FPBGA Search Results

Contextual Info: Package Outline 25-Ball fpBGA Package Outline GA 5.70x5.00mm body, 1.20mm height (max), 0.75mm pitch D 7 6 5 4 3 2 1 Note 2 A B Terminal A1 Corner Index Area (D/4 x E/4) Note 1 SE E C E1 D e E F e D1 Top View SD Bottom View View B A2 Seating Plane A A1 Φb

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

FPBGA

Abstract: ga 25 diode M918 package diode
Contextual Info: Tape and Reel Specification M918 Tape and Reel Option Fine Pitch Ball Grid Array Package GA 25 / 26 Ball W P Direction of Feed Package Suffix Package Type GA fpBGA 050708 Ball Count Tape Width (W) 25 12 26 16 (mm) Pocket Pitch (P) Reel Diameter Units per Reel

GSDC048U

Abstract: GSDC048GU
Contextual Info: GSDC048U 48-Bump BGA 6 mm x 8 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 48-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—48-Bump FPBGA (Package U)

GSDC165AE

Abstract: GSDC165GAE
Contextual Info: GSDC165AE 165-Bump BGA 15 mm x 17 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—165-Bump FPBGA (Package E)

GSDC119B

Abstract: BGA14 GSDC119GB
Contextual Info: GSDC119B 119-Bump BGA 14 mm x 12 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 119-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—119-Bump FPBGA (Package B, Variation 2)

GSDC165D

Abstract: GSDC165GD BGA L
Contextual Info: GSDC165D 165-Bump BGA 13 mm x 15 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—165-Bump FPBGA (Package D)

Contextual Info: ispXPGA Evaluation Board User’s Guide October 2004 ebug02_02 Lattice Semiconductor ispXPGA Evaluation Board User’s Guide Introduction The ispXPGA Evaluation Board is a versatile platform that enables the user to program, evaluate, and de-bug a design for the Lattice ispXPGA architecture. The board features a 900-ball fpBGA ispXPGA device with SMA connectors for access to the device’s High Speed Interface sysHSI™ and other I/Os. Connectors are also available to

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 625 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. Sq. 625-25AB .984 25 625-35AB .984 (25) 625-45AB .984 (25) 625-60AB .984 (25) Material: Aluminum, Black Anodized Fin Height

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 658 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Base Dimensions in. mm Dimension “A” in. (mm) 658-25AB 1.100 (27.9) sq 0.250 (6.4) 658-35AB 1.100 (27.9) sq 0.350 (8.9)

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight lbs. (grams) 624-25AB 624-35AB 624-45AB 624-60AB .827 (21)

FPBGA

Contextual Info: Package Dimensions—119-Bump FPBGA Package B, Variation 3 TOP VIEW A1 1 2 3 4 5 6 BOTTOM VIEW A1 Ø0.10S C Ø0.30S C AS B S Ø0.60~0.90 (119x) 7 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U 20.32 22±0.10 1.27 A B C D E F G H J K L M N P R T U B SEATING PLANE

Contextual Info: Package Dimensions—165-Bump FPBGA Package GE (MCM A1 CORNER TOP VIEW BOTTOM VIEW Ø0.10 M C Ø0.25 M C A B Ø0.40~0.60 (165x) 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 1.0 14.0 17±0.05 1.0 A B C D E F G H

100-Pin Package Pin-Out Diagram

Abstract: GS71024
Contextual Info: GS71024T/U 64K x 24 1.5Mb Asynchronous SRAM TQFP, FPBGA Commercial Temp Industrial Temp Features 8, 10, 12, 15 ns 3.3 V VDD Fine Pitch BGA Bump Configuration • Fast access time: 8, 10, 12, 15 ns • CMOS low power operation: 190/160/130/110 mA at minimum cycle time.

BGA 64 PACKAGE thermal resistance

Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Contextual Info: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight

HL832nxa

Abstract: VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 26-Jul-2010 15.0mm x 15.0mm x 1.7mm FPBGA-324

LX128

Contextual Info: ispGDX2 Data Sheet Revision History Date Version Page Change Summary April, 2003 05 - Previous Lattice release Updated Data Sheet to reflect production release of the LX64 and LX128 devices. - AC/DC Specifications - 100- and 208-ball fpBGA Logic Signal Connections

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

W3E32M72S-XSBX

Contextual Info: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266, 333Mbs 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply

Contextual Info: Package Dimensions—165-Bump FPBGA Package E A1 CORNER TOP VIEW BOTTOM VIEW Ø0.08 M C Ø0.15 M C A B Ø0.40~0.50 (165x) 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 1.0 14.0 17±0.05 1.0 A B C D E F G H I J K

KE-G1250

Abstract: AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02 DATE: 20-Nov-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers

EME-G770

Abstract: KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02R1 DATE: 18-Dec-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers

Contextual Info: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count  2.5V ±0.2V core power supply

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm