PACKAGE TSOP1 Search Results

SAMSUNG 834

Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

SAMSUNG 834

Abstract: pcb design 0,5 mm pitch STD130
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

pcb design 0,5 mm pitch

Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

WED3DG64126V-D2

Contextual Info: WED3DG64126V-D2 1GB- 128Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG64126V is a 128Mx64 synchronous DRAM module which consists of sixteen 64Mx8 SDRAM components in TSOP11 package and one 2K EEPROM in an 8- pin TSSOP package for

WED3DG6434V-D2

Contextual Info: WED3DG6434V-D2 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6434V is a 32Mx64 synchronous DRAM module which consists of sixteen 16Mx8 SDRAM components in TSOP11 package and one 2K EEPROM in an 8- pin TSSOP package for

WED3DG6463V-D2

Contextual Info: WED3DG6463V-D2 512MB- 64Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6463V is a 64Mx64 synchronous DRAM module which consists of sixteen 32Mx8 SDRAM components in TSOP11 package and one 2K EEPROM in an 8- pin TSSOP package for

A 11101

Abstract: WED3DG7217V-D2
Contextual Info: WED3DG7217V-D2 128MB- 16Mx72 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7217V is a 16Mx72 synchronous DRAM module which consists of nine 16Meg x 8 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package

Contextual Info: WED3DG6417V-D1 128MB- 16Mx64 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6417V is a 16Mx64 synchronous DRAM module which consists of four 16Meg x 16 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package

TDS05160

Abstract: TDS05150 TDS03160 TDS03150 TDSR5150 9999 DIODE tsop1736 TLU02401 BPW2 silver ag wire Bond
Contextual Info: V I^ W Y Vishay Telefunken Table of Package Forms Part Number Package Form Part Number Package Form Part Number Package Form TLBR5410 8 TLHR4401 11 TLMH3100 1 TLDR4400 11 TLHR4405 11 TLMH3101 1 TLDR4900 11 TLHR4600 11 TLMK3100 1 TLDR5400 TLDR5800 8 TLHR4601

WED3DG6416V-D1

Contextual Info: WED3DG6416V-D1 128MB- 16Mx64 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6416V is a 16Mx64 synchronous DRAM module which consists of eight 8Meg x 16 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package

Contextual Info: WED3DG7216V-D1 128MB- 16Mx72 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7216V is a 16Mx72 synchronous DRAM module which consists of nine 16Meg x 8 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package

OTA datasheet for 32v for aerospace

Abstract: WED3DG7216V-D1
Contextual Info: WED3DG7216V-D1 128MB- 16Mx72 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7216V is a 16Mx72 synchronous DRAM module which consists of nine 16Meg x 8 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package

TSAL62

Abstract: TSOP2838 IR TSOP1838 Telefunken ir receiver 38 TSOP1838 "ir reciever" ir tsal62 TSOP1856 TSOP1836
Contextual Info: VISH A Y Vishay Telefunken T Receiver for IR-Remote Control continued Package Dim. Fig- Type Features fQ (kHz) IR Receiver for Standard A pplication in Small Package 74 1 = Out; 2 = GND; 3 = Vs 74 ^ 3 1 = Out; 2 = Vs; 3 = GND TSOP1830 TSOP1830SS3V 30 TSOP1833

Contextual Info: WED3DG649V-D1 64MB- 8Mx64 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG649V is a 8Mx64 synchronous DRAM module which consists of four 8Meg x 16 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package for Serial Presence Detect which are mounted on a 144 Pin SODIMM multilayer FR4 Substrate.

K6X1008C2D-GF55

Abstract: k6x1008c2d-pf55 K6X1008C2D-GF70 k6x1008c2d-bf55 K6X1008C2D-DF55 K6X1008-C2D-BF55 K6X1008C2D-BF70 samsung k6x1008c2d K6X1008C2D-TF70 K6X1008C2D
Contextual Info: K6X1008C2D Family CMOS SRAM Document Title 128Kx8 bit Low Power CMOS Static RAM Revision History Revision No. History Draft Data Remark 0.0 Initial draft July 15, 2002 Preliminary 0.1 Revised - Deleted 32-TSOP1-0820R Package Type. - Added Commercial product.

Contextual Info: TSOP11. Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP11. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

TSOP12238YA1

Contextual Info: TSOP12238YA1 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP12238YA1 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

Contextual Info: TSOP19238 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP19238 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

TSAL6200

Abstract: TSOP18238
Contextual Info: TSOP18238 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP18238 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

TSOP14836

Abstract: TSOP1-48 TSAL6200 TSOP148 TSOP14833 TSOP14838 TSOP14840
Contextual Info: TSOP148. Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP148. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

K6X1008C2D-GF70

Abstract: K6X1008C2D-PQ701 55ns K6X1008C2D K6X1008C2D-DF55 K6X1008C2D-GF55 K6X1008C2D-TF70 K6X1008C2D-B K6X1008C2D-F K6X1008C2D-Q
Contextual Info: K6X1008C2D Family CMOS SRAM Document Title 128Kx8 bit Low Power CMOS Static RAM Revision History Revision No. History Draft Data Remark 0.0 Initial draft July 15, 2002 Preliminary 0.1 Revised - Deleted 32-TSOP1-0820R Package Type. - Added Commercial product.

Contextual Info: TSOP14838 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP14838 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

Contextual Info: TSOP12238 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP12238 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

Contextual Info: TSOP12. Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP12. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.