SOT684 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1

MO-220

Abstract: sot684 HVQFN56
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 28 L y y1 C v M C A B w M C

MO-220

Abstract: jedec package MO-220 SOT684-1 HVQFN-56 HVQFN56
Contextual Info: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN56: plastic, heatsink very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A A4 E detail X C e1 1/2 e e 15 y y1 C ∅v M C A B b ∅w M C

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e Eh1 Eh e2 1/2 e

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1 42 terminal 1

MO-220

Abstract: sot684 HVQFN56
Contextual Info: Package outline Philips Semiconductors HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e b 15 L y y1 C v M C A B w M C 28 29 14 e e2 Eh 1/2 e 1 42 terminal 1

MO-220

Abstract: sot684
Contextual Info: PDF: 2003 Nov 24 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C

Contextual Info: SOT684-1 HVQFN56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 18 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

sot684

Abstract: sot684-10
Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-10 B D D1 A terminal 1 index area E1 E A4 A c A1 detail X e1 e 1/2 e L 15 28 14 C C A B C v w b y y1 C 29 e e2 Eh 1/2 e 1 42

MO-220

Abstract: sot684 HVQFN56 HVQFN-56
Contextual Info: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e b 15 28 L y y1 C v M C A B

MO-220

Abstract: sot684
Contextual Info: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm B D SOT684-6 A terminal 1 index area E A A1 c detail X C e1 e 1/2 e ∅v ∅w b 15 28 L M M C A B C y y1 C 29 14 e Eh Ek e2 1/2 e Ej

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-11 terminal A1 index area E A A1 c detail X e1 e L 1/2 e 15 28 14 C C A B C v w b y1 C y 29 e e2 Eh 1/2 e 1 42 56 terminal A1

ISP1582BSUM

Abstract: ISP1582BS-UM ISP1582BS ISP1582BSGA ISP1582 AN1004 st-ericsson AN10071
Contextual Info: ISP1582 Hi-Speed USB peripheral controller Rev. 09 — 29 September 2009 Product data sheet 1. General description The ISP1582 is a cost-optimized and feature-optimized Hi-Speed Universal Serial Bus USB peripheral controller. It fully complies with Ref. 1 “Universal Serial Bus Specification

LPC2148 i2c

Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Contextual Info: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.

ISP1362

Abstract: TFBGA128 portable dvd player power supply ISP1583 CP2147 philips ISP1362 pSOS PXA255 ISP1761 HVQFN14
Contextual Info: Semiconductors Application Matrix Carkit Digital still camera Digital TV Digital video camera Digital video recorder DVD recorder Dongle/bridge Game console Hub Hub: device bay Hub: docking station Hub: monitor Media player Mobile phone Modem: cable/DSL MP3/audio jukebox

HVQFN-56

Contextual Info: DAC1628D1G25 Dual 16-bit DAC: JESD204B interface: up to 1.25 Gsps; x2, x4 and x8 interpolating Rev. 1.1 — 10 October 2011 Objective data sheet 1. General description The DAC1628D1G25 is a high-speed high-performance 16-bit dual channel digital-to-analog converter DAC . The device provides a sample rate up to 1.25 Gsps with

AN01026

Abstract: MO-220 PIP212-12M smd EH1 PIP212M-12M hazel grove
Contextual Info: PIP212-12M DC-to-DC converter powertrain Rev. 02 — 2 March 2005 Preliminary data sheet 1. General description The PIP212M-12M is a fully optimized powertrain for high current high frequency synchronous buck DC-to-DC applications. The PIP212M-12M replaces two power

isp1582

Abstract: ISP1582BS "USB" peripheral
Contextual Info: ISP1582 Hi-Speed Universal Serial Bus Peripheral Controller Rev. 05 — 1 February 2007 Product data sheet 1. General description The ISP1582 is a cost-optimized and feature-optimized Hi-Speed Universal Serial Bus USB Peripheral Controller. It fully complies with Ref. 1 “Universal Serial Bus

Contextual Info: SSTVF16859 13-bit 1 : 2 SSTL_2 registered buffer for DDR Rev. 02 — 19 July 2005 Product data sheet 1. General description The SSTVF16859 is a 13-bit to 26-bit SSTL_2 registered driver with differential clock inputs, designed to operate between 2.3 V and 2.7 V for PC1600-PC2700 applications or

JESD204

Abstract: ADC1113D125 JESD204A ADC ic 0808 pin diagram FK17
Contextual Info: ADC1213D series Dual 12-bit ADC; 65 Msps, 80 Msps, 105 Msps or 125 Msps; serial JESD204A interface Rev. 6 — 9 February 2011 Product data sheet 1. General description The ADC1213D is a dual-channel 12-bit Analog-to-Digital Converter ADC optimized for high dynamic performance and low power at sample rates up to 125 Msps. Pipelined