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    T6N 700 Search Results

    T6N 700 Datasheets (2)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    T6N700COC
    Unknown Short Form Datasheet and Cross Reference Data Short Form PDF 177.19KB 1
    T6N700HOC
    Unknown Short Form Datasheet and Cross Reference Data Short Form PDF 177.19KB 1

    T6N 700 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SMD M05 sot23

    Abstract: NE5531 nE352 A3 smd sot-343 transistor smd m05 SMD transistor M05 transistor smd code 404
    Contextual Info: 2013-2014 RF & Wireless Semiconductors P R O D U C T S b y A P P L I C AT I O N California Eastern Laboratories CEL is the exclusive sales and marketing partner in the Americas for products made by the Compound Semiconductor Devices Business Division (CSDBD) of Renesas Electronics Corporation, formerly


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    2013/4M SMD M05 sot23 NE5531 nE352 A3 smd sot-343 transistor smd m05 SMD transistor M05 transistor smd code 404 PDF

    SMD transistor M05

    Abstract: smd TRANSISTOR code m05 wy smd transistor UPD5740 NE66200 TRANSISTOR m05 smd UPD5740T6N UPG2159T6R SMD transistor M05 driver 50 VOLTS 5 amp smd sot-89 TRANSISTOR
    Contextual Info: NEC XXXXXXXXXX RF & Wireless Semiconductors 2010 2 P R O D U C T S b y A P P L I C AT I O N California Eastern Laboratories serves designers, OEMs and contract manufacturers in the RF & Wireless, Mobilecomm, Multimedia, Broadband Communications, Industrial Control, and Automated Test Equipment ATE


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    10/2M SMD transistor M05 smd TRANSISTOR code m05 wy smd transistor UPD5740 NE66200 TRANSISTOR m05 smd UPD5740T6N UPG2159T6R SMD transistor M05 driver 50 VOLTS 5 amp smd sot-89 TRANSISTOR PDF

    MICRON BGA PART MARKING

    Contextual Info: 288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM 2 Features CIO RLDRAM 2 MT49H32M9 – 32 Meg x 9 x 8 Banks MT49H16M18 – 16 Meg x 18 x 8 Banks MT49H8M36 – 8 Meg x 36 x 8 Banks Features Options1 • 533 MHz DDR operation 1.067 Gb/s/pin data rate


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    288Mb: MT49H32M9 MT49H16M18 MT49H8M36 09005aef80a41b46/Source: 09005aef809f284b MICRON BGA PART MARKING PDF

    MICRON BGA PART MARKING

    Abstract: NF 034 T6N 700 MT49H16M18
    Contextual Info: 288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II Features CIO RLDRAM II MT49H32M9 – 32 Meg x 9 x 8 Banks MT49H16M18 – 16 Meg x 18 x 8 Banks MT49H8M36 – 8 Meg x 36 x 8 Banks Features Options1 • 533 MHz DDR operation 1.067 Gb/s/pin data rate


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    288Mb: MT49H32M9 MT49H16M18 MT49H8M36 09005aef80a41b46/Source: 09005aef809f284b MICRON BGA PART MARKING NF 034 T6N 700 MT49H16M18 PDF

    MICRON BGA PART MARKING

    Abstract: MT49H16M36
    Contextual Info: 576Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II Features CIO RLDRAM II MT49H64M9 – 64 Meg x 9 x 8 Banks MT49H32M18 – 32 Meg x 18 x 8 Banks MT49H16M36 – 16 Meg x 36 x 8 Banks Features Options1 • 533 MHz DDR operation 1.067 Gb/s/pin data rate


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    576Mb: MT49H64M9 MT49H32M18 MT49H16M36 09005aef80a41b46/Source: 09005aef809f284b MICRON BGA PART MARKING MT49H16M36 PDF

    smd code marking x18

    Abstract: MT49H16M36
    Contextual Info: 576Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM 2 Features CIO RLDRAM 2 MT49H64M9 – 64 Meg x 9 x 8 Banks MT49H32M18 – 32 Meg x 18 x 8 Banks MT49H16M36 – 16 Meg x 36 x 8 Banks Features Options1 • 533 MHz DDR operation 1.067 Gb/s/pin data rate


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    576Mb: MT49H64M9 MT49H32M18 MT49H16M36 09005aef80a41b46/Source: 09005aef809f284b smd code marking x18 MT49H16M36 PDF

    Contextual Info: 22 ChipInductors-1008HTSeries 2520 T h e s e lo w p ro file in d u c to rs a re 4 0 % th in n e r th a n o u r c o n v e n tio n a l 1 0 0 8 b o d y s iz e s . T h e y fe a tu re s ta n d a rd in d u c ta n c e to le ra n c e s o f 5 -1 0 % , h ig h S R F s a n d v e ry h ig h Q.


