SOT33 Search Results

MS-029

Abstract: SQFP240 601ZD
Contextual Info: PDF: 2003 May 27 Philips Semiconductors Package outline SQFP240: plastic shrink quad flat package; 240 leads lead length 1.3 mm ; body 32 x 32 x 3.4 mm; high stand-off height SOT334-2 c y X A 180 121 120 181 ZE e E HE A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index

jedec MO-150

Abstract: MO-150 SSOP20
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

Contextual Info: Package outline SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

SQFP240

Abstract: sot334
Contextual Info: PDF: 1999 Dec 08 Philips Semiconductors Package outline SQFP240: plastic shrink quad flat package; 240 leads lead length 1.3 mm ; body 32 x 32 x 3.4 mm SOT334-2 c y X A 180 121 120 181 ZE e E HE A A2 A1 (A3) wM θ Lp bp L pin 1 index detail X 240 61 60 1

SSOP14 package

Abstract: jedec MO-150 SSOP14 SOT337 MO-150
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: MOUNTING AND SOLDERING INSTRUCTIONS page TO126/SOT82 768 SOT186/A; SOT78 T0220AB 772 SOT199/SOT429 (TC>247)/SOT339 (TOP3D) 776 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering GENERAL DATA AND INSTRUCTIONS FOR T0126/S0T82 When the driven nut or screw is in direct contact with a

Contextual Info: Package outline SQFP240: plastic shrink quad flat package; 240 leads lead length 1.3 mm ; body 32 x 32 x 3.4 mm; high stand-off height SOT334-2 c y X A 180 121 120 181 ZE e E HE A A2 A1 (A3) wM θ Lp bp L detail X pin 1 index 61 240 60 1 ZD wM bp e v M A

Contextual Info: SOT337-1 Standard product orientation 12NC ending 118 Rev. 01 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT337-1 118 330 x 16

sot338

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

MO-150

Abstract: SSOP20 package jedec MO-150 SSOP20
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

fet array

Contextual Info: Philips Semiconductors Product specification 4 N-channel 60 mO FET array enhancement mode MOS transistors FEATURES PINNING - SOT338-1 SSOP16 • High-speed switching • No secondary breakdown PIN SYMBOL 1 and 4 di DESCRIPTION drain 1 • Very low on-state resistance

36150

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SQFP240 package SOT334-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

jedec MO-150

Abstract: ssop14 SSOP14 package MO-150
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

jedec MO-150

Abstract: SSOP16 package ssop16 MO-150
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT339-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

MO-150-AE

Abstract: SOT-339-1
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

sot337

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

SOT27-1

Abstract: 74hc SOT109-1 SOT163-1 sot27 SOT38 SOT402-1 SOT360-1 1/CN0944 SOT163
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package information January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package information PACKAGE INFORMATION PART NUMBER PIN COUNT DIL SO SSOP TSSOP 74HC/HCT00 14 SOT27-1 SOT108-1 SOT337-1 SOT402-1 74HC/HCT02

B0244A

Abstract: 2SB531-0 B0296 2sc3659 B0196
Contextual Info: POWER SILICON PNP Item Number Part Number I C 5 10 15 20 >= 5 A, B0956 SOT3309 SOT3309 SOT3309 SOT3329 SOT3329 SOT3329 B05400 BLX48 BLX48 BLX48 B0956F BOX30 TIP513 TIP513 TIP513 TIP514 SFT501 (A) 2SB506A SFT503 (A) +:~~~~ 25 30 TIP523 TIP524 2SC2613 2SC2816

74HCT25

Contextual Info: 74HC259; 74HCT259 8-bit addressable latch Rev. 5 — 7 August 2012 Product data sheet 1. General description The 74HC259; 74HCT259 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL LSTTL . They are specified in compliance with JEDEC

Contextual Info: 74HC237 3-to-8 line decoder, demultiplexer with address latches Rev. 6 — 23 August 2012 Product data sheet 1. General description The 74HC237 is a high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL LSTTL . The 74HC237 is specified in compliance with JEDEC

74hc733

Abstract: 74HC73 74HC73N 74HC73D 74HC73DB 74HC73PW JESD22-A114E SSOP14 SSOP14 package
Contextual Info: 74HC73 Dual JK flip-flop with reset; negative-edge trigger Rev. 04 — 19 March 2008 Product data sheet 1. General description The 74HC73 is a high-speed Si-gate CMOS device that complies with JEDEC standard no. 7A. It is pin compatible with Low-power Schottky TTL LSTTL .