HVQFN56 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1

MO-220

Abstract: sot684 HVQFN56
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 28 L y y1 C v M C A B w M C

PVQN0056KA-A

Abstract: HDD42 P-HVQFN56-8x8-0
Contextual Info: JEITA Package Code P-HVQFN56-8x8-0.50 RENESAS Code PVQN0056KA-A Previous Code ⎯ MASS[Typ.] 0.2g NOTE b1,c1: DIMENSION BEFORE PLATING HD D 42 29 29 28 28 43 3.0 HE E e 43 42 0.0 0.3 1.0 Lp Reference Symbol 14 56 14 A1 A C1 C y S 3.0 1.0 3.0 Index mark S

MO-220

Abstract: jedec package MO-220 SOT684-1 HVQFN-56 HVQFN56
Contextual Info: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN56: plastic, heatsink very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A A4 E detail X C e1 1/2 e e 15 y y1 C ∅v M C A B b ∅w M C

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e Eh1 Eh e2 1/2 e

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1 42 terminal 1

MO-220

Abstract: sot684 HVQFN56
Contextual Info: Package outline Philips Semiconductors HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e b 15 L y y1 C v M C A B w M C 28 29 14 e e2 Eh 1/2 e 1 42 terminal 1

MO-220

Abstract: sot684
Contextual Info: PDF: 2003 Nov 24 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C

Contextual Info: SOT684-1 HVQFN56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 18 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm D B SOT949-2 A A1 A A3 terminal 1 index area E detail X e1 C v w b L 15 28 C A B A y y1 C 29 14 e e2 Eh 1/2 e 1 terminal 1 index area

sot684

Abstract: sot684-10
Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-10 B D D1 A terminal 1 index area E1 E A4 A c A1 detail X e1 e 1/2 e L 15 28 14 C C A B C v w b y y1 C 29 e e2 Eh 1/2 e 1 42

MO-220

Abstract: sot684
Contextual Info: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm B D SOT949-1 A terminal 1 index area E A A1 c detail X e1 1/2 e e 15 L ∅v ∅w b 28 14 M M C C A B C y1 C y 29 e e2 Eh 1/2 e 1 terminal 1

HVQFN56

Contextual Info: +9 4 1  SOT949-2 HVQFN56; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 November 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A E A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e eg Eg 1 42

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm B D SOT684-6 A terminal 1 index area E A A1 c detail X C e1 e 1/2 e ∅v ∅w b 15 28 L M M C A B C y y1 C 29 14 e Eh Ek e2 1/2 e Ej

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-11 terminal A1 index area E A A1 c detail X e1 e L 1/2 e 15 28 14 C C A B C v w b y1 C y 29 e e2 Eh 1/2 e 1 42 56 terminal A1

JESD204A

Abstract: WIDEBAND ULTRASOUND CMLAN
Contextual Info: NXP dual 12/14-bit ADC with serial interface ADC1x13 Dual-channel ADCs with JESD204A-compliant outputs for wireless and industrial Equipped with 3.125-Gbps serial output interfaces that comply with JEDEC JESD204A, these dual-channel ADCs support sample rates up to 125 MSPS, integrate a programmable gain buffer,

ISP1582BSUM

Abstract: ISP1582BS-UM ISP1582BS ISP1582BSGA ISP1582 AN1004 st-ericsson AN10071
Contextual Info: ISP1582 Hi-Speed USB peripheral controller Rev. 09 — 29 September 2009 Product data sheet 1. General description The ISP1582 is a cost-optimized and feature-optimized Hi-Speed Universal Serial Bus USB peripheral controller. It fully complies with Ref. 1 “Universal Serial Bus Specification

LPC2148 i2c

Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Contextual Info: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.

photo interrupter module

Abstract: wiring circuit stepper motor "Photo Interrupter" Application Note mosfet discrete totem pole CIRCUIT PCA9539 principle stepper motor unipolar stepper motor programming in c 7.5 stepper motor PCA9538 optical interrupter darlington
Contextual Info: AN10814 Driving stepper motors using NXP I2C-bus GPIO expanders Rev. 01 — 11 September 2009 Application note Document information Info Content Keywords stepper, stepper motor, GPIO, push-pull, quasi-bidirectional, MOSFET, optical interrupter, Fast-mode Plus, Fm+, I2C-bus