SO-14 PADS LAYOUT Search Results

schematics for a PA amplifier

Abstract: TQM613025 design of multi section directional coupler TQM613026 qualcomm rft
Contextual Info: TQM613026 Application Note Application Note for TQM613026 Power Amplifier-Duplexer Product TQM613026 TABLE OF CONTENTS • 1.0 Description • 2.0 Product Block Diagram and Operation • 3.0 Recommended Handset Schematic and Layout Considerations • 3.1 DC Block Recommendations

jedec package MO-247

Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Contextual Info: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB

Contextual Info: Freescale Semiconductor Application Note AN3964 Rev. 2.0, 4/2013 MC13892 Layout Guidelines 1 Purpose This document is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system. 2 Scope This document contains the packaging and recommended

AN3964

Abstract: battery drill charger MC13892JVK 500E9 MC13892 MC13892VK MC13892VL CLK32KM
Contextual Info: Freescale Semiconductor Application Note AN3964 Rev. 1.0, 3/2010 MC13892 Layout Guidelines By: Jorge Ramirez 1 Purpose This document is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system. 2 Scope

IBM 750L

Abstract: 750FX PowerPC 750FX IBM750FX Signal Path designer
Contextual Info:  Application Note PowerPC 750FX Power Supply Layout and Bypassing Abstract This Note describes power and ground connectivity, and bypass capacitor selection and placement, for the IBM 750FX microprocessor. Proper selection and placement of the power supply bypass caps is critical for the correct operation of

fbga Substrate design guidelines

Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
Contextual Info: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB

capacitive level sensor

Abstract: capacitive touch sensor pcb guideline finger print using labview capacitive touch slider Capacitive PCB capacitive touch sensor labview 3M Touch Systems Capacitive Guidelines touch switch with pcb layout finger print sensor pcb with circuit
Contextual Info: AN 19.16 Physical Design and Layout Guidelines for Capacitive Sensor Systems 1 Overview SMSC’s capacitive sensor family provides systems with a wide variety of slider, button, and LED driver functionality. This application note describes design and printed circuit board PCB layout techniques

84-1LMI

Abstract: XP1018 XU1004
Contextual Info: 35.0-45.0 GHz GaAs MMIC Power Amplifier P1018 October 2005 - Rev 21-Oct-05 Features Chip Device Layout Excellent Transmit Output Stage Output Power Adjust 23.0 dB Small Signal Gain +25.0 dBm P1dB Compression Point 100% On-Wafer RF, DC and Output Power Testing

s2083

Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Contextual Info: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder

p950003

Abstract: aasupreme ESMIT 4180 aasupreme P950003 73M1906 73M1966B tg-utb01543s 4181 sumida 73M1916-20 UTB01543S
Contextual Info: A Maxim Integrated Products Brand 73M1866B/73M1966B MicroDAA with PCM Highway APPLICATION NOTE AN_1x66B_003 October 2009 73M1866B/73M1966B Schematic and Layout Guidelines Introduction This application note provides layout recommendations that must be followed when integrating the 73M1866B

84-1LMI

Abstract: P1017
Contextual Info: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017 September 2005 - Rev 01-Sep-05 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3

P1017

Abstract: P1017-BD DM6030HK TS3332LD XP1017 XP1017-BD XP1017-BD-000V XP1017-BD-EV1 32H2BA0070
Contextual Info: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017-BD August 2007 - Rev 09-Aug-07 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3

p1017

Contextual Info: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017 September 2005 - Rev 01-Sep-05 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3

s2083

Abstract: s2083 application jedec package MO-220 68 PQFN IPC-SM-782 M570 MO-220 S2082
Contextual Info: Surface Mount Instructions for PQFN Packages S2083 V5 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil

PCB layout guidelines for NXP MCUs in BGA packages

Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

0.65mm pitch BGA

Abstract: OMAP35x
Contextual Info: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual

AN10373

Abstract: pci pcb layout
Contextual Info: AN10373 PCI Express PHY PCB Layout Guideline Rev. 01 — 30 April 2005 Application note Document information Info Content Keywords pcb, layout, symmetry, loss, jitter Abstract This document provides a practical guideline for incorporating the PCI Express PHY IC layout into the PCB design.

AN111

Abstract: scotchbrite eraser APP1110 dremel
Contextual Info: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: PCB, circuit board, prototype Jun 14, 2002 APPLICATION NOTE 1110 Prototyping with Surface Mount Devices Abstract: Surface mount devices can often be prototyped without etched PCBs by using plain copperclad and

M1000

Abstract: 40BRFM0058 mmic MIXER 210 84-1LMI XM1000
Contextual Info: 32.0-46.0 GHz GaAs MMIC Balanced Mixer November 2005 - Rev 21-Nov-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010

Contextual Info: MASW-011021 HMICTM Silicon PIN Diode SPDT Switch 6 - 14 GHz Features •          Rev. V1 Die Bond Pad Layout Specified from 8 GHz to 12 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance

M1000

Contextual Info: 32.0-46.0 GHz GaAs MMIC Balanced Mixer November 2005 - Rev 21-Nov-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010

M1000

Contextual Info: 32.0-46.0 GHz GaAs MMIC Balanced Mixer August 2005 - Rev 04-Aug-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010

M1000

Abstract: M1000/SUPER5-KIT/SCC
Contextual Info: 32.0-46.0 GHz GaAs MMIC Balanced Mixer April 2005 - Rev 30-Apr-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010