo thermopile array 2N3960 DP838640 DS8921 equivalent
Contextual Info: Analog Design Guide for Xilinx FPGAs www.national.com/xilinx 2008 Vol. 1 Analog Solutions for FPGAs .2 Design Tools .3 PowerWise Solutions . 4-5 Data Conversion . 6-12 Amplifiers. 13-23

HDMI TO VGA MONITOR PINOUT

Abstract: SEMINAR ON 4G TECHNOLOGY GSM BTS antenna sot23-5 code BBB GSM repeater HDMI to vga pinout microwave products HSPA Module LM5070 12v output DS90LV804TSQ
Contextual Info: Wireless Infrastructure 2G/3G/4G Base Station Solutions Guide 2008 Vol. 1 1Q 2008 High-Speed Data Converters . 4-6 Low-Power Data Converters and Temperature Sensors . 7-8 RF Detectors and High-Speed Comparators.9 Precision and

Contextual Info: P—FBGA107—091S—0.80EZ Unit' nn 0 ^ 1. 40MAX nrroi, . 0. 26±0. 04 <|>O ! 10,80I iHJ- o o o o o|o o o o o 000001 1 0000 XEO o o o | o o o o o o o o o ojo o o o o o_o_o gpio o_o_o % o o o o o]o o o o o oooo oooooo O O O O 0-0 o o o o o o o o olo o o o o

P-FBGA107-0912-0

Contextual Info: P—FBGA107—091S—0.80CZ Unit' nn a ^ 5. 6 1. 4MAX rn rs i 0. 33±0. 05 fPT8~| rc rri O CD ! CD o o o o olcp o d o o o o o o o j o o o 0-0ooooolooooo ooooolooooo I _o OOO Ojp 0.0 oo r oooo'oToobo-eooooojooooo 1 OOOOOIOOOOO o o o o o j o o o o-©o o o o p o o o-eo-©-

Contextual Info: P—FBGA107—091S—0.80DZ Uniti nn Jul.2003

Contextual Info: P—FBGA107—091S—0.80CZ Uniti nn Jul.2003

P-FBGA101-1012-0

Contextual Info: P—FBGA101—101E—0.80A3 Uniti nn Jul.2003

Contextual Info: P—FBGA103—091S—0.80A4 Uniti nn Jul.2003

Contextual Info: P—FBGA107—091S—0.80AZ Uniti nn Ja n ,2004

Contextual Info: P—FBGA107—091S—0.80BZ Unit' nn 0 ^ 1. 40MAX nrroi, . 0. 26±0. 04 <|>O ! 10,80I iHJ- o o o o o|o o o o o 000001 1 0000 XEO o o o | o o o o o o o o o ojo o o o o o_o_o gpio o_o_o % o o o o o]o o o o o oooo oooooo O O O O 0-0 o o o o o o o o olo o o o o

taiyo PSR4000

Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

Contextual Info: P —FBGA107—0912—0.80FZ

NAND FLASH BGA

Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
Contextual Info: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction

Contextual Info: P—FBGA107—091S—0.80FZ Uniti nn Jan,2004

Contextual Info: P—FBGA109—1111—0.80C3 Uniti nn lES H 3 ] EH] -oooooooooooo -ooooooloooooo ooooooioooooo ooo !I ooo ooo ooo hO _O Q _ L ooo_ òoo T óoò OOO I Oooo OOOO ! OO ooooooloooooo OOOOOOIOOOOOO -OOOOOOIOOOOOO L 3 4 5 6 7 8 9 10 11 12 00. 5±0. 0 5 1 fiei0O , 08 M3I STABI

Contextual Info: P—FBGA107—091S—0.80FZ Unit' nn 0 ^ 1. 40MAX nrroi, . 0. 26±0. 04 <|>O ! 10,80I iHJ- o o o o o|o o o o o 000001 1 0000 XEO o o o | o o o o o o o o o ojo o o o o o_o_o gpio o_o_o % o o o o o]o o o o o oooo oooooo O O O O 0-0 o o o o o o o o olo o o o o

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

1LQ1

Abstract: national an-1 voltage regulator MCF528x DSLV010A CLC01A DP83849 bsdl DS90LV110T
Contextual Info: ナショナル セミコンダクター インタフェース製品 セレクションガイド 2006年12月 LVDS/BusLVDS/M-LVDS. ドライバ・レシーバ・. トランシーバ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6 マルチギガビット LVDS.

Virtex-4 serdes

Abstract: camera-link to hd-SDI converter schematic satellite finder BELDEN 1700A dp83848 1470 LM camera-link to SDI converter CAT5E Pinout DP83865 SCHEMATIC dp83848 data sheet
Contextual Info: Interface Selection Guide March 2007 LVDS Drivers/Receivers Tranceivers . 5-6 LVDS and CML PHYs Differential to Differential . 7-10 SerDes . . 11-13 Serial Digital Interface (SDI) . . 14-16

blm21p221sn

Abstract: RJ45INTLED MICTOR38P 3 7segment k168 K163 4R7 w24 2S180 Up board date sheet BLM21P221SN1
Contextual Info: A B C D 8/18/05 3 2 1 5 4 Created schematic and changed the component from the 2S60 on the DSP board to the 2S180 on this Pro version of the board Change Description 3 01 Rev Thursday, August 18, 2005 Date: 2 Document Number P06-10217-01 DSP Pro Stratix II 2S180 Maine Pro

1LQ1

Abstract: LM201 IC ASIC LQFP128 LM5035 LMH7332 picocell DS15CP154 LM5002 LM5070 12v output LMH6515
Contextual Info: 無線通信網絡基建設備 2G/3G/4G 基站解決方案概覽 2008 年 第 2 季 1Q 2008 2G2.5G、3G、LTE 及 4G 無線移動電話基站 例如 GSM/ EDGE/GPRS、W-CDMA、 CDMA2000、TD-SCDMA、 WiMAX 以及其他應用的解 決方案 高速數據轉換器. 4-6

Contextual Info: P—FBGA107—0912—0.80BZ

Contextual Info: P—FBGA107—0912—0.80EZ