HBGA960 Search Results

Contextual Info: Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b e y y1 C ∅w M C AK AH AF AD AB Y V T P M AL AJ AG AE AA F D B heatsink

MS-034

Abstract: n 332 ab sot683 HBGA960
Contextual Info: PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA960: plastic, heatsink ball grid array package; 960 balls; body 33 x 33 x 2.4 mm SOT683-1 B D A D1 ball A1 index area A3 A E1 E A2 A1 detail X e1 b e AL AJ AG AE AC AA W U R N L J G E C A ∅w M AF

MS-034

Contextual Info: PDF: 2002 May 07 Philips Semiconductors Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C AK AH AF

MSD858

Contextual Info: Philips Semiconductors The TZA2080 is a monolithic 68 x 68 asynchronous cross-point switch, designed to carry broadband data streams up to 3.2 Gb/s. The non-blocking switch core is programmed trough a parallel port interface that allows random access programming of each output

CGY2144

Abstract: CGY2141 Ultrafast Photodiode InGaAs MSD828 photodiode germanium STM-64 for FTTH LQFP32 QFP64 TZA3005 TZA3047
Contextual Info: Network Infrastructure Delivering the broadband revolution Philips Semiconductors More information, interaction and better quality of service.These are the challenges that face us with today’s Internet-driven broadband revolution.To meet these challenges,