MICROMODULES Search Results

200B

Abstract: 24LC01B 24LC02B DK-2750 RG41
Contextual Info: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

24LC08B

Abstract: 200B 24LC16B
Contextual Info: M 24LC08B/16B MODULES 8K/16K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V

SMARTCARD micromodule assembly

Contextual Info: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

SMARTCARD micromodule assembly

Abstract: emv 7816 smartcard
Contextual Info: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

SMARTCARD micromodule assembly

Abstract: sgs thomson ST14C04C
Contextual Info: MICROMODULES SMART CARD IC’s EMBEDDING PROCESS BRIEF DATA INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

24LC02B Modules

Contextual Info: 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules CROCHIP FEATURES ISO MODULE LAYOUT • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 1 0 ^ standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

24LC02B Modules

Abstract: 24lc01b 200B 24LC02B 24LC01B Modules I2C EEPROM 1kbit
Contextual Info: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

Contextual Info: 24LC08B/16B MODULES M ic r o c h ip 8K/16K I 2C Serial EEPROMs in ISO Micromodules FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical

ISO 14443-1

Abstract: SMARTCARD micromodule assembly MICROMODULES SMARTCARD micromodule ST16R820 ST16RF52 ST16RF58 ST19RF08
Contextual Info: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

MIL-STD 833 test method 3015

Abstract: ST1305 M14C04 M14C16 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336
Contextual Info: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip

microtune tuner module

Abstract: MT1530 microtune MT1230
Contextual Info: M I C R O T U N E CABLE MODEM AND DIGITAL APPLICATIONS 4900 SERIES RF TUNER MICROMODULES APPLICATIONS • Cable modems CM • Cable telephony • Digital cable systems FEATURES • Input frequency ranges: 50 MHz to 860 MHz (US) 70 MHz to 862 MHz (EU)

SMARTCARD micromodule assembly

Abstract: MICROMODULES SMARTCARD ST16CF54 ST16SF42 ST16600 ST16601 ST16SF41 ST16SF44 ST16SF48
Contextual Info: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

Contextual Info: 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules C R O C H IP FEATURES ISO MODULE LAYOUT • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 nA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

Contextual Info: M 24LC08B/16B MODULES ic r o c h ip 8K/16KI2C Serial EEPROMs in ISO Micromodules ISO MODULE LAYOUT FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology V dd - 1 mA active current typical

D68 package information micromodule

Abstract: MICROMODULES T4X diode uv-tape SO20 TQFP44
Contextual Info: SMARTCARD MCU Ordering Information For Package And Delivery DATA BRIEFING INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – micromodules, – flat packages, – wafers.

SMARTCARD micromodule assembly

Abstract: ST14C02 M14C04 M14C16 M14C32 M14C64 ST1200 ST1305B ST1331 ST1333
Contextual Info: SUPER 35 MM MICROMODULES Super 35 mm Micromodules for Smartcards and Memory Cards DATA BRIEFING • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side 1 1 1 1 1 1 – Support for the chip

2702 eprom

Abstract: ST1305B ST1331 ISO/IEC 7816-1 micromodule MICROMODULES M14C04 M14C16 ST1200 ST1333
Contextual Info: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip

SMARTCARD micromodule assembly

Abstract: stmicroelectronics traceability ST16RF42 MICROMODULES ST16600 ST16CF54B ST16RF58 ST16SF41 ST16SF42 ST16SF44
Contextual Info: Micromodules for Smartcards SECURITY AND TRACEABILITY Security is the key issue for all Smartcards, The security provided by STMicroelectronics extends from chip design to wafer fabrication and now includes micromodule assembly and final testing. All based

040-305

Abstract: 24lc08b 24LC16 200B 24LC16B DK-2750 RG41 tray drawing
Contextual Info: M 24LC08B/16B MODULES 8K/16K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V

SMD CAPACITORS color code

Abstract: RRM12B ECRKN030G61 ECRKN010 ECRKN ECRKN020 XN400 ECRKN020E61 N1200 ECRKN030G
Contextual Info: Adjustable pre-set Ceramic Capacitors(Series K) Chip Type Adjustable(pre-set) Ceramic Capacitors K Series: Series K is 3 mm square, surface mounting device. n Recommended Applications n Features l Hybrid IC and micromodules l Portable radios and cassette tape players

ET-7

Abstract: ecrkn030g61
Contextual Info: Adjustable pre-set Ceramic Capacitors(Series K) Chip Type Adjustable(pre-set) Ceramic Capacitors Series: K Series K is 3 mm square, surface mounting device. n Recommended Applications n Features l Hybrid IC and micromodules l Portable radios and cassette tape players

SMARTCARD micromodule assembly

Abstract: stmicroelectronics traceability MICROMODULES ST16RF42 ST16600 ST16601 ST16R820 ST16RF58 STMicroelectronics TRACEABILITY code ST16SF42
Contextual Info: Micromodules for Smartcards SECURITY AND TRACEABILITY Security is the key issue for all Smartcards, The security provided by STMicroelectronics extends from chip design to wafer fabrication and now includes micromodule assembly and final testing. All based

U2740B-FP

Abstract: NPN planar RF transistor 16 bit ic rf encoder programmable read write transponder transistor C892 e5550F-S8 M44C0W RF ENCODER RF 125khz receiver ir preamplifier
Contextual Info: Tem ic S e m i c o n d u c t o r s Selector Guide Remote Control Part Number Function Key Features Package IR Transm itter / Receiver BPV23NF PIN diode IR photo detector, 875 to 950 nm, sensitivity typical 65 ^A TSHA520. IR emitter family High efficiency, ± 12°, 875 nm

7816 GPIO

Abstract: 7816 SMARTCARD spi 7816 ST19NA18 st19wl34 SO20 ST19 ST19WSC8 ST22
Contextual Info: Smartcard ICs for pay-TV Conditional access and content protection STMicroelectronics is the world’s leading supplier of ICs for pay-TV and conditional access, and has extensive experience supplying 8- and 32-bit secure microcontrollers for conditional access to pay-TV solution providers. ST’s latest solutions are