SOT644 Search Results

Contextual Info: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B b y ∅w M C N M L K e J H e2 G F E D C B A ball A1 index area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA144 package SOT644-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

LFBGA144

Abstract: MO-205 sot644
Contextual Info: PDF: 2000 Oct 17 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.90 mm SOT644-1 B D A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A N M L e K J

LFBGA144

Abstract: MO-205
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b y1 C y ∅w M C N M L K e