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    LATTICE SEMICONDUCTOR TAPE AND REEL SPECIFICATION Search Results

    LATTICE SEMICONDUCTOR TAPE AND REEL SPECIFICATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    XPQR8308QB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 80 V, 350 A, 0.00083 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    XPQ1R00AQB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 300 A, 0.00103 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation

    LATTICE SEMICONDUCTOR TAPE AND REEL SPECIFICATION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    US mark

    Abstract: No abstract text available
    Text: Tape and Reel Specifications A tape-and-reel packing container is available for plastic leaded chip carriers to protect the product from mechanical/ electrical damage and to provide an efficient method for handling. Lattice Semiconductor’s tape-and-reel


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    PDF EIA-RS481. US mark

    Lattice PLSI

    Abstract: lattice semiconductor tape and reel
    Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for


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    PDF EIA-RS481. Lattice PLSI lattice semiconductor tape and reel

    16-mm

    Abstract: 16MM TAPE PACKAGE
    Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for


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    PDF EIA-RS481. 44-pin 84-pin 48-pin 100-pin 128-pin 176-pin 160-pin 16-mm 16MM TAPE PACKAGE

    LATTICE SEMICONDUCTOR Tape and Reel Specification

    Abstract: No abstract text available
    Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel


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    PDF EIA-RS481. moun481. 44-pin 68-pin 84-pin 28-pin 20-pin LATTICE SEMICONDUCTOR Tape and Reel Specification

    REELS

    Abstract: CABGA 56
    Text: Product Bulletin November 2010 #PB1240I Lattice Ordering Guidelines for Custom Product and Tape and Reel Introduction Lattice “Custom Products” include the following: • Factory Pre-Programming Encryption & Non-Encryption  Custom Processing (Including custom testing, restricted material set, custom product


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    PDF PB1240I 20-Pin 24-Pin 1-800-LATTICE REELS CABGA 56

    Untitled

    Abstract: No abstract text available
    Text: iCE40LM Family Data Sheet DS1045 Version 1.2, March 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as


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    PDF iCE40LM DS1045 DS1045

    Untitled

    Abstract: No abstract text available
    Text: iCE40LM Family Data Sheet DS1045 Version 1.3, March 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as


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    PDF iCE40LM DS1045 DS1045

    LATTICE SEMICONDUCTOR Tape and Reel Specification

    Abstract: No abstract text available
    Text: iCE40LM Family Data Sheet DS1045 Version 1.4, August 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as


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    PDF iCE40LM DS1045 DS1045 LATTICE SEMICONDUCTOR Tape and Reel Specification

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.7, October 2013 iCE40 LP/HX Family Data Sheet Introduction October 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device


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    PDF iCE40â DS1040 iCE40 DS1040 iCE40-1K iCE40LP/HX1K iCE40LP640

    TFK 7 segment displays

    Abstract: TFK 609 7-segment display tfk "seven segment display" tfk tfk 648 TFK BPW 41 N smd code marking Ld50 tfk 605 TFK 7 segment d 350 28 tfk 727
    Text: LEDs and Displays Data Book 1996 TELEFUNKEN Semiconductors Contents General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Selector Guide – Alphanumeric Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.8, February 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode  Flexible Logic Architecture


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    PDF iCE40â DS1040 iCE40 DS1040 iCE40-1K iCE40LP/HX1K iCE40LP640 iCE40LP1K

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.5, August 2013 iCE40 LP/HX Family Data Sheet Introduction August 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device


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    PDF iCE40â DS1040 iCE40 DS1040 Distribut2013

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.4, July 2013 iCE40 LP/HX Family Data Sheet Introduction July 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture


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    PDF iCE40â DS1040 iCE40 DS1040

    LATTICE SEMICONDUCTOR Tape and Reel Specification

    Abstract: LVDS25E 0.4mm pitch BGA routing ICE40 FPGA pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.3, May 2013 iCE40 LP/HX Family Data Sheet Introduction April 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture


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    PDF iCE40TM DS1040 iCE40 DS1040 LATTICE SEMICONDUCTOR Tape and Reel Specification LVDS25E 0.4mm pitch BGA routing ICE40 FPGA pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm

