SOT73 Search Results

CPGA223

Abstract: sot738
Contextual Info: PDF: 2002 Nov 13 Philips Semiconductors Package outline SOT738-1 CPGA223: ceramic pin grid array package; 223 pins; body 47.25 x 47.25 x 2.8 mm D pin 1 index mark location VSS VDD A2 E A1 L detail X VDD VSS D1 e 1/2 e b e V U T R P N M L K E1 J H 1/2 G e F

CPGA

Abstract: CPGA299 sot736
Contextual Info: PDF: 2002 Nov 13 Philips Semiconductors Package outline SOT736-1 CPGA299: ceramic pin grid array package; 299 pins; body 52.32 x 52.32 x 2.8 mm D pin 1 index mark location VDD VSS VSS VDD A2 E A1 L detail X VSS VDD VDD VSS D1 e 1/2 e b Y e W V U T R P N M

SOT735-1

Abstract: sot735 4773
Contextual Info: PDF: 2002 Nov 13 Philips Semiconductors Package outline HCPGA391: thermal enhanced ceramic pin grid array package; 391 pins; body 47.25 x 47.25 x 3.2 mm SOT735-1 D Dh VDD VSS VDD VSS VSS CORE VDD CORE VDD CORE VSS CORE VSS VDD pin 1 index mark location A2

ssop16

Abstract: sot73-1 DW 32 sot731
Contextual Info: PDF: 2001 Nov 09 Philips Semiconductors Package outline SSOP16T: plastic shrink small outline package/transparent; 16 leads; body width 4.4 mm SOT731-1 D E A Dw X c y HE pin 1 index v M A Z 9 16 A6 A2 A A3 A5 θ pin 1 index A1 Lp L 1 8 detail X bp w M e

Contextual Info: Package outline SSOP16T: plastic shrink small outline package/transparent; 16 leads straight ; body width 4.4 mm SOT734-1 D E Dw A X y c HE pin 1 index v M A Z 9 16 A6 A7 A2 pin 1 index L detail X 1 8 bp e w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline CWQCCN32L: ceramic window quad chip carrier; no leads; 32 terminals; with lens; body 10.7 x 10.7 x 8 mm B D SOT730-1 A F A E A2 A1 A3 detail X FD C e1 e 1/2 e 12 y y1 C v M C A B w M C b 5 L 13 4 e 1 e2 32 ∅ Lh 1/2 e 29 20 28 21 5 scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions UNIT A

Contextual Info: PDF: 2002 Mar 19 Philips Semiconductors Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 0.3 35.2 34.8 For unspecified dimensions see FCP2-drawing given in the subpackage code.

k 2134

Abstract: sot739
Contextual Info: PDF: 2002 Nov 04 Philips Semiconductors Package outline SOT739-1 CPGA180: ceramic pin grid array package; 180 pins; body 40 x 40 x 2.9 mm D D1 pin 1 index mark location A2 E1 E A1 L detail X b e R e P N M L K J H index pin G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

sot730

Abstract: CWQCCN32L
Contextual Info: PDF: 2002 Aug 13 Philips Semiconductors Package outline CWQCCN32L: ceramic window quad chip carrier; no leads; 32 terminals; with lens; body 10.7 x 10.7 x 8 mm B D SOT730-1 A F A E A2 A1 A3 detail X FD C e1 e 1/2 e 12 y y1 C v M C A B w M C b 5 L 13 4 e 1

sot734

Abstract: SOT734-1
Contextual Info: PDF: 2001 Nov 09 Philips Semiconductors Package outline SSOP16T: plastic shrink small outline package/transparent; 16 leads straight ; body width 4.4 mm SOT734-1 D E Dw A X y c HE pin 1 index v M A Z 9 16 A6 A7 A2 pin 1 index L detail X 1 8 bp w M e 2.5 5 mm

Contextual Info: PDF: 2003 Jun 16 Philips Semiconductors PC board footprint SSOP16T; SOT734-1 FOOTPRINT REFLOW SOLDERING Ol = 7.65 OA handbook, full pagewidth Pl = 6.90 Obl = Pbl = 5.00 OA 0.40 Cu (16x) Obw = Pbw = Ow = Pw = 5.60 OA 5.20 OA 5.15 0.65 5.00 Cu 7.40 Cu DETAIL HOLE A + B SIDE OF PCB

underfill

Abstract: FCP2 SOT732-1 sot732
Contextual Info: Package outline Philips Semiconductors FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions

SOT73

Abstract: CDIP14 cdip-14 philips 23
Contextual Info: PDF: 1999 Jul 16 Philips Semiconductors Package outline CDIP14: ceramic dual in-line package; 14 leads; glass seal SOT73-1 8.25 max seating plane 19.94 max pagewidth 5.08 max 3.4 2.9 0.51 min 2.54 max 0.32 0.23 0.254 M 2.54 12x 0.51 0.38 7.62 10.0 7.6 1.5

HEF40106BP

Abstract: HEF40106B HEF40106BT HEF40106 MO-001
Contextual Info: HEF40106B Hex inverting Schmitt trigger Rev. 4 — 15 November 2010 Product data sheet 1. General description The HEF40106B provides six inverting buffers. Each input has a Schmitt trigger circuit. The inverting buffer switches at different points for positive-going and negative-going

HEF4041BT

Abstract: IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC he4000b HEF4041 HEF4041BP The IC04 LOCMOS HE4000B Logic HEF4041B HEF4041BD
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4041B buffers Quadruple true/complement buffer

HEF4024B

Abstract: The IC04 LOCMOS HE4000B Logic HEF4024BP HEF4024BT HE4000B HEF4024BD
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4024B MSI 7-stage binary counter Product specification

Contextual Info: HEF4731B HEF4731V LSI QUADRUPLE 64-BIT STATIC SHIFT REGISTER The HEF4731B and HEF4731V are quadruple 64-bit static shift registers each with separate serial data inputs D/^ to D q , clock inputs (CP a t0 CP d ) and data outputs (063A t0 C>63d ) from the 64th

4007UB

Abstract: 4007U HEF4007UB HEF4007UBP F4007UB
Contextual Info: HEF4007UB gates DUAL COMPLEMENTARY PAIR AND INVERTER The H E F 4007U B is a dual complementary pair and an inverter w ith access to ijech device. It has three n-channel and three p-channel enhancement mode MOS transistors. 13 11 5P2 Gì PE n! u UË 3P3 J P2

HEF4001UBP

Abstract: BAW62 HE4000B HEF4001UB HEF4001UBD HEF4001UBT MS-012AB HEF4001* OR
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4001UB gates Quadruple 2-input NOR gate

HEF4011UBT

Abstract: MS-012AB BAW62 HE4000B HEF4011UB HEF4011UBD HEF4011UBP
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4011UB gates Quadruple 2-input NAND gate

HEF4082B

Abstract: HE4000B HEF4082BD HEF4082BP HEF4082BT MS-012AB MAX655
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4082B gates Dual 4-input AND gate Product specification

HEF4541BP

Abstract: RT 179 HEF4541BT HE4000B HEF4541B HEF4541BD HEF4541BTD 50 hz Oscillator
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4541B MSI Programmable timer Product specification

Q8031

Abstract: ISL9504 U7500 SLG8LP436 ISL9504 macbook "board view" macbook 820-1889 c5966 U6200 PP3V42G3H
Contextual Info: 8 6 7 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 2 3 4 5 1 CK APPD M42C MLB REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE C 474680 PRODUCTION RELEASED