NSI 230 Search Results

84C30A

Abstract: 051b3
Contextual Info: Full Duplex S4C30A 4-Port Technology Incorporated Ethernet Controller PRELIMINARY April 19, 1996 Features • ■ Note: Check for latest Data Sheet revision before starting any designs. Low Power CMOS Technology ■ Meets A NSI/IEEE802.3 and ISO 8802-3 Standards

Contextual Info: m MULTI-LAYER 8 1 VARISTOR FEATURES * ^ Ex ce lle nt c lam pi n g ratio High t r a nsie nt cu rrent c apa bi l it y Low work ing v o lta ge Small s i z e fr o m 0402 to 0603 ESD and tra nsi ent pro te c ti o n Fast res pon se to the rapidly increase voltage(ns)

SLTA-10 Serial LonTalk Adapter

Abstract: MIP 282 SLTA-10 circuit Integer numerique cmd SLTA la 78040 d 78040 EIA-282 SLTA-10 Adapter EIA-232
Contextual Info: SLTA-10 Adapter and PSG/3 User’s Guide Revision 3 e ECHELON’ Corporation 078-0160-OlE Echelon, LON, LonTalk, LonBuilder, NodeBuilder, Neuron, LonManager, LONMARK, LonMaker, LONWORKS, 3120 and 3150 are registered trademarks of Echelon Corporation. LonSupport

TLA301

Abstract: TLA100-3E TLA601 TLA402S TDK 035 U 111 B IEEE882
Contextual Info: Data Communication Interface Devices PULSE TRANSFORMERS FOR LAN TLA AND CIT SERIES TEMPERATURE RANGE_ Operating 0 to 70°C 0 to 158°F] Storage_- 4 0 to + 1 0 0 °C [-4 0 to +212°F] Series Shapes and dimensions (mm [Inches) ±0.25 [.010]

electrical data sheet

Contextual Info: M INIA TURE FUSEHOLDERS INIATURE Holder / No. 265 PC Mount, 5x20mm Fuses Specifications Mounting O BS 4mm Cap depth E T E L O For direct soldering to PC Boards. Leads should not be twisted or bent closer than 3mm from the cap. Sharp bending of the leads can cause mechanical weakness followed by breaking of the leads.

Intel 4001

Abstract: p4 atx 400w ic 555 specification for AM tansmitter MSIA 1022 gigabyte 945 motherboard power supply diagram gigabyte 945 motherboard ram control ic 12v 400W AUDIO AMPLIFIER CIRCUIT DIAGRAM pec 730 pn sequence generator using jk flip flop SOSSAMAN
Contextual Info: Intel 3100 Chipset Datasheet October 2008 Order Number: 313458-007US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Contextual Info: SIEMENS BPW 34 SILICON PIN PHOTODIODE FEATURES Maximum Ratings * Large Active Area Photodiode O perating and Storage Tem perature Range T0P, T stg . - 4 0 ° to +80°C • Silicon PIN Planar Photodiode Soldering Tem perature (2 mm trom case bottom ) (Ts) t< 3 s . .230°C

LE3100

Abstract: kbc 1098 pmb 7850 Intel core i7 0300LS Socket AM2 delta wireless doorbell IC 501 south bridge SIS 968 MOTHERBOARD pcb CIRCUIT diagram intel core 2 duo e7500
Contextual Info: Intel 3100 Chipset Datasheet June 2007 Order Number: 313458-004US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

R36 281-01

Abstract: lt 7216 power one pmp 7.24 sic NCP 1077 12v 400W AUDIO AMPLIFIER CIRCUIT DIAGRAM Analog devices marking Information I60 Socket AM2 775 MOTHERBOARD CIRCUIT diagram south bridge SIS 968 PC intel 945 MOTHERBOARD CIRCUIT diagram
Contextual Info: Intel 3100 Chipset Datasheet June 2007 Order Number: 313458-004US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

UVA photodiode

Abstract: SFH291 SFH 291 UV diode 250 nm
Contextual Info: SIEMENS SFH 291 SILICON PHOTODIODE HIGH UV SENSITIVITY Package Dimensions in Inches mm FEATURES Maximum Ratings * Anode Marking: Tab at Package Bottom Operating and Storage Temperature Range (TOP, Tgtg) .- 40° to +80”C Soldering Temperature (2 mm from case bottom) (Ta,tS3 s . .230°C

BP104F

Abstract: BP photodiode
Contextual Info: 5835 SIEMENS *BP 104F SURFACE MOUNT BP 104FS SILICON PIN PHOTODIODE DAYLIGHT FILTER Package Dimensions in Inches mm .0 4 3 ( 1. 1) . 2 1 2 ( 5 .4 ) .0 4 3 ( 1. 1) ' .0 3 5 ( 9 ) .0 4 7 ( 1.2 ) .012 (. 3 ) .024 (. 6) 016 (. 4 )" Photosensitive q— p / a rea=A

