LCC CERAMIC CAPACITOR Search Results

Contextual Info: LCC Series - Large Size Multilayer Ceramic Chip Capacitors Holy Stone Multilayer Ceramic Chip Capacitors [ Large Size Ceramic Chip Capacitors ] LCC Series Features Applications Voltage Multipliers Power Supplies DC-DC Converters Surge protection Industrial control circuits

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit U VEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 8 Megabit UVEPROM MICROSYSTEMS DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit UVEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

12 SQ 045 JF

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

FT27C256R

Abstract: AT27C256 CDIL28
Contextual Info: Features • Fast Read Access Time • Low-Power CMOS Operation • • • • • • • – 100 µA max. Standby – 20 mA max. Active at 5 MHz JEDEC Standard Packages – 28-Lead 600-mil Ceramic – 32-Lead Ceramic LCC +Ceramic Custom 5V ± 10% Supply

Contextual Info: DENSE-PAC 0.5 Megabit UVEPROM MICROSYSTEMS DPV32X16A DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of tw o 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

Contextual Info: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs

Contextual Info: DENSE-PAC 2 Megabit UVEPROM MICROSYSTEMS DPV128X16A DESCRIPTION: The D P V 128X 16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: □PM DPV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DPV64X16A Dense-Pac Microsystems, Inc. 64KX 16 UVEPROM PGA MODULE O PRELIMINARY DESCRIPTION: The DPV64X16A is a 40-pin Pin Grid Array PGA consisting of two 64K X 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: □PM * r ~ T DPV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

A143

Abstract: A140 A141 DPV3232V "32K x 32" SRAM
Contextual Info: DPV3232V Dense-Pac Microsystems. Inc. ^ 32K X 32 UVEPROM VERSAPAC DESCRIPTIO N : The DPV3232V is a 66-pin Pin Grid Array PGA consisting o f four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

Contextual Info: DPS8X16A Dense-Pac Microsystems, Inc. HIGH SPEED 8K X 16 CMOS SRAM PCA MODULE O PRELIMINARY DESCRIPTION: The DPS8X16A is a 40-pin Pin Grid Array PGA consisting of two 8K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DPV12832VA H IGH SPEED 128K X 32 UVEPRO M VERSAPAC Microsystems, Inc. 0 DESCRIPTION: The D PV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 4 Megabit CMOS UVEPROM DPV12832VA M I C R O S Y S T E M S DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X8 CMOS UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal

20-PAD

Abstract: 26LS32 pin diagram
Contextual Info: DENSE-PAC LOGIC MODULE MICROSYSTEMS 36-PIN PGA LOGIC DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired ceramic substrate. The 36 pins of the LOGIC M ODULE are

Contextual Info: FTS88130 128Kx8 High Speed SRAM FEATURES Advanced CMOS Technology Fast tOE Automatic Power Down Packages —32-Pin 300 mil DIP and SOJ —32-Pin 400 mil SOJ —32-Pin 600 mil Ceramic DIP —32-Pin 400 mil Ceramic DIP —32-Pin Solder Seal Flatpack —32-Pin LCC 400 x 820 mil [Two-Sided]

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

Capacitor 0.01 uF

Contextual Info: HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL and ASL1 7.0 x 5.08 x 1.8 mm FEATURES: • • • • Leadless chip carrier LCC , Low profile. HCMOS and TTL compatible. Tristate Enable / Disable function. Reflow capable. • APPLICATIONS:

Contextual Info: 5.0 Vdc HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL and ASL1 7.0 x 5.08 x 1.8 mm FEATURES: • • • • Leadless chip carrier LCC , Low profile. HCMOS and TTL compatible. Tristate Enable /Disable function. Reflow capable.

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPRO M DPV3232VA D ESC R IP T IO N : The D PV 3232V A is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs