L024 Search Results

L024K

Contextual Info: CYPRESS L024K x 32 Static RAM Module Features Functional Description • H igh-d en sily 32-m egabit SRAM m odule • 32-bit Standard Footprint supports d en sities from 16K x 32 through IM X 32 T h e C Y M I8 5 1 is a h ig h -p e rfo rm an ce 3 2 -m e g ab it static R A M m o d u le o rg an ized

Contextual Info: Temperature measurement with transistor switching output TC-103A-G1/8-AP6-H1140-L024 • Switchpoint, factory set ■ Temperature range 0…150 °C Wiring diagram General description Edition • 2013-07-14T00:42:18+02:00 Sensor with integrated probe Different probe

GT-BG600L

Contextual Info: 1 1 r - 0 8 .2 0 REV. GT-BG600L B REV. E.C.N. NUMBER AND REVISION COMMENTS A E.C.N. #10431. B E .C .N . # 1 1 1 4 8 . [0 0 .3 2 3 ] & # 1 OBRDR. & REDRAWN. DATE 3 -2 7 -0 0 1 2 .1 1 .OB ELECTRICAL SPECIFICATIONS 26,00±2,00 [L024 ±0.079] 2 PART NUMBER PARAMETER

Contextual Info: Temperature measurement Probe TP-103A-G1/8-H1141-L024 • Pt-100 probe acc. to DIN EN 60751 ■ Vibration an shock-resistant ■ Connectable to TS, TTM, IM34, BL20, BL67 ■ Temperature range -50…120 °C ■ 4-wire technology Wiring diagram Type code Ident no.

Contextual Info: Temperature measurement miniature transmitter with integrated probe TTM050C-103A-G1/8-LI6-H1140-L024 -50.50°C • Miniature design ■ Analog output 4…20 mA ■ Temperature range -50…50 °C Wiring diagram Edition • 2013-07-14T00:50:19+02:00 General description

TT-103A-G1/8-LI6-H1140-L024

Contextual Info: Temperature measurement Transmitter with integrated probe TT-103A-G1/8-LI6-H1140-L024 • Factory setting 0…150 °C ■ Analog output 4…20 mA ■ Temperature range 0…150 °C Wiring diagram Edition • 2013-07-14T00:42:02+02:00 General description Type code

Contextual Info: Temperature measurement miniature transmitter with integrated probe TTM100C-103A-G1/8-LI6-H1140-L024 • Miniature design ■ Analog output 4…20 mA ■ Temperature range 0…100 °C Wiring diagram Edition • 2013-07-14T00:50:11+02:00 General description

Contextual Info: PMC1288 128K x 8 aewange onfqibmiaton ULTRA HIGH SPEED STATIC CMOS RAM SCRAM MODULE ¿ 4 - FEATURES • Ultra-Fast l024K-b!t CMOS Static RAM Module ■ Fully TTL Compatible Inputs and Outputs ■ 600 Mils 32-pin Sidebraze Ceramic DIP

GT-BG470L

Contextual Info: 1 1 r - 0 8 .2 0 REV. GT-BG470L B REV. E .C .N . NUM BER AND A E .C .N . #10431. & B E .C .N . # 1 1 1 4 8 . [0 0 .3 2 3 ] R E V IS IO N # 1 OBRDR. C O M M EN TS & DATE R EDR AW N . 3 -2 7 -0 0 1 2 . 1 1 . OB ELECTRICAL SPECIFICATIONS 26,00±2,00 [L024 ±0.079]

A14C

Abstract: PCT240 PACE 3L05
Contextual Info: ÄPVAM ßli PMC1288 128K x 8 ULTRA HIGH SPEED STATIC CMOS RAM SCRAM MODULE 7$ DMFÛHRUMÂTroD : FEATURES • Ultra-Fast l024K-blt CMOS Static RAM Module ■ 600 Mils 32-pin Sidebraze Ceramic DIP JEDEC Standard for Monolithic 128Kx8 ■ High Speed (Equal Access and Cycle Times)

str f 6456

Abstract: str x 6456 SM 5126 BP STR F 6168 str 6668 STR G 6352 STR 6456 str f 6468 321 CJ 7121 AXP 209 IC
Contextual Info: Tem ic Se ni i co n fi li c t ci Sales Offices rs Addresses Europe France TE M IC France Les Q uadrants 3. avenue du centre B.P. 309 78054 S t.-Q uentin-en-Y veL nes Cedex Tel: 33 I 3060 7000 F a x :33 I 3060 V 11 i Germany TE M IC TE LEFU N K EN m icroelectronic G m bH

Contextual Info: Advanced Micro Devices A m 2 7 X 1 0 2 4 1 Megabit 55,536 x 16-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: — Factory optimized programming — Fully tested and guaranteed ■ As a Mask ROM alternative: — Shorter leadtime

SM10B-SHLS-TF

Contextual Info: LCD Module Technical Specification F irst Edition Apr. 16, 2010 Final R evision Oct. 14, 2010 T-55533D104J-LW-A-ABN T yp e NO Customer C ustom er's Product No OPTREX CORPORATION Approved : Yasuo Kawasaki QUALITY ASSURANCE DIVISION Checked : Toshiaki Ochi P r o d u c t R e a l i z a t i o n Div.