RCA 16299

Abstract: PE 33632 RCA 39535 intel chipset 845 motherboard repair ATC 23172 B65550 k 3919 Socket AM2 ero 1831 intel chipset 845 motherboard repair circuit
Contextual Info: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-003US August 2009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

TDA 3619

Abstract: gcu 101 setting manual
Contextual Info: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-001US July 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Ethernet to HDLC

Abstract: TRACE INVERTER MODEL 2524 BOSCH 30343 intel chipset 845 motherboard repair circuit pmi op 05 e 7702 bosch can 2.0A PE 33632 Socket AM2 AM3 motherboard repair intel chipset 945 motherboard repair
Contextual Info: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-003US August 2009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Siemens photodiode

Abstract: silicon photodiode array Photodiode Array 7SO8
Contextual Info: SIEMENS AK TIE NGE S E LL S C H A F 47E D • ô23SbGS S IE M E N S DG2744Ô b ■ SIEG KOM 0622033 A 6-CHIP SILICON PHOTODIODE ARRAY LOW DARK CURRENT -^ -^ -5 5 Outline Drawing Dimensions mm PC board Frame C h ip Seal | «— 'o r ' o' DESCRIPTION The KOM 0622033 A is a 6 chip photodiode

Contextual Info: M INIA TURE FUSEHOLDERS INIATURE Plug-on Cap / No. 265 WICKMANN PC Mount, 5x20mm Fuses Specifications Mounting For direct soldering to PC Boards. Leads should not be twisted or bent closer than 3mm from the cap. Sharp bending of the leads can cause mechanical weakness followed by breaking of the leads.

B744

Contextual Info: S I E M EN S A K T I E N G E S E L L S C H A F 47E D • ô 2 3 S b G S D G B 7 44 Ô b « S I E û S IE M E N S KOM 0622033 A 6-CHIP SILICON PHOTODIODE ARRAY LOW DARK CURRENT Outline Drawing Dimensions mm P C b o a rd F ra m e C h ip Seal 25.5 2 4 .5 ' 13.5 _

Contextual Info: TH I S DRAW I NG I S UNPUBL I SHED. IE LEA SED FOR P U B L I CAT ION iy Tyco COPYRI G HT Electronics R E V IS IO N S N e d e r I an < ALL RIGHTS RESERVED. D E S C RI P TI O N NOTES: 20MAR06 / î\ POSITION NR. 1A /4\ FO R LEN G TH ~L" S E E D A SH N U M B ER T A B L E

Siemens photodiode visible light

Abstract: SFH 212 T018 T-2856
Contextual Info: SIEMENS AKTIEN6ESELLSCHAF 47E D 0235b05 002?4b7 T • S I E G SIEMENS SFH 212 SILICON PHOTODIODE VERY LOW DARK CURRENT FEATURES Maximum Ratings * Package: 18 A3 DIN 41870 TO18 , G lass Lens, Hermetically Sealed Package, Solder Tabs, Lead Spacing 2.54 mm (1/«0

Contextual Info: TH I S D R A W I NG IS UNPUBL I SHED. IELEASED F OR iy Tyco COPYRI G HT P U B L I C A T I ON Electronics R E V I S I O N S N e d e r I an< ALL RIGHTS RESERVED. D E S C RI P TI O N NOTES: 20MAR06 TVS POSITION NR. 1A 4 \ FOR LEN G TH ~L" S E E D A SH N U M B ER T A B L E

Contextual Info: SIEMENS SFH235 SILICON PIN PHOTODIODE DAYLIGHT FILTER P a cka g e D im e n s io n s in In c h e s m m Cathode .024 (0.6) .016(0.4) r J _ .020 (0.5) .012(0.3) . 071 (1.8) .047(1.2) J 1 .100 (2 54) 122 (3.1) _ .106(2.7) .043(1.1) .028 (0.7) FEATURES Maximum Ratings

Siemens photodiode BPW32

Abstract: BPW32 Siemens photodiode visible light
Contextual Info: SIEMENS BPW32 SILICON PHOTODIODE VERY LOW DARK CURRENT Package Dimensions in Inches mm Chip position 024 (.6 ) .016 (. 4 ) 1 FEATURES * Silicon Planar Photodiode * N-Si Material: Anode=Front Contact, Cathode=Back Contact * High Reliability * No Testable Degradation

Contextual Info: SFH216 Silicon PIN Photodiode Dimensions in inches mm .291 (7.4) .259 (6.6) .571 ( 14.51 . 492 ( 12.5) 0.100 2.54) ,208 (S.3\ .197 (5.0) rs ' _L ( Cathode A .018 (0.45) .106 T 0.189(4.8) e n 81 (4.6) Glass Lens (2.7) Chip Location .220 ( 5.6), .208 (5.3)

74LS

Abstract: CD4015BC CD4015BCM CD4015BCN M16A MS-001 N16E
Contextual Info: Revised January 1999 EMICONDUCTGRTM General Description Features T h e C D4015BC contains tw o identical, 4-stage, serialinput/parallel-output registers w ith independent “ Data” , “C lock,” and “ Reset” inputs. T he logic level present at the