    OCR Scan
    ChipInductors-1008HTSeries 1008HT-3N3T 1008H T-12N T-15N PDF

    Contextual Info: PRELIMINARY INFORMATION L9D222G72BG3 2.2 Gb, DDR2, 32 M x 72 Integrated Module IMOD Benefits FEATURES DDR2 SDRAM Data Rate = 800,667,533 and 400Mbps Available in INDUSTRIAL, EXTENDED and MIL-TEMP Package: 16mm x 22mm – 208PBGA, 1.00mm pitch Differential Data Strobe (DQS, DQSx\) per byte


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    L9D222G72BG3 400Mbps 208PBGA, LDS-L9D222G72BG3-B PDF

    SMD M05 sot

    Abstract: NESG303100G SMD transistor M05 transistor NEC D 882 p m33 tf 130 H02 SOT-363 SMD M05 sot23 UPC8236 T6N 700 NE68000 s-parameters
    Contextual Info: NEC XXXXXXXXXX NEC RF & Wireless Semiconductors 2008 NEC CEL & NEC CONTENTS California Eastern Laboratories serves designers, OEMs GaAs RFIC Switches 3 and contract manufacturers in the RF & Wireless, Mobile- Small Signal GaAs FETs 4 comm, Multimedia, Broadband Communications, Industrial


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    08/2M SMD M05 sot NESG303100G SMD transistor M05 transistor NEC D 882 p m33 tf 130 H02 SOT-363 SMD M05 sot23 UPC8236 T6N 700 NE68000 s-parameters PDF

    L9D222G72BG3

    Contextual Info: PRELIMINARY INFORMATION L9D222G72BG3 2.2 Gb, DDR2, 32 M x 72 Integrated Module IMOD Benefits FEATURES DDR2 SDRAM Data Rate = 800,667,533 and 400Mbps Available in INDUSTRIAL, EXTENDED and MIL-TEMP Package: 16mm x 22mm – 208PBGA, 1.00mm pitch Differential Data Strobe (DQS, DQSx\) per byte


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    L9D222G72BG3 400Mbps 208PBGA, LDS-L9D222G72BG3 L9D222G72BG3 PDF

    AS4DDR232M72PBG

    Contextual Info: PRELIMINARY INFORMATION L9D225G80BG5 2.5 Gb, DDR2, 32 M x 80[72] Integrated Module IMOD Benefits FEATURES DDR2 SDRAM Data Rate = 800,667,533 and 400Mbps Available in INDUSTRIAL, EXTENDED and MIL-TEMP Package: 25mm x 25mm – 255PBGA, 1.27mm pitch Differential Data Strobe (DQS, DQSx\) per byte


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    L9D225G80BG5 400Mbps 255PBGA, LDS-L9D225G80BG5-B AS4DDR232M72PBG PDF

    AGE T6N 600

    Abstract: AS4DDR232M72PBG
    Contextual Info: PRELIMINARY INFORMATION L9D225G80BG5 2.5 Gb, DDR2, 32 M x 80[72] Integrated Module IMOD Benefits FEATURES DDR2 SDRAM Data Rate = 800,667,533 and 400Mbps Available in INDUSTRIAL, EXTENDED and MIL-TEMP Package: 25mm x 25mm – 255PBGA, 1.27mm pitch Differential Data Strobe (DQS, DQSx\) per byte


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    L9D225G80BG5 400Mbps 255PBGA, LDS-L9D225G80BG5-A AGE T6N 600 AS4DDR232M72PBG PDF

    FBGA DDR3

    Abstract: AS4DDR264M72PBG E-1150 55125C
    Contextual Info: PRELIMINARY INFORMATION L9D250G80BG5 5.0 Gb, DDR2, 64 M x 80[72] Integrated Module IMOD Benefits FEATURES DDR2 SDRAM Data Rate = 800,667,533 and 400Mbps Available in INDUSTRIAL, EXTENDED and MIL-TEMP Package: 25mm x 25mm – 255PBGA, 1.27mm pitch Differential Data Strobe (DQS, DQSx\) per byte


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    L9D250G80BG5 400Mbps 255PBGA, LDS-L9D250G80BG5-A FBGA DDR3 AS4DDR264M72PBG E-1150 55125C PDF

    Contextual Info: 1Gb: x4, x8, x16 – DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2 Features


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    MT47H256M4 MT47H128M8 MT47H64M16 18-compatible) 90-Ball 09005aef8117c1b1, 09005aef8117c192 PDF

    Contextual Info: Preliminary‡ 1Gb: x4, x8, x16 – DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2


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    MT47H256M4 MT47H128M8 MT47H64M16 18-compatible) 09005aef8117c1b1, 09005aef8117c192 PDF