L-02402G-B6.4

Abstract: k 2225 2X12
Contextual Info: L-02402G-B6.4 BACK LIGHT SERIES Package Dimension: 67.16 64.36 6.0 5.5 3.3 A 11.9 7.0 19.45 K 22.25 2.4 Foam twin adhesive Ø 0.51 6.4±0.5 0.17MAX Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice

b17 c144

Abstract: BUF C147 c046 ea18 108 to 174 mhz radio receiver idc139
Contextual Info: CXD2951GA-4 Single Chip GPS LSI Description The CXD2951GA-4 is a dedicated single chip LSI for the GPS Global Positioning System , satellitebased location measurement system. This LSI enables the configuration of a single chip system providing a cost-effective, low-power solution.

32.768KHz TCXO, 0.2PPM

Abstract: C143 T transistor BUF C145 C143 E S S transistor ea18 r028 CXD2951GA-4 800MHz CDMA Handset Circuit Diagram C082 c092 diode
Contextual Info: Single Chip GPS LSI CXD2951GA-4 Description The CXD2951GA-4 is a dedicated single chip LSI for the GPS Global Positioning System , satellite-based location measurement system. This LSI enables the configuration of a single chip system providing a costeffective, low-power solution.

BUF C145

Abstract: C143 T transistor C082 c143 lna vco mixer quadrature 2GHz r057 CXD2951GA-2 EA11 NMEA-0183 KOA RK73H
Contextual Info: CXD2951GA-2 Single Chip GPS LSI Description The CXD2951GA-2 is a dedicated single chip LSI for the GPS Global Positioning System , satellitebased location measurement system. This LSI enables the configuration of a single chip system providing a cost-effective, low-power solution.

nec tokin oe 128

Abstract: MS-17171 MCP51M NEC Tokin od 108 c113 pc 100 3p3 nvidia c51mv PC017 MS17171 Athlon Neo X2 CM1616
Contextual Info: 5 4 3 MS-17171 Ver : 2.0 2 Processor 1 DDR2 Sodimm 0 AMD S1 638 pin uFCPGA 638 socket Battery Charger Page 6 DDR2 400 / 533 / 667 MHz Page 31 DDR2 Sodimm 1 Page 2,3,4,5 Battery select Page 6 Page 32 D D 16 X 16 Bit HyperTransport Link DRAM Power Page 33 North Bridge

BL-B3341Q

Abstract: BL-B4541Q R
Contextual Info: Absolute Maximum Ratings Chip Package T-1 Standard 1.0" Lead 3φ T-1 1.0" Lead 3φ T-1 1.0" Lead 3φ 1.0” Lead High Flangeless 3.4φ T-1 1.0” Lead High Flangeless 3.0φ T-1 1.0” Lead 3.0φ T-1 1.0” Lead 3.0φ T-1 Standard 1.0” Lead 3.1φ Part No.

Contextual Info: GLASS PASSIVATED RECTIFIERS 3 Ê L ili ^ U . — m Ia PLASTIC MATERIAL U SED C A R R IE S UL 94V-0 OPERATING AND STO RA GE T EM PERA TU RE RANGE : -65 "C to +175 °C TYPE Maximum Peak Reverse Voltage VpK A av | °C ‘K f i f f m t i A i t * . ii & iS t iii L _ § lX M $ 3 lf

32.768KHz TCXO, 0.2PPM

Abstract: BUF C145 C082 r057 CXD2951GH ED13 ED17 NMEA-0183 assisted-gps 1575.42Mhz oscillator
Contextual Info: CXD2951GH Single Chip GPS LSI Description The CXD2951GH is a dedicated single chip LSI for the GPS Global Positioning System , satellite-based location measurement system. This LSI enables the configuration of a single chip system providing a cost-effective, low-power solution.

C4154

Abstract: c3148 B1137 2WB77016 DSP DOS ec a063 PD77116 MDLDL intertools uPD77113
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社

L015

Abstract: L016 L017 L023 L024 L077 L078 uPD77016 uPD7716 uPD77017
Contextual Info: - Software GmbH - Atair Developer Studio – µPD77016 Assembler / µPD77016 Linker Plug-In User's Manual Atair Developer Studio – µPD77016 Assembler / µPD77016 Linker Plug-In User's Manual Copyright 2000-2001, Atair Software GmbH. All rights reserved.

L023

Abstract: IC020 l035 IF2G BUF C145 C082 l004 r057 CXD2951GA-2 EA11
Contextual Info: CXD2951GA-2 Preliminary Single Chip GPS LSI Description The CXD2951GA-2 is a dedicated single chip LSI for the GPS Global Positioning System , satellitebased location measurement system. This LSI enables the configuration of a single chip system providing a cost-effective, low-power solution.