SOLDER PASTE, INDIUM, TYPE 3 Search Results

Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

lf 12201

Abstract: Solder Paste, Indium, Type 3
Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

fujitsu relay 57d24

Abstract: 57D24-N
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—12 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other

Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES l High power contact capacity (carrying current: 40 A/10 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l RoHS compliant since date code: 0627

Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES NO High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l l RoHS compliant since date code: 0627

relay power door 24V 582D24-Y

Abstract: 582D24-Y 582D24 y
Contextual Info: COMPACT POWER RELAY 1 POLE X 2—12A 28VDC (FOR 24V BATTERY AUTOMOTIVE APPLICATIONS) FBR572, 582 SERIES RoHS compliant n FEATURES Two independent relays mounted in a single package (43% of the volume of the two FRL-270 relays) l High current contact capacity

LGA voiding

Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
Contextual Info: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal

C4493

Contextual Info: Advance Product Information Sept. 1, 2004 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD Key Features TGA2925 • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 37.5 dBm Nominal Psat Internally Partially Matched IMD3 -50 dBc @ 24 dBm SCL, Typical

relay power door 24V 582D24-Y

Abstract: 572ND24-N SPDT relay rl1
Contextual Info: COMPACT POWER RELAY 1 POLE X 2—12A 28VDC (FOR 24V BATTERY AUTOMOTIVE APPLICATIONS) FBR572, 582 SERIES RoHS compliant n FEATURES Two independent relays mounted in a single package (43% of the volume of the two FRL-270 relays) l High current contact capacity

Rogers RO4003 substrate

Contextual Info: Advance Product Information October 6, 2004 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD\SG Key Features TGA2925 • • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 3%EVM @27dBm OFDM signal at 3.5GHz 37.5 dBm Nominal Psat

EPU 610

Contextual Info: Advance Product Information January 12, 2005 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD\SG Key Features TGA2925 • • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 3%EVM @27dBm OFDM signal at 3.5GHz 37.5 dBm Nominal Psat

HUGHES mcw 550

Abstract: hughes welder welder hughes mcw 550 ECCOBOND 56c SN62PRMAB3 relative permittivity beryllium copper ferrite welder ECCOBOND 300 kester Re SOLDER PASTE mcw-550
Contextual Info: Ferrodisc and Drop-In* Devices Overview Ferrodisc and Drop-In circulators and isolators manufactured by M/A-COM are ex­ tremely well suited for all types of microwave integrated circuits MIC’s . The rapidly growing awareness and utilization of these devices in microwave systems of all

Lead Free reflow soldering profile BGA

Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
Contextual Info: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

tamura tlf-206-93f

Abstract: SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free
Contextual Info: MATRIX TRANSCEIVER MODULES ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is

JEDEC JESD22-B117

Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet
Contextual Info: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4

p10 LED matrix single color module

Abstract: tamura tlf-206-93f ZMXM-400 SAC-387
Contextual Info: MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 N O T FO R R EC N O EW M M D EN ES D IG ED N Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-

IPC-7527

Abstract: IPC-7525 koki solder paste IPC7527
Contextual Info: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single

amd (BGA) replacement alloy

Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony
Contextual Info: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different

07135

Abstract: Aluminum Base LED PCB AN1027 AN-1142 HLMP-HB61 HLMP-HB61-QU0ZZ HLMP-HD61 HLMP-HD61-TXTZZ HLMP-HM61 HLMP-HM61-Y30ZZ
Contextual Info: HLMP-HD61, HLMP-HM61 and HLMP-HB61 Precision Optical Performance Red, Green and Blue 5mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern

663n

Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 IEC 68-2-32 tamura solder paste
Contextual Info: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4

Aluminum Base LED PCB

Abstract: AN1027 AN-1142 HLMP-AB61-RU0ZZ HLMP-AD61 HLMP-AD61-X1TZZ HLMP-AM61-Z30ZZ SN63
Contextual Info: HLMP-AD61, HLMP-AM61 and HLMP-AB61 Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs Data Sheet Features Description These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern

2068 dd

Abstract: 1990 1142 D 1062 transistor LED Sign Board Diagram sn 1699 1142 and 1990 3.4 led 4 to 20ma current source circuit diagram LED wavelength 520 high light datasheet of red ir led
Contextual Info: HLMP-LD61, HLMP-LM61 and HLMP-LB61 Precision Optical Performance Red, Green and Blue 4mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern

IPC-7527

Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
Contextual Info: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single