SOT601 Search Results

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA280: plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm D SOT601-1 B D1 A ball A1 index area A2 A E1 E A1 detail X C e1 V ∅v M C A B b e y1 C y ∅w M C W U T e R

TFBGA280

Abstract: sot601
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA280: plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm SOT601-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A W V U T e

SOT601-1

Contextual Info: Package outline TFBGA280: plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm D SOT601-1 B D1 A ball A1 index area A2 A E1 E A1 detail X C e1 V y1 C ∅v M C A B b e y ∅w M C W U T e R P M K H F D N L e2 J G E C ball A1 index area B

MO-216

Contextual Info: PDF: 2003 Jul 18 Philips Semiconductors Package outline TFBGA280: plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm D SOT601-1 B D1 A ball A1 index area A2 A E1 E A1 detail X C e1 V ∅v M C A B b e y1 C y ∅w M C W U T e R

b0951

Abstract: 2SC647 BLX19 BLX16 25G60 2n5979 2N4310 ST+T8+1060
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 25 30 35 40 45 • 50 60 65 70 75 · · 80 ·85 90 · 95 912 Ie Max (A) V(BA)CEO (V) fT hFE Min Max (Hz) leBO Max (A) t, Max tf Max PD Max TOper Max (a) (a) (W) (OC) Package Style >= 5 A, (Co nt' d)

2SC3303 to-251

Abstract: 2S0586 2SC3303 2N4306 bo 913 bur10 SML1634
Contextual Info: POWER SILICON NPN Item Part Number Number I C 5 -10 15 -20 25 30 35 40 45 -50 ~ BUR10 BUR10 BUR10 SVTSO-5 SVTSO-5 SVTBO-5 2N2SS0 2N4113 2N4115 2N4306 2N4309 2SC520 2N1725 2N3S50 SOT5636 SOT63S3 2N2S93 2N5326 "~""";JIOI'\L. 55 - -60 2SC3367 2S0961 2N5337