    Contextual Info: 2Gb: x8, x16 Automotive DDR2 SDRAM Features Automotive DDR2 SDRAM MT47H256M8 – 32 Meg x 8 x 8 banks MT47H128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • • • • • • • • • • • • Configuration


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    MT47H256M8 MT47H128M16 60-ball 84-ball DDR2-800) DDR2-667) 09005aef8441c566 PDF

    Contextual Info: 512Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM SAA128M4. – 32 Meg x 4 x 4 banks SAA64M8. – 16 Meg x 8 x 4 banks SAA32M16. – 8 Meg x 16 x 4 banks For the latest data sheet, please refer to the SpecTek Web site: http://www.spectek.com


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    512Mb: SAA128M4. SAA64M8. SAA32M16. 18-compatible) 60-ball 10x10mm) PDF

    Contextual Info: PreLIMINARY Information L9D112G80BG4 1.2 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Laminate Ball Grid array (LBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply


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    L9D112G80BG4 LDS-L9D112G80BG4-A PDF

    DDR2 x32

    Abstract: GDDR3 SDRAM 256Mb K4J55323QF-GC K4J55323QF-GC12 K4J55323QF-GC14 MICRON gddr3 K4J55323QF-GC20 Gl WL02 Elpida GDDR3 T12N
    Contextual Info: 256M GDDR3 SDRAM K4J55323QF-GC 256Mbit GDDR3 SDRAM 2M x 32Bit x 4 Banks Graphic Double Data Rate 3 Synchronous DRAM with Uni-directional Data Strobe and DLL 144 - Ball FBGA Revision 1.7 January 2005 Samsung Electronics reserves the right to change products or specification without notice.


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    K4J55323QF-GC 256Mbit 32Bit K4J55323QF-G DDR2 x32 GDDR3 SDRAM 256Mb K4J55323QF-GC K4J55323QF-GC12 K4J55323QF-GC14 MICRON gddr3 K4J55323QF-GC20 Gl WL02 Elpida GDDR3 T12N PDF

    Contextual Info: 256Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H64M4 – 16 Meg x 4 x 4 banks MT47H32M8 – 8 Meg x 8 x 4 banks MT47H16M16 – 4 Meg x 16 x 4 banks For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2 Features • VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V excluding 37V ; -37V VDD = +1.9V ±0.1V, VDDQ = +1.9V ±0.1V


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    256Mb: MT47H64M4 MT47H32M8 MT47H16M16 18-compatible) 09005aef8117c187, 09005aef80b12a05 256MbDDR2 PDF

    Contextual Info: 256Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H64M4 – 16 Meg x 4 x 4 banks MT47H32M8 – 8 Meg x 8 x 4 banks MT47H16M16 – 4 Meg x 16 x 4 banks For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2 Features • VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V excluding 37V ; -37V VDD = +1.9V ±0.1V, VDDQ = +1.9V ±0.1V


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    256Mb: MT47H64M4 MT47H32M8 MT47H16M16 18-compatible) 09005aef8117c187, 09005aef80b12a05 256MbDDR2 PDF

    Contextual Info: 256Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H64M4 – 16 Meg x 4 x 4 banks MT47H32M8 – 8 Meg x 8 x 4 banks MT47H16M16 – 4 Meg x 16 x 4 banks For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2 Features • VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V excluding 37V ; -37V VDD = +1.9V ±0.1V, VDDQ = +1.9V ±0.1V


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    256Mb: MT47H64M4 MT47H32M8 MT47H16M16 18-compatible) 09005aef8117c187, 09005aef80b12a05 256MbDDR2 PDF

    84 FBGA outline

    Abstract: DDR2 x32 5 pin cmos operational amplifier z X6 BP 109 transistor T6N 700 DDR2 SDRAM Meg x 4 x 9 banks 0-30v power DDR2 SDRAM sstl_18 84 FBGA ccd ck
    Contextual Info: 256Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H64M4 – 16 Meg x 4 x 4 MT47H32M8 – 8 Meg x 8 x 4 MT47H16M16 – 4 Meg x 16 x 4 For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2 Features • VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V excluding -37V ; -37V VDD = +1.9V ±0.1V, VDDQ = +1.9V


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    256Mb: MT47H64M4 MT47H32M8 MT47H16M16 18-compatible) 09005aef8117c187, 09005aef80b12a05 256MbDDR2 84 FBGA outline DDR2 x32 5 pin cmos operational amplifier z X6 BP 109 transistor T6N 700 DDR2 SDRAM Meg x 4 x 9 banks 0-30v power DDR2 SDRAM sstl_18 84 FBGA ccd ck PDF

    Contextual Info: 1Gb: x4, x8, x16 – DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks For the latest data sheet, please refer to the Micron Web site: http://www.micron.com/ddr2 Features


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    MT47H256M4 MT47H128M8 MT47H64M16 18-compatible) 09005aef8117c1b1, 09005aef8117c192 PDF