Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT683 Search Results

    SOT683 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT683-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink Original PDF

    SOT683 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b e y y1 C ∅w M C AK AH AF AD AB Y V T P M AL AJ AG AE AA F D B heatsink


    Original     		PDF HBGA960: OT683-1 MS-034

    MS-034

    Abstract: n 332 ab sot683 HBGA960
    Text: PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA960: plastic, heatsink ball grid array package; 960 balls; body 33 x 33 x 2.4 mm SOT683-1 B D A D1 ball A1 index area A3 A E1 E A2 A1 detail X e1 b e AL AJ AG AE AC AA W U R N L J G E C A ∅w M AF


    Original     		PDF HBGA960: OT683-1 MS-034 MS-034 n 332 ab sot683 HBGA960

    MS-034

    Abstract: No abstract text available
    Text: PDF: 2002 May 07 Philips Semiconductors Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C AK AH AF


    Original     		PDF HBGA960: OT683-1 MS-034 MS-034