    ICE40 lattice

    Abstract: ICE40 FPGA 0.4mm pitch BGA routing TN1251 ICE40LP1K ICE40LP1K-CM36 GDDR71 pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm ICE40LP384SG32
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.2, April 2013 iCE40 LP/HX Family Data Sheet Introduction April 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture


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    PDF iCE40TM DS1040 iCE40 DS1040 ICE40 lattice ICE40 FPGA 0.4mm pitch BGA routing TN1251 ICE40LP1K ICE40LP1K-CM36 GDDR71 pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm ICE40LP384SG32

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 02.9, April 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features  Flexible Logic Architecture – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode


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    PDF iCE40â DS1040 iCE40 DS1040 LP384

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX Family Data Sheet DS1040 Version 3.0, July 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features  Flexible Logic Architecture – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode


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    PDF iCE40â DS1040 iCE40 DS1040 iCE40LP1K.

    DS1047

    Abstract: No abstract text available
    Text: MachXO3L Family Data Sheet Advance DS1047 Version 00.2, February 2014 MachXO3L Family Data Sheet Introduction February 2014 Advance Data Sheet DS1047 Features  Solutions • • • • • • • • • • Smallest footprint, lowest power, high data


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    PDF DS1047 DS1047

    LCMXO2-256 pinout

    Abstract: No abstract text available
    Text: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.2, April 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 


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    PDF DS1035 DS1035 LCMXO2-256 pinout

    LCMX02

    Abstract: LCMX02 1200 LCMXO2-1200HC-4TG144C LCMXO2-4000HC LCMXO2-1200HC-4MG132C lcmxo2-1200 TQFP-144 footprint LCMXO2-7000HC LCMXO2-640HC-4TG100C LCMX02-2000
    Text: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 


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    PDF DS1035 DS1035 MachXO2-2000 MachXO2-1200-R1 LCMX02-2000UHE4FG484I, LCMX02-2000UHE-5FG484I, LCMX02-2000UHE-6FG484I. AN8086, LCMX02 LCMX02 1200 LCMXO2-1200HC-4TG144C LCMXO2-4000HC LCMXO2-1200HC-4MG132C lcmxo2-1200 TQFP-144 footprint LCMXO2-7000HC LCMXO2-640HC-4TG100C LCMX02-2000

    Untitled

    Abstract: No abstract text available
    Text: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 


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    PDF DS1035 DS1035 MachXO2-2000 MachXO2-1200-R1 LCMX02-2000UHE4FG484I, LCMX02-2000UHE-5FG484I, LCMX02-2000UHE-6FG484I. AN8086,

    machxo3

    Abstract: No abstract text available
    Text: MachXO3L Family Data Sheet Advance DS1047 Version 00.3, May 2014 MachXO3L Family Data Sheet Introduction May 2014 Advance Data Sheet DS1047 Features  Solutions • Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications


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    PDF DS1047 DS1047 WLCSP81, CABGA324, CABGA400 WLCSP49, machxo3

    LCMX02

    Abstract: LCMXO2-4000 LCMX02 1200 LCMX02-2000 LCMXO2-7000HC-4TG144 HB1010 LCMXO2-1200HC-4MG132C LCMXO2 verilog HDL program to generate PWM XO2-640
    Text: MachXO2 Family Handbook HB1010 Version 01.9, September 2011 MachXO2 Family Handbook Table of Contents September 2011 Section I. MachXO2 Family Data Sheet Introduction Features . 1-1


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    PDF HB1010 TN1204 TN1205 TN1199 LCMX02 LCMXO2-4000 LCMX02 1200 LCMX02-2000 LCMXO2-7000HC-4TG144 LCMXO2-1200HC-4MG132C LCMXO2 verilog HDL program to generate PWM XO2-640

    Untitled

    Abstract: No abstract text available
    Text: iCE40 LP/HX/LM Family Handbook HB1011 Version 01.2, November 2013 iCE40 LP/HX/LM Family Handbook Table of Contents October 2013 Section I. iCE40 LP/HX Family Data Sheet Introduction Features . 1-1


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    PDF iCE40â HB1011 iCE40 TN1251