FPBGA 272 Search Results

ispMACH M4A3

Abstract: ISPGDX160A ispGAL22V10
Contextual Info: 208-Ball fpBGA 256-Ball fpBGA 100-Ball caBGA 144-Ball fpBGA 49-Ball caBGA Fine Pitch BGA 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch 23.00 x 23.00 mm 1.0 mm pitch BGA 27.00 x 27.00 mm

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

lcmxo2-1200

Abstract: LFE3-17EA LCMXO2 1200 LC4064 LFXP20C 22V10A lfe3-70ea LC4256 HW-USBN-2A LFXP2-40E
Contextual Info: Rev 5.2 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of Lattice devices all families except iCE without soldering on a printed circuit board. The Desktop Programmer communicates to software on the PC (ispVM System or Diamond Programmer) via a Lattice Programming Cable (USB: HW-USBN-2A, or Parallel: HW-DLN-3C Parallel cable is included with the Model 300). To program a specific Lattice device, an appropriate Lattice socket adapter must be installed on the Model 300 Desktop

im4a3-64

Abstract: lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea IM4A3-256 iM4A3-384 LFXP2-8E lfe3-70ea
Contextual Info: Lattice Socket Adapter Listing Rev 4.30 Socket Adapters are the interface between programming hardware such as the Lattice Model 300 desktop programmer , and Lattice programmable devices. This document shows which Lattice Socket Adapters support which Lattice programmable products. Lattice Socket Adapters are

ispmach lc4032

Abstract: Lattice Socket Products LFE3-95EA
Contextual Info: Rev 5.8.1 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of all Lattice families except iCE without soldering on a printed circuit board. The Model 300 is supported by the Lattice Programming Cable HW-USBN-2A is included with the Model 300 . To program a specific Lattice device, an appropriate Lattice socket adapter must be

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

lattice im4a3

Abstract: im4a3-64 im4a3 lattice Im4a3 128/64 im4a3-128/64 IM4A3-256 tqfp 44 socket iM4A3-128 im4a3-192 128-PIN PQFP
Contextual Info: GAL, ispGAL, ispGDX, ispLSI, ispPAC, MACH, ispMACH, ispXPGA and ispXPLD Socket Adapters The following socket adapters are available to program GAL, ispGAL, ispLSI, ispGDX, ispPAC, MACH, ispMACH, ispXPGA and ispXPLD devices on Lattice's Model 100 and 300 programmers and on

Lattice Socket Products

Abstract: LFE3-95EA
Contextual Info: Rev 5.7 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of all Lattice families except iCE without soldering on a printed circuit board. The Model 300 is supported by the Lattice Programming Cable (HW-USBN-2A is included with the Model 300). To program a specific Lattice device, an appropriate Lattice socket adapter must

lfe2

Abstract: PL25B
Contextual Info: LatticeECP2/M Family Data Sheet DS1006 Version 02.6, April 2007 LatticeECP2/M Family Data Sheet Introduction April 2007 Advance Data Sheet DS1006 • Pre-Engineered Source Synchronous I/O Features • DDR registers in I/O cells • Dedicated gearing logic

416-ball

Abstract: 1152-ball 132-ball lattice fpbga 484 FPBGA
Contextual Info: Product Bulletin April 2009 #PB1240H Lattice Ordering Guidelines for Custom Product and Tape and Reel Introduction Lattice “Custom Products” include the following: • Factory Programming • Custom Processing • Custom Testing • Custom Marking •

PR88A

Contextual Info: LatticeECP2/M Family Data Sheet DS1006 Version 02.5, March 2007 LatticeECP2/M Family Data Sheet Introduction March 2007 Advance Data Sheet DS1006 • Pre-Engineered Source Synchronous I/O Features • DDR registers in I/O cells • Dedicated gearing logic

REELS

Abstract: CABGA 56
Contextual Info: Product Bulletin November 2010 #PB1240I Lattice Ordering Guidelines for Custom Product and Tape and Reel Introduction Lattice “Custom Products” include the following: • Factory Pre-Programming Encryption & Non-Encryption  Custom Processing (Including custom testing, restricted material set, custom product

Contextual Info: LatticeECP2/M Family Data Sheet DS1006 Version 02.2, December 2006 LatticeECP2/M Family Data Sheet Introduction December 2006 Advance Data Sheet DS1006 • Pre-Engineered Source Synchronous I/O Features • DDR registers in I/O cells • Dedicated gearing logic

LFE2-20E-5FN256I

Abstract: lfe2m35e-7fn484c LFE2M50E-5F484C LFE2M50E-5FN484C LFE2M50E5F484C lfe2m35e7fn484c LFE2M50E-6FN484C
Contextual Info: LatticeECP2/M Family Data Sheet DS1006 Version 02.3, February 2007 LatticeECP2/M Family Data Sheet Introduction December 2006 Advance Data Sheet DS1006 • Pre-Engineered Source Synchronous I/O Features • DDR registers in I/O cells • Dedicated gearing logic

Contextual Info: LatticeECP/EC Family Data Sheet Version 01.6, May 2005 LatticeECP/EC Family Data Sheet Introduction May 2005 Preliminary Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported

Contextual Info: LatticeECP/EC Family Data Sheet DS1000 Version 02.7, February 2008 LatticeECP/EC Family Data Sheet Introduction May 2005 Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported

PT15B

Contextual Info: LatticeECP/EC Family Data Sheet Version 02.3, January 2007 LatticeECP/EC Family Data Sheet Introduction May 2005 Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported

Contextual Info: LatticeECP/EC Family Data Sheet DS1000 Version 02.8, September 2012 LatticeECP/EC Family Data Sheet Introduction September 2012 Data Sheet Features        Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os

24.000 mhz

Abstract: FPBGA bga 208 PACKAGE bga 388 e2cmos technology 5000VA 5256VA 5384VA 5512VA 5kva
Contextual Info: Introduction to ispLSI 5000V Family Introduction The ispLSI 5000V SuperWIDE Family represents Lattice’s second generation of true 3.3V in-system programmable PLDs with programmable 3.3V/2.5V outputs to support your next generation designs. A new SuperWIDE architecture provides support for even the widest

LFEC6E-3T144C

Abstract: PT15B EC656
Contextual Info: LatticeECP/EC Family Data Sheet Version 02.2, March 2006 LatticeECP/EC Family Data Sheet Introduction May 2005 Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported

LFEC6E-5T144C

Abstract: PB18A BDQS14 flip flop T Toggle pl25a 5qn208c PB20A LFEC6E-4FN256C PB11B PL18B
Contextual Info: LatticeECP/EC Family Data Sheet DS1000 Version 02.7, February 2008 LatticeECP/EC Family Data Sheet Introduction May 2005 Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported

PT15B

Abstract: R8K10 DDR400 LFEC10 LFEC15 LFEC33 LFECP10 LFECP15 LFECP20 LFECP33
Contextual Info: LatticeECP/EC Family Data Sheet Version 02.2, March 2006 LatticeECP/EC Family Data Sheet Introduction May 2005 Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported

116-Pin

Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Contextual Info: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size

PT15B

Abstract: LFEC15E-5FN484C
Contextual Info: LatticeECP/EC Family Data Sheet DS1000 Version 02.6, November 2007 LatticeECP/EC Family Data Sheet Introduction May 2005 Data Sheet Features − − − − − − • Extensive Density and Package Options • 1.5K to 32.8K LUT4s • 65 to 496 I/Os • Density migration supported